Patent US4106494A successfully refreshed from Google Patents.
US4710253A
Expired / Lapsed
US
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Method for manufacturing a circuit board
Assignee: SOMICH TECHNOLOGY Inc 42 WOODCRAFT BAY WINNIPEG MANITOBA CANADA R2R 1C7
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Filing: 1985-05-30
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Granted: 1987-12-01
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Expires: 2005-05-30
Abstract
Abstract A circuit board is manufactured by applying a film of heat actuable adhesive to a substrate and depositing on the film a layer of a conductive powder. The powder and film are then activated by laser radiation or by direct contact with a heated plate. The excess powder is then removed and the substrate fired to cure or bond the powder to the substrate while removing excess adhesive film.
Inventors
- 👤 Peter Soszek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:35
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/102; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/09; H05K2203/092; H05K2203/10; H05K2203/107; H05K3/38; H05K3/386
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
113 words
A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, applying a layer of a heat actuable adhesive to said surface, loosely dispensing onto said layer an electrically conductive powder consisting of elemental metal in such a manner that the powder remains unbonded to the surface and can be readily removed therefrom, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive without affecting the powder to adhesively bond said powder to said surface in said pattern, and removing from said surface powder which remains unbonded.
Claim 2
Independent Claim
113 words
A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, applying a layer of a heat actuable adhesive to said surface, loosely dispensing onto said layer an electrically conductive powder consisting of elemental metal in such a manner that the powder remains unbonded to the surface and can be readily removed therefrom, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive without affecting the powder to adhesively bond said powder to said surface in said pattern, and removing from said surface powder which remains unbonded.
Claim 3
Independent Claim
118 words
A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, loosely dispensing onto said surface a powder in such a manner that the powder remains unbonded to the surface and can readily be removed therefrom, said powder consisting of a mixture of a heat actuable adhesive powder and an electrically conductive elemental metal powder, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive powder without affecting said metal powder to bond said metal powder to said surface in said pattern, and removing from said surface said powder which remains unbonded.
Claim 4
Independent Claim
118 words
A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, loosely dispensing onto said surface a powder in such a manner that the powder remains unbonded to the surface and can readily be removed therefrom, said powder consisting of a mixture of a heat actuable adhesive powder and an electrically conductive elemental metal powder, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive powder without affecting said metal powder to bond said metal powder to said surface in said pattern, and removing from said surface said powder which remains unbonded.
Claim 5
Dependent Claim
15 words
The invention according to claim 1 wherein said adhesive means is applied as a film.
Claim 6
Dependent Claim
35 words
The invention according to claim 1 wherein said adhesive means comprises a thermoplastic adhesive and, subsequent to removing powder from said surface, said surface is heated to cure said powder and remove said thermoplastic adhesive.
Claim 7
Dependent Claim
27 words
The invention according to claim 4 wherein said powder includes means activated by said heat to permanently bond said powder to said surface as said conductive pattern.
Claim 8
Dependent Claim
38 words
The invention according to claim 1 wherein simultaneously with said heating of said powder in said pattern, pressure is applied to said powder in said pattern whereby said powder is bonded to said surface by heat and pressure.
Claim 9
Dependent Claim
33 words
The invention according to claim 1 wherein prior to selectively heating said powder, pressure is applied to said powder over all of said surface to compress the powder into contact with said surface.
Claim 10
Dependent Claim
16 words
The invention according to claim 1 wherein said selective heating is carried out by a laser.
Claim 11
Dependent Claim
37 words
The invention according to claim 6 wherein said simultaneous heating and pressure is applied by a master pattern which is pressed into contact with said powder and heated to a temperature sufficient to activate said adhesive means.
Claim 12
Dependent Claim
39 words
The invention according to claim 2 wherein said adhesive powder comprises a thermoplastic adhesive and, subsequent to removing said powder from said surface, said surface is heated to cure said metal powder and to remove said thermoplastic adhesive powder.
Claim 13
Dependent Claim
36 words
The invention according to claim 10 wherein said powder includes means activated by said heating of said surface to cure said metal powder to permanently bond said metal powder to said surface as said conductive pattern.
Claim 14
Dependent Claim
39 words
The invention according to claim 2 wherein simultaneously with said heating of said powder in said pattern, pressure is applied to said powder in said pattern whereby said metal powder is bonded to said surface by heat and pressure.
Claim 15
Dependent Claim
33 words
The invention according to claim 2 wherein prior to selectively heating said powder pressure is applied to said powder over all of said surface to compress said powder into contact with said surface.
Claim 16
Dependent Claim
16 words
The invention according to claim 2 wherein said selective heating is carried out by a laser.
Claim 17
Dependent Claim
37 words
The invention according to claim 2 wherein said simultaneous heating and pressure is applied by a master pattern which is pressed into contact with said powder and heated to a temperature sufficient to activate said adhesive powder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-30 | 1991-06-01 | 1991-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-30 | 1995-06-01 | 1995-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-30 | 1999-06-01 | 1999-12-01 | $7700.00 | Window Closed / Lapsed |