US4750976A
Expired / Lapsed
US
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Electrically conductive copper layers and process for preparing same
Assignee: BLASBERG OBERFLACHENTECHNIK MERSCHEIDER STR 165 D - 5650 SOLINGEN 13 GERMANY GmbH
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Filing: 1985-12-09
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Granted: 1988-06-14
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Expires: 2005-12-09
Abstract
Abstract Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas (a) are galvanically coated with a coating of a black metal in an acidic medium; (b) the resist is removed and then the copper areas having been exposed thereby are removed by etching; (c) the conductor plates are provided with an adhering solder mask; (d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.
Inventors
- 👤 Jurgen Hupe
- 👤 Frank Sonnenschein
- 👤 Herbert Breidenbach
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; C; C23; C23F; C23F1/00; C23F1/02; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/38; H05K3/382; H05K3/384; H05K2203/00; H05K2203/03; H05K2203/0361; H05K3/243; H05K3/28; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24942; Y10T428/2495; Y10T428/24967; Y10T428/24975; Y10T428/26; Y10T428/263; Y10T428/264; Y10T428/265
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
92 words
Process for preparing an electrically conductive copper layer in conductor plates having a coating, wherein conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas (a) are galvanically coated with a coating of a black metal in an acidic medium; (b) the resist is removed and then the copper areas having been exposed thereby are removed by etching; (c) the conductor plates are provided with an adhering solder mask; (d) at those parts that are not covered by the solder mask the black metal coating is removed.
Claim 2
Dependent Claim
92 words
Process for preparing an electrically conductive copper layer in conductor plates having a coating, wherein conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas (a) are galvanically coated with a coating of a black metal in an acidic medium; (b) the resist is removed and then the copper areas having been exposed thereby are removed by etching; (c) the conductor plates are provided with an adhering solder mask; (d) at those parts that are not covered by the solder mask the black metal coating is removed.
Claim 3
Dependent Claim
20 words
Process according to claim 1, wherein a black chromium or black nickel coating is used as the black metal coating.
Claim 4
Dependent Claim
16 words
Process according to claim 1, wherein the black metal coating is removed in an acidic medium.
Claim 5
Dependent Claim
16 words
Process according to claim 2, wherein the black metal coating is removed in an acidic medium.
Claim 6
Dependent Claim
32 words
Process according to claim 1 in step (d) in the portions not covered by the solder mask the black metal coating is removed by an alkaline potassium hexacyanoferrate(III) solution containing wetting agent(s).
Claim 7
Dependent Claim
32 words
Process according to claim 2 in step (d) in the portions not covered by the solder mask the black metal coating is removed by an alkaline potassium hexacyanoferrate(III) solution containing wetting agent(s).
Claim 8
Dependent Claim
33 words
Process according to claim 3 in step (d) in the portions not covered by the solder mask the black metal coating is further removed by an alkaline potassium hexacyanoferrate(III) solution containing wetting agent(s).
Claim 9
Dependent Claim
21 words
Process according to claim 5, wherein the removal is carried out at a temperature of from room temperature to 70° C.
Claim 10
Dependent Claim
21 words
Process according to claim 6, wherein the removal is carried out at a temperature of from room temperature to 70° C.
Claim 11
Dependent Claim
21 words
Process according to claim 7, wherein the removal is carried out at a temperature of from room temperature to 70° C.
Claim 12
Dependent Claim
35 words
Process according to claim 5 wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate(III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 13
Dependent Claim
36 words
Process according to claim 6 wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate (III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 14
Dependent Claim
35 words
Process according to claim 7 wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate(III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 15
Dependent Claim
36 words
Process according to claim 8 wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate (III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 16
Dependent Claim
29 words
Process according to claim 1, wherein the copper areas exposed by the removal of the black metal coating in step (d) are provided with a well solderable metal layer.
Claim 17
Dependent Claim
20 words
Process according to claim 15, wherein a black chromium or black nickel coating is used as the black metal coating.
Claim 18
Dependent Claim
16 words
Process according to claim 15, wherein the black metal coating is removed in an acidic medium.
Claim 19
Dependent Claim
16 words
Process according to claim 16, wherein the black metal coating is removed in an acidic medium.
Claim 20
Dependent Claim
33 words
Process according to claim 15 in step (d) in the portions not covered by the solder mask the black metal coating is removed by an alkyline potassium hexacyanoferrate (III) solution containing wetting agent(s).
Claim 21
Dependent Claim
33 words
Process according to claim 16 in step (d) in the portions not covered by the solder mask the black metal coating is removed by an alkyline potassium hexacyanoferrate (III) solution containing wetting agent(s).
Claim 22
Dependent Claim
34 words
Process according to claim 17 in step (d) in the portions not covered by the solder mask the black metal coating is further removed by an alkyline potassium hexacyanoferrate (III) solution containing wetting agent(s).
Claim 23
Dependent Claim
21 words
Process according to claim 19, wherein the removal is carried out at a temperature of from room temperature to 70° C.
Claim 24
Dependent Claim
20 words
Process according to claim 20, wherein the removal is carried at a temperature of from room temperature to 70° C.
Claim 25
Dependent Claim
21 words
Process according to claim 21, wherein the removal is carried out at a temperature of from room temperature to 70° C.
Claim 26
Dependent Claim
36 words
Process according to claim 19, wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate (III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 27
Dependent Claim
36 words
Process according to claim 20, wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate (III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 28
Dependent Claim
36 words
Process according to claim 21, wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate (III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and from 0.001 to 1 g/l of the wetting agent.
Claim 29
Dependent Claim
35 words
Process according to claim 22, wherein the solution contains at least 0.2 mol/l of potassium hexacyanoferrate (III), from 0.1 mol/l to 5 mol/l of potassium hydroxide and 0.001 to 1 g/l of the wetting agent.
References Cited (Backward Citations)
US2985567A
Cited
US3620935A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-14 | 1991-12-14 | 1992-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-14 | 1995-12-14 | 1996-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-14 | 1999-12-14 | 2000-06-14 | $7700.00 | Window Closed / Lapsed |