US4751136A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate for high-frequency circuit and process for making the same
Assignee: Resonac Corp
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Filing: 1987-08-31
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Granted: 1988-06-14
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Expires: 2007-08-31
Abstract
Abstract A substrate for high-frequency circuits best suited as a substrate for a flat antenna to receive satellite-broadcast microwaves or as a similar substrate, the substrate comprising (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film, and a process for making such substrates.
Inventors
- 👤 Masaki Kamiya
- 👤 Takao Sugawara
- 👤 Kenji Tsukanishi
- 👤 Yutaka Yamaguchi
- 👤 Mitsuo Yokota
- 👤 Masao Asaoka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:14
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H01; H01Q; H01Q15/00; H01Q15/14; H01Q15/141; H01Q15/142; H01Q9/00; H01Q9/04; H01Q9/0407; H05K1/0213; H05K1/0237; H05K1/024; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/0137; H05K2201/0158; H05K3/00; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T428/00; Y10T428/249921; Y10T428/249953; Y10T428/249982; Y10T428/249985; Y10T428/249986; Y10T428/249987; Y10T428/24999; Y10T428/31504; Y10T428/31678; Y10T428/31692
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
48 words
A substrate for high-frequency circuits which comprises (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film.
Claim 2
Dependent Claim
48 words
A substrate for high-frequency circuits which comprises (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film.
Claim 3
Dependent Claim
20 words
The substrate for high-frequency circuits of claim 1, wherein the water-impermeable film comprises a plastic film or a plastic adhesive.
Claim 4
Dependent Claim
16 words
The substrate for high-frequency circuits of claim 1, wherein the water-impermeable film comprises a polyolefin film.
Claim 5
Dependent Claim
95 words
A process for making substrates for high-frequency circuits which comprise scattering an insulator powder having an average particle diameter of 0.001 to 1 mm to a definite thickness on a water-impermeable film superposed on a metal foil, and applying heat and pressure to the superposed layers to form an insulator layer wherein the particles of the insulator powder maintain the state of being fused or bonded to the neighboring particles of the powder and have air in the interstices between particles of the insulator and to bond together all the layer into a single body.
Claim 6
Dependent Claim
95 words
A process for making substrates for high-frequency circuits which comprise scattering an insulator powder having an average particle diameter of 0.001 to 1 mm to a definite thickness on a water-impermeable film superposed on a metal foil, and applying heat and pressure to the superposed layers to form an insulator layer wherein the particles of the insulator powder maintain the state of being fused or bonded to the neighboring particles of the powder and have air in the interstices between particles of the insulator and to bond together all the layer into a single body.
Claim 7
Dependent Claim
88 words
A process for making substrates for high-frequency circuits which comprise overlaying a metal foil with a water-impermeable film and then with a previously formed insulator layer in sheet form wherein particles of an insulator powder having an average particle diameter of 0.001 to 1 mm maintain the state of being fused or bonded to the neighboring particles of the powder and have air in the interstices between particles of the insulator, and applying heat and pressure to all the layers superposed to bond them into a single body.
Claim 8
Dependent Claim
88 words
A process for making substrates for high-frequency circuits which comprise overlaying a metal foil with a water-impermeable film and then with a previously formed insulator layer in sheet form wherein particles of an insulator powder having an average particle diameter of 0.001 to 1 mm maintain the state of being fused or bonded to the neighboring particles of the powder and have air in the interstices between particles of the insulator, and applying heat and pressure to all the layers superposed to bond them into a single body.
References Cited (Backward Citations)
US4219602A
Cited
US4212733A
Cited
US4221835A
Cited
DE2901623A1
Cited
JPS60167394A
Cited
US4647500A
Cited
JPS6269580A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-14 | 1991-12-14 | 1992-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-14 | 1995-12-14 | 1996-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-14 | 1999-12-14 | 2000-06-14 | $7700.00 | Window Closed / Lapsed |