Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
186 words
A method of forming a lateral bipolar transistor in a substrate of semiconductor material having an upper surface and a predetermined crystalline orientation, said method including the steps of: (a) doping the substrate with impurities of a first type; (b) forming at least two predeterminedly spaced apart narrow grooves extending from the upper surface into the substrate; (c) forming laterally extending emitter and collector regions by laterally diffusing impurities of a second type through the sidewalls of said grooves, which lateral diffusion extends a distance predetermined to be less than the spacing between the adjacent grooves to thereby form the lateral bipolar transistor with the first type doped substrate forming the base region between the second type doped emitter and collector regions; (d) forming spaced apart emitter and collector contact regions of said second type in the substrate extending downwardly from said upper surface to intersect with the laterally extending emitter and collector regions about said grooves; (e) forming a base contact of said first type at the upper surface of the substrate over the base region defined between the second type emitter and collector regions.
Claim 2
Independent Claim
186 words
A method of forming a lateral bipolar transistor in a substrate of semiconductor material having an upper surface and a predetermined crystalline orientation, said method including the steps of: (a) doping the substrate with impurities of a first type; (b) forming at least two predeterminedly spaced apart narrow grooves extending from the upper surface into the substrate; (c) forming laterally extending emitter and collector regions by laterally diffusing impurities of a second type through the sidewalls of said grooves, which lateral diffusion extends a distance predetermined to be less than the spacing between the adjacent grooves to thereby form the lateral bipolar transistor with the first type doped substrate forming the base region between the second type doped emitter and collector regions; (d) forming spaced apart emitter and collector contact regions of said second type in the substrate extending downwardly from said upper surface to intersect with the laterally extending emitter and collector regions about said grooves; (e) forming a base contact of said first type at the upper surface of the substrate over the base region defined between the second type emitter and collector regions.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein said semiconductor material is monocrystalline silicon and wherein said upper surface is in the (110) plane.
Claim 4
Dependent Claim
15 words
the method of claim 1 wherein said impurities of a first type are N type.
Claim 5
Dependent Claim
14 words
The method of claim 1 wherein said substrate includes a layer of epitaxial material.
Claim 6
Dependent Claim
15 words
The method of claim 1 wherein said grooves are longitudinally aligned parallel to one another.
Claim 7
Dependent Claim
17 words
The method of claim 1 wherein said groove side walls are substantially in the (111) crystalline plane.
Claim 8
Dependent Claim
15 words
The method of claim 1 wherein said impurities of a second type are P type.
Claim 9
Dependent Claim
16 words
The method of claim 1 wherein said grooves are on the order of one micrometer wide.
Claim 10
Dependent Claim
13 words
the method of claim 1 wherein said grooves are formed by plasma etch.
Claim 11
Dependent Claim
24 words
The method of claim 1 wherein said step of forming said grooves includes the step of forming continuous grooves one interior to the other.
Claim 12
Dependent Claim
19 words
The method of claim 10 wherein said step of forming continuous grooves includes the step of forming concentric rectangles.
Claim 13
Dependent Claim
19 words
The method of claim 10 wherein the step of forming continuous grooves includes the step of forming concentric rings.
Claim 14
Dependent Claim
29 words
The method of claim 1 including the ste of gaseous deposition of impurities into said sidewalls and driving said impurities by diffusion into said walls to a predetermined depth.
Claim 15
Dependent Claim
48 words
The method of claim 1 further including the steps of: forming an N well in said substrate; forming a third region of P type material in said N well; forming a fourth region of N type material in said third region whereby a vertical NPN transistor is formed.