Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
104 words
An image sensor comprising (a) a substrate, (b) a plurality of individual electrodes disposed on one surface of the substrate, each individual electrode comprising a contact portion and a lead portion, (c) an insulating film layer disposed over the individual electrodes, (d) a semiconductor photoelectric conversion layer disposed on the insulating film layer, and (e) a common electrode disposed on the semiconductor photoelectric conversion layer opposite the contact portion of the individual electrodes, wherein windows are formed in the insulating film layer such that contact is made between the contact portions of the individual electrodes and the semiconductor photoelectric conversion layer through the windows.
Claim 2
Dependent Claim
104 words
An image sensor comprising (a) a substrate, (b) a plurality of individual electrodes disposed on one surface of the substrate, each individual electrode comprising a contact portion and a lead portion, (c) an insulating film layer disposed over the individual electrodes, (d) a semiconductor photoelectric conversion layer disposed on the insulating film layer, and (e) a common electrode disposed on the semiconductor photoelectric conversion layer opposite the contact portion of the individual electrodes, wherein windows are formed in the insulating film layer such that contact is made between the contact portions of the individual electrodes and the semiconductor photoelectric conversion layer through the windows.
Claim 3
Dependent Claim
33 words
An image sensor according to claim 1, wherein the insulating film layer is formed from a photosensitive resin and wherein the windows are formed by light exposure and development of the photosensitive resin.
Claim 4
Dependent Claim
18 words
An image sensor according to claim 1, wherein the common electrode is formed from an electrically conductive resin.
Claim 5
Dependent Claim
18 words
An image sensor according to claim 2, wherein the common electrode is formed from an electrically conductive resin.
Claim 6
Dependent Claim
72 words
An image sensor comprising (a) a substrate, (b) a plurality of individual electrodes arranged on one surface of the substrate, each comprising a contact portion and a lead portion, (c) a semiconductor photoelectric conversion layer disposed over the individual electrodes, and (d) a common electrode disposed over the semiconductor photoelectric conversion layer and opposite the contact portions of the individual electrodes wherein the common electrode is formed from an electrically conductive resin
Claim 7
Dependent Claim
72 words
An image sensor comprising (a) a substrate, (b) a plurality of individual electrodes arranged on one surface of the substrate, each comprising a contact portion and a lead portion, (c) a semiconductor photoelectric conversion layer disposed over the individual electrodes, and (d) a common electrode disposed over the semiconductor photoelectric conversion layer and opposite the contact portions of the individual electrodes wherein the common electrode is formed from an electrically conductive resin
Claim 8
Independent Claim
120 words
A method for making an image sensor comprising the steps of (a) forming a plurality of individual electrodes on a substrate, each individual electrode comprising a contact portion and a lead portion, (b) depositing an insulating film layer over the individual electrodes, (c) forming windows in the insulating film layers such that at least a portion of the contact portion of the individual electrodes are exposed, (d) depositing a semiconductor photoelectric conversion layer over the insulating film such that the semiconductor layer makes contact with the contact portions of the individual electrodes through the windows, and (e) forming a common electrode on the semiconductor photoelectric conversion film, said common electrode being disposed opposite the contact portions of the individual electrodes.
Claim 9
Independent Claim
120 words
A method for making an image sensor comprising the steps of (a) forming a plurality of individual electrodes on a substrate, each individual electrode comprising a contact portion and a lead portion, (b) depositing an insulating film layer over the individual electrodes, (c) forming windows in the insulating film layers such that at least a portion of the contact portion of the individual electrodes are exposed, (d) depositing a semiconductor photoelectric conversion layer over the insulating film such that the semiconductor layer makes contact with the contact portions of the individual electrodes through the windows, and (e) forming a common electrode on the semiconductor photoelectric conversion film, said common electrode being disposed opposite the contact portions of the individual electrodes.
Claim 10
Dependent Claim
32 words
A method according to claim 6, wherein the insulating film layer is a photosensitive resin and wherein the windows are formed by exposing the insulating film layer to light and developing it.
Claim 11
Dependent Claim
28 words
A method according to claim 6, further comprising the step of baking prior to depositing the semiconductor photoelectric conversion layer to remove impurities from the insulating film layer.
Claim 12
Dependent Claim
19 words
A method according to claim 8, wherein the baking is done at a temperature of 300° C. or higher.
Claim 13
Dependent Claim
63 words
A method according to claim 6, further comprising the steps of depositing a protective coating on the individual electrodes prior to forming the insulating film; baking prior to depositing the semiconductor photoelectric conversion layer to remove impurities from the insulating film layer; and removing the protective coating from the contact portions of the individual electrodes to expose the contact portions through the windows.
Claim 14
Dependent Claim
19 words
A method according to claim 10, wherein the baking is done at a temperature of 300° C. or higher.