US4739633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Room temperature to cryogenic electrical interface
Assignee: Hypres Inc
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Filing: 1985-11-12
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Granted: 1988-04-26
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Expires: 2005-11-12
Abstract
Abstract Apparatus is disclosed for electrically interfacing a circuit operable at one temperature with a circuit operable at another temperature, comprising a primary cooling or heating surface disposed inside a vacuum chamber which is thermally connected to the first circuit. Transmission lines may extend through the wall of the vacuum chamber to the second circuit which can be located outside. In one embodiment, the first circuit is operable at cryogenic temperatures and is fabricated on an elongated fused quartz substrate together with the transmission lines. The first circuit may be thermally connected to the primary surface via a secondary surface, which may itself be thermally connected to the primary surface via a flexible support and/or a thermal switch. The use of a flexible element in the construction of the apparatus prevents thermally induced movement from shattering the substrate. The primary surface may be cooled by a thermally conductive rod immersible in liquid helium; by the forced flow of liquid helium into a vessel located inside the vacuum chamber, the interior of which vessel is in thermal communication with the primary surface; by a closed cycle refrigerator; or by other means.
Inventors
- 👤 Sadeg M. Faris
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 15:30
CPC Classifications
H; H03; H03K; H03K5/00; H03K5/159; F; F17; F17C; F17C13/00; H03K19/00; H03K19/02; H03K19/195
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
74 words
A monolithic superconductive chip comprising: a. a substrate with a low temperature region and a high temperature region; b. a low temperature electronic circuit formed on said low temperature region and including an element which is superconductive when it has a temperature below a critical level; and c. a plurality of electrical conductors formed on said substrate, said conductors being connected to said electronic circuit and traversing said substrate to said high temperature region.
Claim 2
Dependent Claim
74 words
A monolithic superconductive chip comprising: a. a substrate with a low temperature region and a high temperature region; b. a low temperature electronic circuit formed on said low temperature region and including an element which is superconductive when it has a temperature below a critical level; and c. a plurality of electrical conductors formed on said substrate, said conductors being connected to said electronic circuit and traversing said substrate to said high temperature region.
Claim 3
Dependent Claim
108 words
A monolithic superconductive chip comprising: a. an elongated substrate having two opposed ends a high temperature and a low temperature region corresponding to one of said ends, respectively; b. a low temperature electronic circuit formed on said low temperature region and including an element which is superconductive when it has a temperature below a critical level; c. a plurality of contacting pads formed in said high temperature region; d. a plurality of biasing and monitoring lines connected between said electronic circuit and one of said contacting pads; and e. a plurality of high performance transmission lines connected to said electronic circuit and extending into said high temperature region.
Claim 4
Dependent Claim
108 words
A monolithic superconductive chip comprising: a. an elongated substrate having two opposed ends a high temperature and a low temperature region corresponding to one of said ends, respectively; b. a low temperature electronic circuit formed on said low temperature region and including an element which is superconductive when it has a temperature below a critical level; c. a plurality of contacting pads formed in said high temperature region; d. a plurality of biasing and monitoring lines connected between said electronic circuit and one of said contacting pads; and e. a plurality of high performance transmission lines connected to said electronic circuit and extending into said high temperature region.
Claim 5
Independent Claim
117 words
An apparatus for maintaining an electronic circuit at a low temperature, comprising: a vacuum chamber having an aperture; a primary surface disposed within the vacuum chamber; cooling means for the primary surface; a substrate having a low temperature region, a high temperature region, and a plurality of conductors, the substrate extending through the aperture with the low temperature region disposed substantially within the vacuum chamber and the high temperature region disposed substantially outside the vacuum chamber, the electronic circuit being disposed in the low temperature region, and the plurality of conductors extending from the electronic circuit into the high temperature region; and means for coupling the low temperature region of the substrate thermally to the primary surface.
Claim 6
Independent Claim
117 words
An apparatus for maintaining an electronic circuit at a low temperature, comprising: a vacuum chamber having an aperture; a primary surface disposed within the vacuum chamber; cooling means for the primary surface; a substrate having a low temperature region, a high temperature region, and a plurality of conductors, the substrate extending through the aperture with the low temperature region disposed substantially within the vacuum chamber and the high temperature region disposed substantially outside the vacuum chamber, the electronic circuit being disposed in the low temperature region, and the plurality of conductors extending from the electronic circuit into the high temperature region; and means for coupling the low temperature region of the substrate thermally to the primary surface.
Claim 7
Dependent Claim
10 words
Apparatus according to claim 3, wherein the substrate is flexible.
Claim 8
Dependent Claim
37 words
Apparatus according to claim 3, wherein the thermal coupling means comprises: a secondary surface in thermal contact with the low temperature region of the substrate; and thermal connecting means connecting the secondary surface to the primary surface.
Claim 9
Dependent Claim
12 words
Apparatus according to claim 5, wherein the thermal connecting means is flexible.
Claim 10
Dependent Claim
13 words
Apparatus according to claim 5, wherein the thermal connecting means comprises a braid.
Claim 11
Dependent Claim
159 words
Apparatus for electrically interfacing a first circuit operable at a first temperature with a second circuit operable at a second temperature above the first temperature, comprising: a vacuum chamber having an aperture; a primary surface disposed within the vacuum chamber; cooling means for maintaining the primary surface at a third temperature below the first temperature; a substrate having a first region on which the first circuit is formed, a second region, and conductor means formed on the substrate, the substrate extending through the aperture, with the first region being disposed substantially within the vacuum chamber and the second region being disposed substantially outside the vacuum chamber, the conductor means having a first end coupled to the first circuit and a second end extending into the second region for electrical coupling to the second circuit; and thermal coupling means for coupling the first region of the substrate to the primary surface for maintaining the first region at the first temperature.
