US4697205A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat pipe
Assignee: Aavid Thermacore Inc
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Filing: 1986-03-13
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Granted: 1987-09-29
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Expires: 2006-03-13
Abstract
Abstract A semiconductor circuit construction in which the semiconductor junction is constructed as an integral part of a heat pipe to eliminate the casing which interferes with heat flow. The semiconductor chip material directly forms one wall of the casing of a heat pipe which is constructed as a hollow wafer-like configuration. A special material formed from a mixture of glass and the semiconductor material and which is directly adjacent to the backside of the semiconductor chip is used as the heat pipe wick.
Inventors
- 👤 George Y. Eastman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 00:04
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
112 words
A combined semiconductor electronic circuit device and heat pipe comprising: a semiconductor circuit element constructed upon an outside surface of semiconductors material, the semiconductor material also forming a wall which is part of a heat pipe casing enclosed and sealed by additional walls; a sintered semiconductor wick structure within heat pipe casing and adjacent to the inside of the wall of semiconductor material wherein the wick structure is comprised of a sintered mixture of the same semiconductor material as the wall to which it is adjacent and up to twenty percent by weight of glass frit; and a vaporizable liquid within the sealed heat pipe to act as the heat conducting medium.
Claim 2
Dependent Claim
112 words
A combined semiconductor electronic circuit device and heat pipe comprising: a semiconductor circuit element constructed upon an outside surface of semiconductors material, the semiconductor material also forming a wall which is part of a heat pipe casing enclosed and sealed by additional walls; a sintered semiconductor wick structure within heat pipe casing and adjacent to the inside of the wall of semiconductor material wherein the wick structure is comprised of a sintered mixture of the same semiconductor material as the wall to which it is adjacent and up to twenty percent by weight of glass frit; and a vaporizable liquid within the sealed heat pipe to act as the heat conducting medium.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-09-28 | 1991-03-30 | 1991-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-09-28 | 1995-03-30 | 1995-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-09-28 | 1999-03-30 | 1999-09-29 | $7700.00 | Window Closed / Lapsed |