US4739544A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a vapor-phase-diffused boundary-layer type multilayer ceramic capacitor
Assignee: Mitsubishi Mining and Cement Co Ltd
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Filing: 1986-12-11
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Granted: 1988-04-26
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Expires: 2006-12-11
Abstract
Abstract A method of manufacturing a miniaturized multilayer ceramic capacitor having high capacitance which comprises a dielectric body of the type that the grain boundaries thereof are insulated. Multilayer chips are prepared which consist of a semiconductor ceramic material whose major constituent comprises titanate of alkaline-earth metal such as Ba, Sr or the like; and such chips are placed within a container formed of a fired mixture of CuO and Al2O3 and subjected to a heat treatment so that copper ions which serve as insulating agent, are caused to uniformly diffuse from vapor phase in crystal grain boundaries of the semiconductor ceramics body of each of the chips.
Inventors
- 👤 Kiyoshi Okazaki
- 👤 Hideji Igarashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:49
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/018; H01G4/06; H01G4/08; H01G4/12; H01G4/1272; H01G4/1281; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
233 words
A method of manufacturing a multilayer ceramic capacitor comprising a dielectric body having insulated grain boundaries, inner electrodes, and outer electrodes, comprising the steps of: preparing green sheets of semiconductor ceramics; printing metal paste onto the surface of each of said green sheets of semiconductor ceramics to form the inner electrodes; stacking said sheets; applying a pressure to the stack of said sheets to cause said sheets to adhere to each other, while heating said stack, thereby forming a layer-built structure; cutting said layer-built structure into a plurality of multilayer chips in such a manner that the inner electrodes are exposed at opposing two surfaces of the chips; firing said chips to form multilayer semiconductor ceramic chips; thereafter, causing an insulating agent consisting of at least one component selected from the group consisting of copper ions and copper oxide to be thermally diffused in grain boundaries of said semiconductor ceramics, thereby insulating the grain boundaries; providing the outer electrodes on said opposing two surfaces of each of said chips; and maintaining said chips at an elevated temperature in a vapor-phase atmosphere including said insulating agent, so that ions of said insulating agent or a compound containing said insulating agent in said vapor-phase atmosphere are caused to thermally diffuse in the semiconductor ceramics constituting said chips through the grain boundaries thereof, thereby uniformly insulating the grain boundaries of said semiconductor ceramics constituting said chips.
Claim 2
Independent Claim
233 words
A method of manufacturing a multilayer ceramic capacitor comprising a dielectric body having insulated grain boundaries, inner electrodes, and outer electrodes, comprising the steps of: preparing green sheets of semiconductor ceramics; printing metal paste onto the surface of each of said green sheets of semiconductor ceramics to form the inner electrodes; stacking said sheets; applying a pressure to the stack of said sheets to cause said sheets to adhere to each other, while heating said stack, thereby forming a layer-built structure; cutting said layer-built structure into a plurality of multilayer chips in such a manner that the inner electrodes are exposed at opposing two surfaces of the chips; firing said chips to form multilayer semiconductor ceramic chips; thereafter, causing an insulating agent consisting of at least one component selected from the group consisting of copper ions and copper oxide to be thermally diffused in grain boundaries of said semiconductor ceramics, thereby insulating the grain boundaries; providing the outer electrodes on said opposing two surfaces of each of said chips; and maintaining said chips at an elevated temperature in a vapor-phase atmosphere including said insulating agent, so that ions of said insulating agent or a compound containing said insulating agent in said vapor-phase atmosphere are caused to thermally diffuse in the semiconductor ceramics constituting said chips through the grain boundaries thereof, thereby uniformly insulating the grain boundaries of said semiconductor ceramics constituting said chips.
Claim 3
Dependent Claim
43 words
The method according to claim 1, wherein said semiconductor ceramics consists of titanate of alkaline-earth metals doped with a substance to make said titanate semiconductive, said alkaline-earth metals being one or more selected from the group consisting of varium, strontium, calcium and magnesium.
Claim 4
Dependent Claim
133 words
The method according to claim 1, wherein the procedure of maintaining said chips in the vapor-phase atmosphere containing the insulating agent, comprises the steps of: disposing said chips in a container formed of a fired mixture of CuO and Al 2 O 3 ; and heating said container and said chips at a temperature in the range of 1100° C.-1250° C. for a period of time in the range from 1 minute to 24 hours, in the vapor-phase atmosphere containing said at least one component, thereby causing copper ions to be diffused through the grain boundaries of the semiconductor ceramics constituting said chips, and thereby insulating the grain boundaries of the semiconductor ceramics constituting said chips so that each of said chips is transformed to a dielectric body having a high dielectric constant.
References Cited (Backward Citations)
US4367265A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-26 | 1991-10-26 | 1992-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-26 | 1995-10-26 | 1996-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-26 | 1999-10-26 | 2000-04-26 | $7700.00 | Window Closed / Lapsed |