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US4696536A Expired / Lapsed US ⏱️ 0.0 years remaining

Integrated optical wavelength demultiplexer

Assignee: United States Department of the Navy
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Filing: 1985-07-01
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Granted: 1987-09-29
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Expires: 2005-07-01
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Abstract

Abstract An optical wavelength demultiplexer is fabricated as an integral part of an integrated circuit chip. A waveguide in a common substrate having a chirped diffraction grating receives a number of wavelengths of optically modulated data from a single mode fiber. The wavelengths are diffracted from the plane of the lines of the grating into discrete beams angles through the substrate and impinge on appropriately located photodetectors. Signals provided by the detectors are fed to and processed by other integrated circuitry also contained on the chip. The common transparent substrate such as fused silica, glass, sapphire, lithium niobate or lithium tantalate mount semiconductor films of Si, Ge, GaAs or quanternary alloys that have the detectors and other integrated circuitry that are created by conventional CVD techniques. The waveguide and appropriate chirp grating are formed by established deposition and photolithographic procedures ot assure the separation of as many as fifty discrete beams of as many different wavelengths and their projection onto a like number of photodetectors to provide for a heretofore unattainable degree of optical wavelength demultiplexing.

Inventors

  • 👤 Donald J. Albares
  • 👤 Ronald E. Reedy

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 18:17
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/10; G02B6/12; G02B6/12007; G02B6/12004; G02B6/24; G02B6/26; G02B6/28; G02B6/293; G02B6/29379; G02B6/2938; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4215; G02B6/4256; G02B6/4257; G02B6/4259; G02B6/4274; G02B6/29304; G02B6/29305; G02B6/2931

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 237 words
An apparatus for wavelength demultiplexing single mode optical data transmitted in a plurality of discrete optical wavelengths on an integrated chip substrate comprising: an optical waveguide disposed on and integrated with the integrated chip substrate for guiding the plurality of optical wavelengths therethrough: means provided to coextend in the integrated optical waveguide for diffracting the plurality of optical wavelengths therefrom, the diffracting means being configured in a chirped grating to diffract each of the plurality of optical wavelengths into focussed discrete beams at discrete diffraction angles out of the plane of the chirped grating that are different one from the other; a semiconductor film integrated with and disposed on the integrated chip substrate having its lattice matched to that of the substrate; a plurality of photodetectors integrated in the semiconductor film on the integrated circuit chip substrate in a juxtaposed relationship each at a location corresponding to where the discrete beams are diffracted and focussed for intercepting the beams and optically detecting the information content thereof to generate representative electrical signs, the seminconductor film and the plurality of photodetectors are located in a substantially coplanar relationship with respect to the optical waveguide and chirped grating; and means disposed on a parallel side of the substrate spaced from the optical waveguide and the chirped grating for reflecting the diffracted discrete beams onto the photodetectors, the apparatus combining the optical demultiplexing and electronic functions on the integrated chip substrate.
Claim 2
Independent Claim 237 words
An apparatus for wavelength demultiplexing single mode optical data transmitted in a plurality of discrete optical wavelengths on an integrated chip substrate comprising: an optical waveguide disposed on and integrated with the integrated chip substrate for guiding the plurality of optical wavelengths therethrough: means provided to coextend in the integrated optical waveguide for diffracting the plurality of optical wavelengths therefrom, the diffracting means being configured in a chirped grating to diffract each of the plurality of optical wavelengths into focussed discrete beams at discrete diffraction angles out of the plane of the chirped grating that are different one from the other; a semiconductor film integrated with and disposed on the integrated chip substrate having its lattice matched to that of the substrate; a plurality of photodetectors integrated in the semiconductor film on the integrated circuit chip substrate in a juxtaposed relationship each at a location corresponding to where the discrete beams are diffracted and focussed for intercepting the beams and optically detecting the information content thereof to generate representative electrical signs, the seminconductor film and the plurality of photodetectors are located in a substantially coplanar relationship with respect to the optical waveguide and chirped grating; and means disposed on a parallel side of the substrate spaced from the optical waveguide and the chirped grating for reflecting the diffracted discrete beams onto the photodetectors, the apparatus combining the optical demultiplexing and electronic functions on the integrated chip substrate.
Claim 3
Dependent Claim 38 words
An apparatus according to claim 1 in which the optical waveguide and the chirped grating are disposed in the substrate and the semiconductor film is disposed in an overlying relationship on the substrate with the photodetectors disposed therein.
Claim 4
Dependent Claim 35 words
An apparatus according to claim 2 further including: means forming a thermal buffer layer between the semiconductor film and the substrate for isolating the film from optical energy propagating along a surface of the substrate.
Claim 5
Dependent Claim 18 words
An apparatus according to claim 2 in which the substrate is sapphire and the semiconductor film is silicon.
Claim 6
Dependent Claim 18 words
An apparatus according to claim 2 in which the substrate is sapphire and the semiconductor film is germanium.
Claim 7
Dependent Claim 19 words
An apparatus according to claim 2 in which the substrate is sapphire and the semiconductor film is gallium arsenide.
Claim 8
Dependent Claim 20 words
An apparatus according to claim 2 in which the substrate is sapphire and the semiconductor film is a quaternary alloy.
Claim 9
Dependent Claim 19 words
An apparatus according to claim 2 in which the substrate is LiNO 3 and the semiconductor film is silicon.
Claim 10
Dependent Claim 19 words
An apparatus according to claim 2 in which the substrate is LiNO 3 and the semiconductor film is germanium.
Claim 11
Dependent Claim 20 words
An apparatus according to claim 2 in which the substrate is LiNO 3 and the semiconductor film is gallium arsenide.
Claim 12
Dependent Claim 21 words
An apparatus according to claim 2 in which the substrate is LiNO 3 and the semiconductor film is a quaternary alloy.
Claim 13
Dependent Claim 19 words
An apparatus according to claim 2 in which the substrate is LiTaO 3 and the semiconductor film is silicon.
Claim 14
Dependent Claim 19 words
An apparatus according to claim 2 in which the substrate is LiTaO 3 and the semiconductor film is germanium.
Claim 15
Dependent Claim 20 words
An apparatus according to claim 2 in which the substrate is LiTaO 3 and the semiconductor film is gallium arsenide.
Claim 16
Dependent Claim 21 words
An apparatus according to claim 2 in which the substrate is LiTaO 3 and the semiconductor film is a quarternary alloy.

References Cited (Backward Citations)

US4372642A Cited
WO1983003506A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-09-28 1991-03-30 1991-09-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-09-28 1995-03-30 1995-09-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-09-28 1999-03-30 1999-09-29 $7700.00 Window Closed / Lapsed

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