Socket for integrated circuit component

Claim 2

Apparatus for socketing integrated circuit components, in which the integrated circuit components each have a plurality of component leads extending in rows on opposite sides of an integrated circuit component body, the apparatus comprising: an insulative socket housing having a plurality of cavities extending inwardly from the top thereof, the cavities being arranged along and adjacent opposite outer sides of the housing, and having centerline spacings equivalent to the centerline spacings of the component leads, each cavity being open along the top of the housing and partially open along an inwardly oriented face of the housing, the housing defining a component seating ledge at the bottom of the inwardly open portions of the cavities, each cavity having first and second opposite endwalls extending from said inwardly oriented face toward the outer housing side; and a plurality of resilient contact terminals received within corresponding cavities, each terminal having an arcuately deformed intermediate section restrained within the corresponding cavity and a component lead contact surface preloaded toward the first endwall, the terminals being oriented to engage a corresponding lead insertable between the terminal and the first endwall only along one interstitial edge of the lead; the opposite interstitial edge of each leading engaging the first endwall.

Claim 3

The apparatus of claim 1 wherein the terminals exert a force only against the interstitial edges of the component leads when the integrated circuit component body is positioned on the component seating ledge.

Claim 4

The apparatus of claim 2 wherein the arcuately deformed intermediate terminal section comprises means for stiffening the terminals upon engagement with the component leads.

Claim 5

The apparatus of claim 3 wherein the intermediate terminal section initially comprises a flat section, the flat section being arcuately deformed upon insertion into a cavity.

Claim 6

The apparatus of claim 1 wherein each terminal includes a leg extending through an orifice on the bottom surface of the housing.

Claim 7

The apparatus of claim 5 wherein the legs of adjacent terminals are laterally staggered.

Claim 8

The apparatus of claim 6 wherein the legs comprise means for interconnecting the terminals to conductive traces on a substrate, the stagger of the legs increasing the spacing between adjacent interconnections to the conductive traces.

Claim 9

The apparatus of claim 1 wherein a plurality of ribs are defined on the first and second endwalls, the ribs engaging the respective terminal along laterally disposed portions of each terminal, a portion of the terminal being arcuately deformed upon engagement with the ribs.

Claim 10

The apparatus of claim 8 wherein the ribs comprise a centrally disposed rib extending from the second endwall and at least one rib extending adjacent an edge of the first endwall.

Claim 11

The apparatus of claim 9 wherein two ribs extend adjacent opposite edges of the first endwall, the centrally disposed rib, extending from the second endwall, the two ribs adjacent the opposite edges of the first endwall extending closer to the component lead receiving opening to flex the terminal closer toward the second endwall.

Claim 12

The apparatus of claim 1 wherein a shoulder is defined on the second endwall between the component lead receiving opening and the contact retention portion, each terminal being preloaded into contact with the shoulder, the lead in portion of the terminal being positioned between the shoulder and the top of the socket.

Claim 13

Apparatus for socketing small outline integrated circuit components, in which the small outline integrated circuit components each have a plurality of leads, stamped from a lead frame, partially encapsulated within an integrated circuit component body, the leads extending transversely outwardly from opposite sides of an integrated circuit component body, adjacent leads being spaced apart on centerlines no greater than 0.05 inch, each component lead being formed downwardly and extending to but not substantially beyond a lower surface of the body; the apparatus comprising: a socket housing having a plurality of cavities, each cavity comprising means for receipt of individual small outline integrated circuit component leads and being defined by interstitial partitions, endwalls of each cavity comprising end surfaces of interstitial partitions; and a plurality of resilient terminals, individually positioned within each cavity, each terminal having a planar lead contact portion, the planar lead contact portions being oriented to extend both perpendicular to the individual leads and between adjacent leads to resiliently engage each lead along only one interstitial edge, the opposite interstitial edge of each lead engaging an endwall of the cavity.

