Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
96 words
An electrically variable piezoelectric hybrid microelectronic circuit capacitor, comprising in combination: a substrate; a first capacitor plate formed on a surface of said substrate; a ridge formed by a hybrid microelectronic circuit manufacturing process on said surface of said substrate, said ridge having an upper surface positioned a predetermined distance above said first capacitor plate; an arch or dome shaped piezoelectric wafer connected to said upper surface of said ridge; a second capacitor plate formed on a first surface of said piezoelectric wafer; a first control plate formed on a second surface of said piezoelectric wafer.
Claim 2
Dependent Claim
96 words
An electrically variable piezoelectric hybrid microelectronic circuit capacitor, comprising in combination: a substrate; a first capacitor plate formed on a surface of said substrate; a ridge formed by a hybrid microelectronic circuit manufacturing process on said surface of said substrate, said ridge having an upper surface positioned a predetermined distance above said first capacitor plate; an arch or dome shaped piezoelectric wafer connected to said upper surface of said ridge; a second capacitor plate formed on a first surface of said piezoelectric wafer; a first control plate formed on a second surface of said piezoelectric wafer.
Claim 3
Dependent Claim
155 words
An electrically variable piezoelectric hybrid microelectronic circuit capacitor, comprising in combination: a ceramic substrate; a first capacitor plate formed on a surface of said ceramic substrate; a substantially circular supporting ridge formed by a hybrid microelectronic circuit manufacturing process on said surface of said ceramic substrate, said ridge having an upper surface positioned a predetermined distance above said first capacitor plate; a substantially dome shaped piezoelectric wafer having a convex surface adjacent said first capacitor plate and a concave surface opposed to said convex surface, said wafer being connected to said upper surface of said ridge at the perimeter of said wafer; a second capacitor plate formed on said convex surface of said piezoelectric wafer; and a control plate formed on said concave surface of said piezoelectric wafer; whereby, the capacitance between said first and second capacitor plates is a function of the control voltage applied between said control plate and said second capacitor plate.
Claim 4
Dependent Claim
155 words
An electrically variable piezoelectric hybrid microelectronic circuit capacitor, comprising in combination: a ceramic substrate; a first capacitor plate formed on a surface of said ceramic substrate; a substantially circular supporting ridge formed by a hybrid microelectronic circuit manufacturing process on said surface of said ceramic substrate, said ridge having an upper surface positioned a predetermined distance above said first capacitor plate; a substantially dome shaped piezoelectric wafer having a convex surface adjacent said first capacitor plate and a concave surface opposed to said convex surface, said wafer being connected to said upper surface of said ridge at the perimeter of said wafer; a second capacitor plate formed on said convex surface of said piezoelectric wafer; and a control plate formed on said concave surface of said piezoelectric wafer; whereby, the capacitance between said first and second capacitor plates is a function of the control voltage applied between said control plate and said second capacitor plate.
Claim 5
Dependent Claim
13 words
The capacitor of claim 1 wherein said ridge is tooled in said substrate.
Claim 6
Dependent Claim
13 words
The capacitor of claim 1 wherein said ridge is sputtered on said substrate.
Claim 7
Dependent Claim
13 words
The capacitor of claim 1 wherein said ridge is vacuum-deposited on said substrate.
Claim 8
Dependent Claim
13 words
The capacitor of claim 1 wherein said ridge is electroplated on said substrate.
Claim 9
Dependent Claim
13 words
The capacitor of claim 1 wherein said ridge is screened on said substrate.
Claim 10
Dependent Claim
17 words
The capacitor of claim 1 wherein said ridge is a preformed glass ring bonded to said substrate.
Claim 11
Dependent Claim
19 words
The capacitor of claim 1 further comprising a second control plate on said first surface of said piezoelectric wafer.