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US4753192A Expired / Lapsed US ⏱️ 0.0 years remaining

Movable core fast cool-down furnace

Assignee: Kokusai Semiconductor Equipment Corp
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Filing: 1987-01-08
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Granted: 1988-06-28
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Expires: 2007-01-08
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Abstract

Abstract One fast cool-down furnace embodiment discloses a double wall in the interspace of which a cooling air stream is flowable to provide fast cool-down of a load of wafers. The double wall embodiment is retrofittable on existing diffusion furnace, and includes a cylindrical member aligned in concentric relation with the diffusion tube by combination plenum defining and supporting manifolds. In a second embodiment, the fast cool-down furnace includes a reaction vessel and a heating core relatively movable relative to each other in such a way that in a fast cool-down condition the core and reaction vessel are spaced apart. Cooling tubes are embedded in the movable core. Fans or other aids to cooling are provided. Operation is either in a controlled cool-down mode or in a quick quench mode.

Inventors

  • 👤 Forest S. Goldsmith
  • 👤 Arthur Waugh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 17:26
CPC Classifications
C; C30; C30B; C30B31/00; C30B31/06; C30B31/10; C23; C23C; C23C8/00; F; F27; F27B; F27B17/00; F27B17/0016; F27B17/0025; F27D; F27D19/00; F27D9/00

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 66 words
A fast cool-down furnace comprising: a diffusion furnace defining a reaction chamber in which semiconductor wafers are processed having a furnace core surrounding the reaction chamber which heats the semiconductor wafers therewithin; and fast cool-down means for moving the core relative to the reaction chamber such that the core is moved into a position where it is remote from the reaction chamber in a cool-down mode.
Claim 2
Dependent Claim 66 words
A fast cool-down furnace comprising: a diffusion furnace defining a reaction chamber in which semiconductor wafers are processed having a furnace core surrounding the reaction chamber which heats the semiconductor wafers therewithin; and fast cool-down means for moving the core relative to the reaction chamber such that the core is moved into a position where it is remote from the reaction chamber in a cool-down mode.
Claim 3
Dependent Claim 17 words
The fast cool-down furnace of claim 1, wherein said moving means includes a motor driven linear track.
Claim 4
Dependent Claim 30 words
The invention of claim 1, further including means mounted to the core for cooling the core while surrounding the vessel so as to provide an intended degree of cool down.
Claim 5
Dependent Claim 18 words
The invention of claim 3, wherein said core cooling means includes fluid flow pipes embedded in the core.
Claim 6
Dependent Claim 19 words
The fast cool-down furnace of claim 4, wherein said fluid flow pipes are circumferentially symmetrically embedded about said core.
Claim 7
Dependent Claim 23 words
The fast cool-down furnace of claim 1, further including means for cooling the reaction vessel when the core is in said cool-down mode.
Claim 8
Dependent Claim 104 words
A movable core fast cool-down furnace comprising: a diffusion furnace defining a reaction chamber in which semi-conductor wafers are processed having a furnace core surrounding the reaction chamber which heats the semi-conductor wafers therewithin; controlled cool-down means coupled to the furnace core for cooling the wafers to a predetermined temperature at a selectable temperature/time characteristic rate; fast cool-down means for moving the core relative to the reaction chamber such that the core is moved into a position where it is remote from the reaction chamber in a quick-quench mode; and means for cooling the reaction vessel when the core is in said quick-quench mode.
Claim 9
Dependent Claim 104 words
A movable core fast cool-down furnace comprising: a diffusion furnace defining a reaction chamber in which semi-conductor wafers are processed having a furnace core surrounding the reaction chamber which heats the semi-conductor wafers therewithin; controlled cool-down means coupled to the furnace core for cooling the wafers to a predetermined temperature at a selectable temperature/time characteristic rate; fast cool-down means for moving the core relative to the reaction chamber such that the core is moved into a position where it is remote from the reaction chamber in a quick-quench mode; and means for cooling the reaction vessel when the core is in said quick-quench mode.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-06-28 1991-12-28 1992-06-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-06-28 1995-12-28 1996-06-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-06-28 1999-12-28 2000-06-28 $7700.00 Window Closed / Lapsed

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