US4749436A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Equipment for thermal stabilization process of photoresist pattern on semiconductor wafer
Assignee: Tokyo Ohka Kogyo Co Ltd
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Filing: 1987-07-29
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Granted: 1988-06-07
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Expires: 2007-07-29
Abstract
Abstract An equipment (100; 200) for thermal stabilization process of photoresist pattern on semiconductor wafer comprises an ultraviolet lamp (20) by which a photoresist pattern formed on a semiconductor wafer (W) put in a process chamber (S) under vacuum pressure is irradiated with ultraviolet rays of a predetermined strength, and a heater (10) for heating the wafer to a predetermined temperature.
Inventors
- 👤 Mitsuaki Minato
- 👤 Isamu Hijikata
- 👤 Akira Uehara
- 👤 Muneo Nakayama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:06
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/20; G03F7/2022; G03F7/2024; Y; Y10; Y10S; Y10S438/00; Y10S438/942; Y10S438/948
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
72 words
An equipment for thermal stabilization process of photoresist pattern on semiconductor wafer, comprising: a hermetically sealable process chamber in which a semiconductor wafer formed with a photoresist pattern is put; an ultraviolet lamp for irradiating said photoresist pattern with ultraviolet rays of a predetermined strength; a means for reducing the inner pressure of said process chamber to a predetermined value; and a means for heating said semiconductor wafer to a predetermined temperature.
Claim 2
Dependent Claim
72 words
An equipment for thermal stabilization process of photoresist pattern on semiconductor wafer, comprising: a hermetically sealable process chamber in which a semiconductor wafer formed with a photoresist pattern is put; an ultraviolet lamp for irradiating said photoresist pattern with ultraviolet rays of a predetermined strength; a means for reducing the inner pressure of said process chamber to a predetermined value; and a means for heating said semiconductor wafer to a predetermined temperature.
Claim 3
Dependent Claim
115 words
An equipment for thermal stabilization process according to claim 1, wherein: said equipment further comprises a table with an opening formed therethrough, a stage on which said semiconductor wafer is put and which hermetically closes the aperture at one end of said opening, and a chamber cover for hermetically closing the aperture at the other end of said opening; said process chamber is defined by cooperation of said opening of said table, said stage, and said chamber cover; said reducing means comprises a suction path formed in said table in communication with said process chamber, and a suctioning means connected to said suction path; and said heating means comprises a heater built in said stage.
Claim 4
Dependent Claim
53 words
An equipment for thermal stabilization process according to claim 2, wherein: said chamber cover comprises a transparent plate; said ultraviolet lamp is disposed outside of said transparent plate; and said table is formed with a communication path for selectively connecting said process chamber to an inert gas feed line and a purge line.
Claim 5
Dependent Claim
23 words
An equipment for thermal stabilization process according to claim 3, further comprising: a shutter interposed between said ultraviolet lamp and said chamber cover.
Claim 6
Dependent Claim
46 words
An equipment for thermal stabilization process according to claim 2, wherein: said ultraviolet lamp is disposed in said process chamber; and said chamber cover is provided with an admission pipe for selectively connecting said process chamber to an inert gas feed line and a purge line.
Claim 7
Dependent Claim
53 words
An equipment for thermal stabilization process according to claim 2, further comprising: a control system including an illumination monitor for monitoring an illumination strength of said ultraviolet lamp, and a control unit for computing a process time to thereby automatically control the operation of said shutter and the transfer of said semiconductor wafer.
References Cited (Backward Citations)
JPS6197834A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-07 | 1991-12-07 | 1992-06-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-07 | 1995-12-07 | 1996-06-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-07 | 1999-12-07 | 2000-06-07 | $7700.00 | Window Closed / Lapsed |