US4740252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder paste for electronic parts
Assignee: Senju Metal Industry Co Ltd
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Filing: 1987-02-02
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Granted: 1988-04-26
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Expires: 2007-02-02
Abstract
Abstract A solder paste comprises a solder paste portion containing powdered solder and metallic spheres which are made of a material having a higher melting point than the solder paste portion and whose surface can be wet by molten solder. The metallic spheres have a diameter of 0.07-0.3 mm. The metallic spheres can comprise a single metal or two metals, one of which forms the center of the sphere and the second of which is plated on the surface of the first.
Inventors
- 👤 Eietsu Hasegawa
- 👤 Rikiya Kato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 16:25
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/02; B23K35/0222; B23K35/0244; B23K35/025; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/3465; H05K3/3485; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/10; H05K2201/10227; H05K2201/10234; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
76 words
A solder paste for the soldering of electronic parts comprising: approximately 99.5 weight % to approximately 95 weight % of a solder paste portion comprising a powdered solder and a flux; and approximately 0.5 weight % to approximately 5 weight % of metallic spheres which are made of a material having a higher melting point than said powdered solder and whose surfaces can be wet by molten solder and which have a diameter of 0.07-0.3 mm.
Claim 2
Dependent Claim
76 words
A solder paste for the soldering of electronic parts comprising: approximately 99.5 weight % to approximately 95 weight % of a solder paste portion comprising a powdered solder and a flux; and approximately 0.5 weight % to approximately 5 weight % of metallic spheres which are made of a material having a higher melting point than said powdered solder and whose surfaces can be wet by molten solder and which have a diameter of 0.07-0.3 mm.
Claim 3
Dependent Claim
20 words
A solder paste as claimed in claim 1, wherein each of said metallic spheres is made of a single metal.
Claim 4
Dependent Claim
18 words
A solder paste as claimed in claim 2, wherein said single metal is selected from Ag and Ni.
Claim 5
Dependent Claim
41 words
A solder paste as claimed in claim 1, wherein each of said metallic spheres is made of a first metal which forms the center of said spheres and a second metal which is plated on the surface of said first metal.
Claim 6
Dependent Claim
20 words
A solder paste as claimed in claim 4, wherein said first metal is Cu and said second metal is Ni.
Claim 7
Dependent Claim
23 words
A solder paste as claimed in claim 1, wherein said solder paste portion comprises as Sn-Pb powdered solder and a solder paste flux.
Claim 8
Dependent Claim
16 words
A solder paste as claimed in claim 1, wherein said metallic spheres are of uniform diameter.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-26 | 1991-10-26 | 1992-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-26 | 1995-10-26 | 1996-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-26 | 1999-10-26 | 2000-04-26 | $7700.00 | Window Closed / Lapsed |