US4704318A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Print circuit board
Assignee: Toshiba Corp
•
Filing: 1986-03-12
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Granted: 1987-11-03
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Expires: 2006-03-12
Abstract
Abstract There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.
Inventors
- 👤 Masayuki Saito
- 👤 Hirosi Oodaira
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 00:27
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/06; H01C17/065; H01C17/22; H01C17/24; H01C17/242; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K1/0313; H05K1/032; H05K1/09; H05K1/092; H05K1/095; H05K1/16; H05K2203/00; H05K2203/16; H05K2203/161; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678; Y10T428/31692; Y10T428/31696; Y10T428/31855; Y10T428/31931
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
54 words
A wiring substrate comprising a wiring circuit formed on a metal substrate with an insulating resinous layer interposed therebetween, wherein said insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight (based on the whole mass of the resinous layer) of high molecular softening agent.
Claim 2
Dependent Claim
54 words
A wiring substrate comprising a wiring circuit formed on a metal substrate with an insulating resinous layer interposed therebetween, wherein said insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight (based on the whole mass of the resinous layer) of high molecular softening agent.
Claim 3
Dependent Claim
20 words
The wiring substrate according to claim 1, wherein the high molecular softening agent is hydrogenated polybutadiene or atactic polypropylene resin.
Claim 4
Dependent Claim
29 words
The wiring substrate according to claim 1, wherein the high molecular softening agent is one selected from the group consisting of chlorinated polyethylene, ethylene-vinyl acetate copolymer, and vinyl acetate.
Claim 5
Dependent Claim
21 words
The wiring substrate according to claim 1, wherein the thermosetting 1,2-polybutadiene resin has an average molecular weight of 1700 to 3300.
Claim 6
Dependent Claim
15 words
The wiring substrate according to claim 1, wherein the metal substrate is prepared from aluminium.
Claim 7
Dependent Claim
16 words
The wiring substrate according to claim 1, wherein the insulating resinous layer further contains light-reflecting pigment.
Claim 8
Dependent Claim
16 words
The wiring substrate according to claim 1, wherein the insulating resinous layer further contains thixotropic agent.
Claim 9
Dependent Claim
16 words
The wiring substrate according to claim 1, wherein the insulating resinous layer further contains a solvent.
Claim 10
Dependent Claim
20 words
The wiring substrate according to claim 1, wherein the insulating resinous layer has a lower relative dielectric constant than 3.
Claim 11
Dependent Claim
37 words
The wiring substrate according to claim 1, which further comprises another insulating resinous layer interposed between said wiring circuit and said insulating resinous layer, said another insulating resinous layer comprising thermosetting 1,2-polybutadiene and containing no softening agent.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-02 | 1991-05-04 | 1991-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-02 | 1995-05-04 | 1995-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-02 | 1999-05-04 | 1999-11-03 | $7700.00 | Window Closed / Lapsed |