Claim 14

Apparatus for socketing small outline integrated circuit components, in which the small outline integrated circuit components each have a plurality of leads, stamped from a lead frame, partially encapsulated within an integrated circuit component body, the leads extending transversely outwardly from opposite sides of an integrated circuit component body, adjacent leads being spaced apart on centerlines no greater than 0.05 inch, each component lead being formed downwardly and extending to but not substantially beyond a lower surface of the body; the apparatus comprising: a socket housing having a plurality of cavities, each cavity comprising means for receipt of individual small outline integrated circuit component leads and being defined by interstitial partitions, endwalls of each cavity comprising end surfaces of interstitial partitions; and a plurality of resilient terminals, individually positioned within each cavity, each terminal having a planar lead contact portion, the planar lead contact portions being oriented to extend both perpendicular to the individual leads and between adjacent leads to resiliently engage each lead along only one interstitial edge, the opposite interstitial edge of each lead engaging an endwall of the cavity.

Claim 15

The apparatus of claim 12 wherein the planar lead contact portions are oriented within respective cavities to engage only an interstitial edge of a stamped lead insertable into the corresponding cavity.

Claim 16

The apparatus of claim 13 wherein each planar lead contact portion is located abreast a first cavity endwall extending perpendicular to the individual leads, with a lead positioned within a cavity.

Claim 17

The apparatus of claim 14 wherein each planar lead contact portion is preloaded toward a second cavity endwall prior to insertion of a component lead therein and flexes to a position abreast the opposite first cavity endwall with the component lead in the cavity.

Claim 18

The apparatus of claim 12 wherein the planar lead contact portion is oriented to engage an interstitial edge of a lead in the corresponding cavity without applying stresses normal to the plane of the lead.

Claim 19

The apparatus of claim 12 wherein the cavities are located in two rows on opposite sides of the housing, each cavity having an inwardly open side extending above an intermediate seat surface comprising means for supporting the small outline integrated circuit component.

Claim 20

A socket for an integrated circuit package of the type having two opposed rows of leads formed with laterally projecting feet for mounting against surface contacts on a printed circuit board, the socket comprising a dielectric housing a package receiving face and an opposed board mounting face with two parallel rows of apertures extending therebetween, the package receiving face having therein a package receiving nest having a floor flanked by parallel opposed sidewalls, the sidewalls of the nest having respective parallel rows of channels therein, each aperture having a pair of opposed sidewalls paralleling the sidewalls of the nest and a pair of opposed endwalls substantially perpendicular thereto, the apertures in each row intersecting respective channels, a row of the channels being spaced to receive said feet when said package is placed in the nest, a plurality of elongate formed contacts lying in respective apertures, each contact having first and second sheared surfaces facing respective sidewalls of the aperture and opposed first and second rolled surfaces facing respective endwalls thereof, each contact having a first end proximate said package receiving face and an opposed second end proximate the mounting face, each contact forming a leaf spring facing one said endwall, the apex of the leaf spring being located so that the leaf springs resiliently engage the feet of the package leads in the channels when the package is inserted in the nest.

Claim 21

A socket for an integrated circuit package of the type having two opposed rows of leads formed with laterally projecting feet for mounting against surface contacts on a printed circuit board, the socket comprising a dielectric housing a package receiving face and an opposed board mounting face with two parallel rows of apertures extending therebetween, the package receiving face having therein a package receiving nest having a floor flanked by parallel opposed sidewalls, the sidewalls of the nest having respective parallel rows of channels therein, each aperture having a pair of opposed sidewalls paralleling the sidewalls of the nest and a pair of opposed endwalls substantially perpendicular thereto, the apertures in each row intersecting respective channels, a row of the channels being spaced to receive said feet when said package is placed in the nest, a plurality of elongate formed contacts lying in respective apertures, each contact having first and second sheared surfaces facing respective sidewalls of the aperture and opposed first and second rolled surfaces facing respective endwalls thereof, each contact having a first end proximate said package receiving face and an opposed second end proximate the mounting face, each contact forming a leaf spring facing one said endwall, the apex of the leaf spring being located so that the leaf springs resiliently engage the feet of the package leads in the channels when the package is inserted in the nest.