Claim 12
Dependent Claim
159 words
Apparatus for electrically interfacing a first circuit operable at a first temperature with a second circuit operable at a second temperature above the first temperature, comprising: a vacuum chamber having an aperture; a primary surface disposed within the vacuum chamber; cooling means for maintaining the primary surface at a third temperature below the first temperature; a substrate having a first region on which the first circuit is formed, a second region, and conductor means formed on the substrate, the substrate extending through the aperture, with the first region being disposed substantially within the vacuum chamber and the second region being disposed substantially outside the vacuum chamber, the conductor means having a first end coupled to the first circuit and a second end extending into the second region for electrical coupling to the second circuit; and thermal coupling means for coupling the first region of the substrate to the primary surface for maintaining the first region at the first temperature.
Claim 13
Dependent Claim
16 words
Apparatus according to claim 3, wherein the primary surface is cooled by a closed cycle refrigerator.
Claim 14
Dependent Claim
23 words
Apparatus according to claim 3, wherein the primary surface is cooled by a reservoir of a fluid which boils at a low temperature.
Claim 15
Dependent Claim
43 words
Apparatus according to claim 10, further comprising: a vessel disposed in the vacuum chamber, the interior of the vessel being in thermal communication with the primary surface; and means for transfering fluid from the reservoir into the vessel for cooling the primary surface.
Claim 16
Dependent Claim
25 words
Apparatus according to claim 10, further comprising a thermally conductive rod in thermal communication with the primary surface, the rod being immersible in the reservoir.
Claim 17
Dependent Claim
23 words
Apparatus according to claim 3, wherein the aperture in the wall is plugable by a cap having a hole sealable around the substrate.
Claim 18
Dependent Claim
30 words
Apparatus according to claim 5, wherein the thermal connecting means comprises a rigid, thermally conductive support and a flexible, thermally conductive diaphragm connecting the rigid support to the secondary surface.
Claim 19
Dependent Claim
18 words
Apparatus according to claim 5, further comprising a thermal switch between the primary surface and the secondary surface.
Claim 20
Dependent Claim
36 words
Apparatus according to claim 8, further comprising means for avoiding substantial degradation of the mechanical, electrical or thermal properties of the first circuit or the conductor means which might otherwise result from movement of the substrate.
Claim 21
Dependent Claim
17 words
Apparatus according to claim 16, wherein the aperture comprises a removable cap through which the substrate passes.
Claim 22
Dependent Claim
19 words
Apparatus according to claim 17, wherein the means for avoiding substantial degradation comprises the cap, the cap being flexible.
Claim 23
Dependent Claim
17 words
Apparatus according to claim 16, wherein the thermal coupling means comprises the means for avoiding substantial degradation.
Claim 24
Dependent Claim
19 words
Apparatus according to claim 16, wherein the means for avoiding substantial degradation comprises the substrate, the substrate being flexible.
Claim 25
Dependent Claim
33 words
Apparatus according to claim 16, further comprising: a secondary surface in thermal contact with the low temperature region of the substrate; and means for thermally connecting the secondary surface to the primary surface.
Claim 26
Dependent Claim
20 words
Apparatus according to claim 21, wherein the means for avoiding substantial degradation comprises means for flexibly supporting the secondary surface.
Claim 27
Dependent Claim
18 words
Apparatus according to claim 21, further comprising a thermal switch between the primary surface and the secondary surface.
Claim 28
Dependent Claim
81 words
Apparatus according to claim 8, further comprising: a vessel disposed inside the vacuum chamber, the interior of the vessel being in thermal communication with the primary surface; and fluid transfer means connected at one end to the interior of the vessel and connectable at the other end to a reservoir of cold fluid, the vacuum chamber extending coaxially with the fluid transfer means, so that pressurization of the reservoir will force fluid therefrom into the vessel for cooling the primary surface.
Claim 29
Dependent Claim
51 words
Apparatus according to claim 8, further comprising heat transfer means, a first end of which is in thermal communication with the primary surface, and a second end of which is immersible in a reservoir of cold fluid, the vacuum chamber extending coaxially therewith but terminating short of the second end thereof.
Claim 30
Dependent Claim
85 words
A monolithic superconductive chip comprising: a. a substrate having a low temperature region and a high temperature region; b. a low temperature electronic circuit formed on said low temperature region and including an element which is superconductive when it has a temperature below a critical level; and c. a plurality of electrical conductors formed on the substrate and having ends connected to said electronic circuit; said conductors extending into said high temperature region and including high performance transmission lines, and non-critical biasing and monitoring lines.
Claim 31
Dependent Claim
85 words
A monolithic superconductive chip comprising: a. a substrate having a low temperature region and a high temperature region; b. a low temperature electronic circuit formed on said low temperature region and including an element which is superconductive when it has a temperature below a critical level; and c. a plurality of electrical conductors formed on the substrate and having ends connected to said electronic circuit; said conductors extending into said high temperature region and including high performance transmission lines, and non-critical biasing and monitoring lines.
Claim 32
Dependent Claim
11 words
The chip of claim 26 wherein said substrate is fused quartz.
Claim 33
Dependent Claim
15 words
The chip of claim 26 wherein said substrate is flexible to compensate for thermal expansion.
Claim 34
Dependent Claim
19 words
The chip of claim 26 wherein at least one of said electronic circuit and said transmission lines contains niobium.
Claim 35
Dependent Claim
18 words
The chip of claim 26 further comprising contacting pads in said high temperature region terminating said non-critical lines.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-26 | 1991-10-26 | 1992-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-26 | 1995-10-26 | 1996-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-26 | 1999-10-26 | 2000-04-26 | $7700.00 | Window Closed / Lapsed |