US4737884A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device module
Assignee: Fujitsu Ltd
•
Filing: 1987-06-24
•
Granted: 1988-04-12
•
Expires: 2007-06-24
Abstract
Abstract A semiconductor device module includes a package and a holder, the package includes, for example, a central processing unit, and the holder accommodates a removable leadless chip carrier. The holder comprising contact leads connected to electrode pads of the package. The leadless chip carrier also includes, for example, an erasable programmable read only memory, whereby the leadless chip carrier can be easily removed from the holder, resulting in easily writing into the erasable programmable read only memory or easy replacement of the leadless chip carrier.
Inventors
- 👤 Kensaku Wada
- 👤 Hidehiko Akasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:49
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1076; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
353 words
A semiconductor device module including internal wiring layers, operatively connected to an external circuit, including a leadless chip carrier having side surfaces, said semiconductor device module comprising: at least one semiconductor chip; a package accommodating said semiconductor chip, said package including a main surface, perpendicular to the side surfaces of the leadless chip carrier, a bottom surface opposite said main surface, a plurality of external terminals formed on said bottom surface, and a plurality of first electrode pads provided on said periphery of said main surface and extending in a direction parallel to said main surface; a holder, mounted on said main surface of said package and having substantially the same or smaller external shape and size as that of said package, for accommodating the leadless chip carrier, the leadless chip carrier including a plurality of second electrode pads formed on its side surfaces, said holder including a holder body having external surfaces, having a bottom surface adjacent to said main surface of said package and having a recessed portion formed therein for accommodating the leadless chip carrier, said recessed portion having inner walls adjacent to the leadless chip carrier; and a plurality of contact leads operatively connected to said second electrode pads of said leadless chip carrier and provided on the inner walls of said recessed portion adjacent to the side surfaces of said leadless chip carrier, each of said contact leads having an end exposed on the bottom surface of said holder body and extending in a direction parallel to the bottom surface so as to respectively form third electrode pads operatively connected to said first electrode pads, each of said third electrode pads positioned on the interior of said external surfaces of said holder body and including contact portions extending in a direction parallel to the bottom surface of said holder body and abutting said external surfaces of said holder body, for contacting the external circuit, said leadless chip carrier being removably fitted in said recessed portion of said holder body, and said first electrode pads operatively connected to said at least one semiconductor chip through the internal wiring layers.
Claim 2
Dependent Claim
353 words
A semiconductor device module including internal wiring layers, operatively connected to an external circuit, including a leadless chip carrier having side surfaces, said semiconductor device module comprising: at least one semiconductor chip; a package accommodating said semiconductor chip, said package including a main surface, perpendicular to the side surfaces of the leadless chip carrier, a bottom surface opposite said main surface, a plurality of external terminals formed on said bottom surface, and a plurality of first electrode pads provided on said periphery of said main surface and extending in a direction parallel to said main surface; a holder, mounted on said main surface of said package and having substantially the same or smaller external shape and size as that of said package, for accommodating the leadless chip carrier, the leadless chip carrier including a plurality of second electrode pads formed on its side surfaces, said holder including a holder body having external surfaces, having a bottom surface adjacent to said main surface of said package and having a recessed portion formed therein for accommodating the leadless chip carrier, said recessed portion having inner walls adjacent to the leadless chip carrier; and a plurality of contact leads operatively connected to said second electrode pads of said leadless chip carrier and provided on the inner walls of said recessed portion adjacent to the side surfaces of said leadless chip carrier, each of said contact leads having an end exposed on the bottom surface of said holder body and extending in a direction parallel to the bottom surface so as to respectively form third electrode pads operatively connected to said first electrode pads, each of said third electrode pads positioned on the interior of said external surfaces of said holder body and including contact portions extending in a direction parallel to the bottom surface of said holder body and abutting said external surfaces of said holder body, for contacting the external circuit, said leadless chip carrier being removably fitted in said recessed portion of said holder body, and said first electrode pads operatively connected to said at least one semiconductor chip through the internal wiring layers.
Claim 3
Dependent Claim
22 words
A semiconductor device module as set forth in claim 1, wherein said leadless chip carrier includes an erasable programmable read only memory.
Claim 4
Dependent Claim
18 words
A semiconductor device module as set forth in claim 1, wherein said holder has a square-shaped bottom surface.
Claim 5
Dependent Claim
37 words
A semiconductor device module as set forth in claim 3, wherein said main surface of said package is a square surface having the same area as the square surface of said square-shaped bottom surface of said holder.
Claim 6
Dependent Claim
22 words
A semiconductor device module as set forth in claim 2, wherein said semiconductor chip accommodated in said package is a microcomputer chip.
Claim 7
Dependent Claim
33 words
A semiconductor device module as set forth in claim 1, wherein said inner walls of said recessed portion in said holder include a side wall perpendicular to the bottom surface of the holder.
Claim 8
Dependent Claim
41 words
A semiconductor device module as set forth in claim 6, wherein said side wall is provided with at least one cut portion on a diagonal line of said side wall, for removing said leadless chip carrier by means of a tool.
Claim 9
Dependent Claim
43 words
A semiconductor device module as set forth in claim 1, wherein each of said contact leads of said holder includes spring means for ensuring electrical contact between said second electrode pads of said leadless chip carrier and said contact leads of said holder.
Claim 10
Dependent Claim
17 words
A semiconductor device module as set forth in claim 1, wherein said package is a flat package.
Claim 11
Dependent Claim
18 words
A semiconductor device module as set forth in claim 1, wherein said package is a dual inline package.
References Cited (Backward Citations)
US3479634A
Cited
US3846734A
Cited
US4035046A
Cited
US4037270A
Cited
US4155615A
Cited
US4271426A
Cited
US4356532A
Cited
US4378139A
Cited
US4417777A
Cited
US4538864A
Cited
US4558397A
Cited
US4627533A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-12 | 1991-10-12 | 1992-04-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-12 | 1995-10-12 | 1996-04-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-12 | 1999-10-12 | 2000-04-12 | $7700.00 | Window Closed / Lapsed |