Solder-bearing leads

Claim 2

A solder-bearing lead adapted to be soldered to a conductive surface, comprising: an integral elongated strip-like essentially planar body portion, said body portion having on one edge thereof a laterally extending tab integral therewith, said tab being bent into a plane substantially perpendicular to the plane of said body portion, said bent tab having a partially curved form along one edge, extending in a direction longitudinally of said body portion and, a solder mass retained between said curved edge and said body portion.

Claim 3

A lead as in claim 1 wherein said body portion and the end of said tab are substantially coextensive in the direction of said body portion and form a channel therebetween, said solder mass extending flush or outwardly from said channel, whereby said solder mass may be placed in direct contact with the conductive surface to which said lead is to be soldered, and upon melting said solder mass, said tab is permitted to be in or to move into contact with said conductive surface to make electrical contact therewith and to be retained in such contact upon re-solidification of said solder mass.

Claim 4

A lead as in claim 1, including two tabs, one on each edge of said planar body portion, and said tabs curve inwardly toward said body portion.

Claim 5

A lead as in claim 3 for surface soldering to a conductive surface, wherein said tabs and an end of said body portion form an open channel therebetween, and said solder mass is in said channel, whereby said lead may be placed on said conductive surface with the end of said lead substantially perpendicular said conductive surface and said solder mass in contact with said conductive surface.

Claim 6

A lead as in claim 4, wherein said solder mass is at least flush with or extends outwardly from said channel in the direction of the length of said body portion.

Claim 7

A lead as in claim 4 wherein the ends of said tabs retain said solder mass against said body portion end.

Claim 8

A lead as in claim 6 wherein the ends of said tabs partly encircle said solder means.

Claim 9

A lead as in claim 6 wherein the ends of said tabs are staked into said solder mass.

Claim 10

A solder-bearing lead adapted to be soldered to a conductive surface, comprising: an elongated strip-like body portion, said body portion having on one edge thereof a curved finger defining an opening between said body portion and said finger, said finger being bent into a plane substantially perpendicular from the body portion to form therebetween part of a channel with said body portion forming a border for said channel, a solder mass in said channel and bordered by said finger, said finger being curved inwardly of said channel and longitudinally of said body portion to retain said solder mass therein.

Claim 11

A solder-bearing lead adapted to be soldered to a conductive surface, comprising: an elongated strip-like body portion, said body portion having on one edge thereof a curved finger defining an opening between said body portion and said finger, said finger being bent into a plane substantially perpendicular from the body portion to form therebetween part of a channel with said body portion forming a border for said channel, a solder mass in said channel and bordered by said finger, said finger being curved inwardly of said channel and longitudinally of said body portion to retain said solder mass therein.

Claim 12

A solder-bearing lead as in claim 9, wherein the end of said finger is substantially opposite an end of said body portion, and said solder mass has a dimension extending along said body portion at least as far as the extent of said finger along said body portion, whereby said solder mass extends flush with or outwardly from said channel and may be placed in direct contact with the conductive surface to which said lead is to be soldered, and upon melting said solder mass, said finger is permitted to be in or move into contact with said conductive surface to make electrical contact therewith and to be retained in such contact upon resolidification of said solder mass.

Claim 13

A solder-bearing lead as in claim 10, wherein said solder dimension is substantially equal to the projection of said finger along said body portion.

Claim 14

A solder-bearing lead adapted to be soldered to a conductive surface, comprising: an elongated strip-like body portion, said body portion having on each edge thereof an integral curved finger defining an opening between each finger and said body portion, said openings being laterally aligned transversely of said body-portion strip, said fingers being bent substantially perpendicular from the body portion strip to align said openings to form a channel transversely of said strip, with said body portion forming a floor for said channel, a solder mass in said channel and bordered by said pair of fingers, said fingers being curved inwardly of said channel and longitudinally of said body portion to retain said solder mass therein, said solder mass having a dimension extending along said body portion at least as great as the extent of said fingers along said body portion, whereby said solder mass extends flush or outwardly from said channel and may be placed in direct contact with the conductive surface to which said lead is to be soldered, while spacing said fingers from said surface, and upon melting said solder mass, said fingers are permitted to be in or move into contact with said conductive surface to make electrical contact therewith and to be retained in such contact upon re-solidification of said solder mass.

Claim 15

A solder-bearing lead adapted to be soldered to a conductive surface, comprising: an elongated strip-like body portion, said body portion having on each edge thereof an integral curved finger defining an opening between each finger and said body portion, said openings being laterally aligned transversely of said body-portion strip, said fingers being bent substantially perpendicular from the body portion strip to align said openings to form a channel transversely of said strip, with said body portion forming a floor for said channel, a solder mass in said channel and bordered by said pair of fingers, said fingers being curved inwardly of said channel and longitudinally of said body portion to retain said solder mass therein, said solder mass having a dimension extending along said body portion at least as great as the extent of said fingers along said body portion, whereby said solder mass extends flush or outwardly from said channel and may be placed in direct contact with the conductive surface to which said lead is to be soldered, while spacing said fingers from said surface, and upon melting said solder mass, said fingers are permitted to be in or move into contact with said conductive surface to make electrical contact therewith and to be retained in such contact upon re-solidification of said solder mass.

Claim 16

A lead as in claim 9, wherein said fingers and solder mass are adjacent one end of said lead, the other end of said lead being formed as an electrical element, whereby said electrical element may be surface-mounted on said conductive surface by juxtaposing said solder mass to said surface, melting said solder, and re-solidifying said solder.

Claim 17

A lead as in claim 13, wherein said element is a circuit board edge clip.

Claim 18

A lead as in claim 13, wherein said element is a pin-receiving connector contact.

Claim 19

A lead as in claim 13, wherein said element is a circuit board connector contact.

Claim 20

A lead as in claim 9, further including a spring finger integral with said lead body portion and positioned opposite to said solder mass to form a clip arrangement for a circuit board or the like.

Claim 23

A method as in claim 18, further including the steps of forming on another edge of said blank a second laterally extending tab aligned with said first tab transversely of said body portion, bending said second tab substantially perpendicularly of said body portion, placing said solder mass on said body portion adjacent an edge of each said tab, and bending said edges of said tabs to secure said solder mass.

Claim 24

The method as in claim 19, wherein said solder mass extends outwardly of said channel beyond the tips of said tabs.

Claim 25

The method as in claim 20, wherein said solder mass extends into the opening between said tabs on each edge of said body portion.

Claim 26

The method as in claim 19, wherein said solder mass is substantially level with the tips of said tabs.

Claim 27

The method of claim 19, wherein said solder mass is depressed below the tips of said tabs.

Claim 28

A terminal for a lead for surface mounting on a substrate having a conductive area comprising a solder-bearing lead as in claim 1, where said tab is located adjacent one end of said lead and in a position to be juxtaposed to said conductive area of said substrate.