Claim 22

The socket of claim 18 wherein the nest comprises a seat defined by two parallel spaced apart ledges having a sword slot extending therebetween.

Claim 23

Apparatus for socketing integrated circuit components, in which the integrated circuit components have a plurality of component leads extending in rows on opposite sides of an integrated circuit component body, the apparatus comprising: an insulative socket housing having a plurality of cavities extending inwardly from the top thereof, the cavities being arranged along and adjacent opposite outer sides of the housing, and having centerline spacings equivalent to the centerline spacings of the component leads, each cavity being open along the top of the housing, each cavity having opposite endwalls, each cavity being partially open along an inwardly oriented face of the housing, the opposite endwalls defining each cavity extending from said inwardly oriented face toward an adjacent outer housing side; and a plurality of resilient contact terminals received within corresponding cavities, each terminal having only a single component lead contact surface preloaded toward one of said endwalls, the single component lead contact surface being oriented to engage a corresponding lead insertable between the terminal and the one endwall only along one interstitial edge of the lead, the opposite interstitial edge of the lead engaging the one endwall.

Claim 24

Apparatus for socketing integrated circuit components, in which the integrated circuit components have a plurality of component leads extending in rows on opposite sides of an integrated circuit component body, the apparatus comprising: an insulative socket housing having a plurality of cavities extending inwardly from the top thereof, the cavities being arranged along and adjacent opposite outer sides of the housing, and having centerline spacings equivalent to the centerline spacings of the component leads, each cavity being open along the top of the housing, each cavity having opposite endwalls, each cavity being partially open along an inwardly oriented face of the housing, the opposite endwalls defining each cavity extending from said inwardly oriented face toward an adjacent outer housing side; and a plurality of resilient contact terminals received within corresponding cavities, each terminal having only a single component lead contact surface preloaded toward one of said endwalls, the single component lead contact surface being oriented to engage a corresponding lead insertable between the terminal and the one endwall only along one interstitial edge of the lead, the opposite interstitial edge of the lead engaging the one endwall.

Claim 25

The apparatus of claim 20 wherein each terminal has an arcuately deformed intermediate section restrained within the corresponding cavity.

Claim 26

Apparatus for socketing an integrated circuit component, in which the integrated circuit component has a plurality of leads, stamped from a lead frame, extending from the sides of an integrated circuit component body, the apparatus comprising: a socket housing having a plurality of cavities defined by opposed endwalls and oriented for receipt of individual leads; and a plurality of terminals individually positioned within each cavity, each terminal having a substantially flat contact surface, the cavity endwalls engaging each terminal to spring bias each terminal normal to the planar contact surface, each terminal being oriented within respective cavities to engage a stamped lead insertable into the cavity along only one interstitial edge of the lead, the opposite interstitial edge of each lead engaging one of said endwalls of the cavity.

Claim 27

Apparatus for socketing an integrated circuit component, in which the integrated circuit component has a plurality of leads, stamped from a lead frame, extending from the sides of an integrated circuit component body, the apparatus comprising: a socket housing having a plurality of cavities defined by opposed endwalls and oriented for receipt of individual leads; and a plurality of terminals individually positioned within each cavity, each terminal having a substantially flat contact surface, the cavity endwalls engaging each terminal to spring bias each terminal normal to the planar contact surface, each terminal being oriented within respective cavities to engage a stamped lead insertable into the cavity along only one interstitial edge of the lead, the opposite interstitial edge of each lead engaging one of said endwalls of the cavity.

Claim 28

The apparatus of claim 22 wherein the socket housing comprises a one-piece member, each terminal engaging the housing for retaining each terminal in the respective cavity.