US4704305A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Automatic solder paste application to circuit boards
Assignee: Nortel Networks Ltd
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Filing: 1984-12-13
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Granted: 1987-11-03
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Expires: 2004-12-13
Abstract
Abstract Solder paste is automatically applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in a nylon, "Delrin," "Teflon" or other plastic-metal plate, the holes being in a predetermined pattern, filling solder paste into the holes which are facing in an upward direction pivoting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling determines the amount of solder paste filled into the holes.
Inventors
- 👤 Jean P. Berger
- 👤 Evans H. Pridgen
- 👤 Alfred W. Owens
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:13
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/0195; H05K2203/03; H05K2203/0338
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
86 words
A method of applying solder to a circuit board comprising: (a) positioning a plate with holes therein, said holes being in a predetermined pattern and having openings facing upwardly, (b) filling said holes at a solder filling location with solder paste downwardly from above said plate, (c) moving said plate from the solder filling location to a solder ejecting location by rotating said plate approximately 180 degrees wherein said holes face downwardly, and (d) ejecting the solder paste from said holes downwardly onto a circuit board.
Claim 2
Independent Claim
86 words
A method of applying solder to a circuit board comprising: (a) positioning a plate with holes therein, said holes being in a predetermined pattern and having openings facing upwardly, (b) filling said holes at a solder filling location with solder paste downwardly from above said plate, (c) moving said plate from the solder filling location to a solder ejecting location by rotating said plate approximately 180 degrees wherein said holes face downwardly, and (d) ejecting the solder paste from said holes downwardly onto a circuit board.
Claim 3
Dependent Claim
18 words
A method as claimed in claim 1, including reciprocating pins in said holes to eject the solder paste.
Claim 4
Dependent Claim
16 words
The method of claim 2, including squashing the solder paste on the circuit board during ejecting.
Claim 5
Dependent Claim
31 words
The method of claim 3, including forming generally hemispherical shaped solder dots with a generally pointed tip after ejecting and as the pins are being moved away from the circuit board.
Claim 6
Dependent Claim
15 words
The method of claim 2, including forming a seal between said plate and said pins.
Claim 7
Dependent Claim
17 words
The method of claim 5, including forming the portion of said plate forming the seal of plastic.
Claim 8
Dependent Claim
17 words
The method of claim 5, including forming the portion of said plate forming the seal of polytetrafluoroethylene.
Claim 9
Dependent Claim
18 words
A method as claimed in claim 1, including varying the amount of solder paste filled into the holes.
Claim 10
Dependent Claim
24 words
A method as claimed in claim 1, including ejecting said solder paste through a screen mesh to deposit said solder paste in the holes.
References Cited (Backward Citations)
US2724364A
Cited
US3198169A
Cited
US3604391A
Cited
US3952697A
Cited
DE2719945A1
Cited
US4323593A
Cited
US4273607A
Cited
US4352712A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-02 | 1991-05-04 | 1991-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-02 | 1995-05-04 | 1995-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-02 | 1999-05-04 | 1999-11-03 | $7700.00 | Window Closed / Lapsed |