US4734255A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Use of a copper-titanium-cobalt alloy as the material for electronic components
Assignee: Wieland Werke AG
•
Filing: 1986-03-25
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Granted: 1988-03-29
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Expires: 2006-03-25
Abstract
Abstract The invention relates to the use of a copper-titanium-cobalt-alloy which consists of 0.05-0.6% titanium; 0.05-0.6% cobalt; remainder copper, whereby the cobalt is partially replaced by iron. Due to its excellent characteristics with respect to electrical and thermal conductivity, mechanical strength, softening resistance and homogeneity, the alloy is used as the material for electronic components, in particular lead frames for transistors, integrated circuits or the like, and parts for electronic components for automobiles.
Inventors
- 👤 Wolfgang Duerrschnabel
- 👤 Franz J. Puckert
- 👤 Heinrich Stueer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 07:47
CPC Classifications
C; C22; C22C; C22C9/00; C22C9/06; H; H10; H10W; H10W70/00; H10W70/40; H10W70/456
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
44 words
A supporting or connecting element of an electronic device, said element being made of an alloy consisting of: ______________________________________
Ti 0.05-0.6 wt. %
Co 0.05-0.6 wt. %
Cu and balance
unavoidable
impurities
______________________________________ wherein the weight ratio of Ti/Co is from 1.0 to 1.5.
Claim 2
Dependent Claim
44 words
A supporting or connecting element of an electronic device, said element being made of an alloy consisting of: ______________________________________
Ti 0.05-0.6 wt. %
Co 0.05-0.6 wt. %
Cu and balance
unavoidable
impurities
______________________________________ wherein the weight ratio of Ti/Co is from 1.0 to 1.5.
Claim 3
Dependent Claim
12 words
An element as claimed in claim 1, which is a lead frame.
Claim 4
Dependent Claim
26 words
An element as claimed in claim 1, in which said alloy is essentially free of zinc, tin, nickel, silicon, aluminum, cadmium, beryllium, lead, selenium and tellurium.
Claim 5
Dependent Claim
40 words
An alloy consisting of from 0.05 to 0.6 percent by weight of titanium, from 0.05 to 0.6 percent by weight of cobalt and the balance is copper and unavoidable impurities, the weight ratio of Ti/Co being from 1/1 to 1.5/1.
Claim 6
Dependent Claim
40 words
An alloy consisting of from 0.05 to 0.6 percent by weight of titanium, from 0.05 to 0.6 percent by weight of cobalt and the balance is copper and unavoidable impurities, the weight ratio of Ti/Co being from 1/1 to 1.5/1.
Claim 7
Dependent Claim
12 words
An electronic component made of an alloy as claimed in claim 4.
Claim 8
Dependent Claim
21 words
A lead frame for transistors and integrated circuits, said lead frame being made of an alloy as claimed in claim 4.
Claim 9
Dependent Claim
40 words
An alloy consisting of from 0.2 to 0.5 percent by weight of titanium, from 0.2 to 0.5 percent by weight of cobalt and the balance being copper and unavoidable impurities, the weight ratio of Ti/Co being from 1/1 to 1.5/1.
Claim 10
Dependent Claim
40 words
An alloy consisting of from 0.2 to 0.5 percent by weight of titanium, from 0.2 to 0.5 percent by weight of cobalt and the balance being copper and unavoidable impurities, the weight ratio of Ti/Co being from 1/1 to 1.5/1.
Claim 11
Dependent Claim
12 words
An electronic component made of an alloy as claimed in claim 7.
Claim 12
Dependent Claim
21 words
A lead frame for transistors and integrated circuits, said lead frame being made of an alloy as claimed in claim 7.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-29 | 1991-09-28 | 1992-03-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-29 | 1995-09-28 | 1996-03-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-29 | 1999-09-28 | 2000-03-29 | $7700.00 | Window Closed / Lapsed |