Method of making and installing conductive floor tile for control of static generation

Claim 1

A method of providing an installation of floor covering capable of dissipating static electrical charges at a decay rate of substantially 5000 volts of charge in substantially 0.07-0.08 seconds including the steps of forming individual thin static dissipative tiles by forming a hard plastic surface lamination of melamine, bonding thin wire mesh screen to the hard surface lamination, placing the tiles closely adjacent to each other on a floor and bonding them to the floor by way of a floor adhesive, and providing for electrical connection between tiles over the entire surface by the step of placing electrical connectors underneath the joints between adjacent tiles in contact with the wire mesh screen of adjacent tiles and providing a grounding connection whereby static charges generated on the floor surface are dissipated at the said decay rate, forming the tiles in a generally rectangular shape, positioning a plurality of similar tiles contiguously adjacent to each other, placing electrically conductive members in the adhesive and beneath joints between adjacent tiles to provide electrical conductivity between electrically conductive laminations of the tiles whereby the entire floor covering has the capability of dissipating static charges before they can build up and extending one of the said electrical conductors beyond the perimeter of the tiles and attaching it to a suitable ground, forming the electrical connectors from aluminum, providing wave formations in the conductors and providing pressure against the tiles whereby to flatten out the wave formations in the connectors during installation to insure electrical connection between electrically conductive laminations of adjacent tiles.

Claim 2

A method of providing an installation of floor covering capable of dissipating static electrical charges at a decay rate of substantially 5000 volts of charge in substantially 0.07-0.08 seconds including the steps of forming individual thin static dissipative tiles by forming a hard plastic surface lamination of melamine, bonding thin wire mesh screen to the hard surface lamination, placing the tiles closely adjacent to each other on a floor and bonding them to the floor by way of a floor adhesive, and providing for electrical connection between tiles over the entire surface by the step of placing electrical connectors underneath the joints between adjacent tiles in contact with the wire mesh screen of adjacent tiles and providing a grounding connection whereby static charges generated on the floor surface are dissipated at the said decay rate, forming the tiles in a generally rectangular shape, positioning a plurality of similar tiles contiguously adjacent to each other, placing electrically conductive members in the adhesive and beneath joints between adjacent tiles to provide electrical conductivity between electrically conductive laminations of the tiles whereby the entire floor covering has the capability of dissipating static charges before they can build up and extending one of the said electrical conductors beyond the perimeter of the tiles and attaching it to a suitable ground, forming the electrical connectors from aluminum, providing wave formations in the conductors and providing pressure against the tiles whereby to flatten out the wave formations in the connectors during installation to insure electrical connection between electrically conductive laminations of adjacent tiles.

Claim 3

A method of providing an installation of floor covering capable of dissipating static electrical charges at a decay rate of substantially 5000 volts of charge in substantially 0.07-0.08 seconds including the steps of forming individual thin static dissipative tiles by forming a hard plastic surface lamination of melamine, bonding thin electrically conductive wire mesh screen to the hard surface lamination, placing the tiles closely adjacent to each other on a floor and bonding them to the floor by way of a floor adhesive, and providing for electrical connection between tiles over the entire surface by the step of placing electrical connectors underneath the joints between adjacent tiles in contact with the wire mesh screen of adjacent tiles and providing a grounding connection whereby static charges generated on the floor surface are dissipated at the said decay rate, bonding the wire mesh screen to the hard surface lamination by applying a water-based adhesive, including suspending electrolytic copper in powder form in the adhesive, providing continuous agitation of the adhesive whereby to keep the electrolytic material suspended in the adhesive during application, bonding the relatively hard surface lamination and the electrically conductive screen and adhesive together under conditions of pressure and heat, forming the tiles in a generally rectangular shape, positioning a plurality of similar tiles contiguously adjacent to each other, placing electrically conductive members in the adhesive and beneath joints between adjacent tiles to provide electrical conductivity between the electrically conductive laminations of the tiles whereby the floor covering has the capability of dissipating static charges before they can build up and extending one of said electrical conductors beyond the perimeter of the tiles and attaching it to a suitable ground, forming the electrical connectors from aluminum, providing wave formations in the conductors, providing pressure against the tiles, whereby to flatten out the wave formations in the connectors during installation to ensure electrical connection between the electrically conductive laminations of adjacent tiles.

Claim 4

A method of providing an installation of floor covering capable of dissipating static electrical charges at a decay rate of substantially 5000 volts of charge in substantially 0.07-0.08 seconds including the steps of forming individual thin static dissipative tiles by forming a hard plastic surface lamination of melamine, bonding thin electrically conductive wire mesh screen to the hard surface lamination, placing the tiles closely adjacent to each other on a floor and bonding them to the floor by way of a floor adhesive, and providing for electrical connection between tiles over the entire surface by the step of placing electrical connectors underneath the joints between adjacent tiles in contact with the wire mesh screen of adjacent tiles and providing a grounding connection whereby static charges generated on the floor surface are dissipated at the said decay rate, bonding the wire mesh screen to the hard surface lamination by applying a water-based adhesive, including suspending electrolytic copper in powder form in the adhesive, providing continuous agitation of the adhesive whereby to keep the electrolytic material suspended in the adhesive during application, bonding the relatively hard surface lamination and the electrically conductive screen and adhesive together under conditions of pressure and heat, forming the tiles in a generally rectangular shape, positioning a plurality of similar tiles contiguously adjacent to each other, placing electrically conductive members in the adhesive and beneath joints between adjacent tiles to provide electrical conductivity between the electrically conductive laminations of the tiles whereby the floor covering has the capability of dissipating static charges before they can build up and extending one of said electrical conductors beyond the perimeter of the tiles and attaching it to a suitable ground, forming the electrical connectors from aluminum, providing wave formations in the conductors, providing pressure against the tiles, whereby to flatten out the wave formations in the connectors during installation to ensure electrical connection between the electrically conductive laminations of adjacent tiles.