Dielectric composition

Claim 2

A castable dielectric composition comprising a dispersion of finely divided solids comprising: a. 50-75% wt. noncrystallizable glass of which the deformation temperature (T d ) is 580°-625° C. and the softening point (T s ) is 630°-700° C., and (T s -T d ) is 50°-75° C., b. 50-25% wt. refractory which is substantially insoluble in the glass at temperatures of 825°-900° C., both dispersed in a solution of c. an organic polymeric binder in d. volatile nonaqueous organic solvent.

Claim 3

A green tape formed by (1) casting onto a flexible substrate a thin layer of a dispersion of finely divided solids comprising: a. 50-75% wt. noncrystallizable glass of which the deformation temperature (T d ) is 580°-625° C. and the softening point (T s ) is 630°-700° C. and (T s -T d ) is 50°-75° C. b. 50-25% wt. refractory which is substantially insoluble in the glass at temperatures of 825°-900° C., the refractory and glass solids being selected from the group consisting of Al 2 O 3 , mullite, cordierite, SiO 2 , CaZrO 2 , forsterite, ZrO 2 and mixtures thereof, both dispersed in a solution of c. an organic polymeric binder in d. volatile nonaqueous organic solvent; (2) heating the cast layer to remove the volatile organic solvent therefrom and (3) separating the solvent-free layer from the substrate.

Claim 4

A green tape formed by (1) casting onto a flexible substrate a thin layer of a dispersion of finely divided solids comprising: a. 50-75% wt. noncrystallizable glass of which the deformation temperature (T d ) is 580°-625° C. and the softening point (T s ) is 630°-700° C. and (T s -T d ) is 50°-75° C. b. 50-25% wt. refractory which is substantially insoluble in the glass at temperatures of 825°-900° C., the refractory and glass solids being selected from the group consisting of Al 2 O 3 , mullite, cordierite, SiO 2 , CaZrO 2 , forsterite, ZrO 2 and mixtures thereof, both dispersed in a solution of c. an organic polymeric binder in d. volatile nonaqueous organic solvent; (2) heating the cast layer to remove the volatile organic solvent therefrom and (3) separating the solvent-free layer from the substrate.

Claim 5

A multilayer interconnection assemblage comprising a plurality of conductively interconnected thick film functional layers separated by layers of the green tape of claim 10, the assemblage having been cofired to volatilize the organic material from the layers and to effect sintering of the solids of the functional layers and densification of the solids of the green tape layers.