US4695481A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of performing plating of an item having fine parts and a support device therefor
Assignee: Senju Metal Industry Co Ltd
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Filing: 1986-03-27
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Granted: 1987-09-22
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Expires: 2006-03-27
Abstract
Abstract A method and device of performing plating of an item having a row of fine parts, e.g. a flatpack IC are disclosed. The method comprises immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.
Inventors
- 👤 Yuuji Kawamata
- 👤 Tomohiko Iino
- 👤 Ryoichi Suzuki
- 👤 Noriyuki Haga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 01:15
CPC Classifications
C; C23; C23C; C23C2/00; C23C2/30; C23C2/26; C23C2/265
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
100 words
A method of performing plating of an item having a row of fine parts to be plated comprising immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.
Claim 2
Independent Claim
100 words
A method of performing plating of an item having a row of fine parts to be plated comprising immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.
Claim 3
Dependent Claim
58 words
A method as claimed in claim 1, wherein: said item is a flatpack IC; said fine parts to be plated are the leads of said flatpack IC; and said step of causing flux to exert a fluxing action comprises applying flux to said leads from above and allowing said flux to flow downwards over all of said leads.
Claim 4
Dependent Claim
100 words
A method as claimed in claim 2, wherein applying flux to said leads comprises: immersing said flatpack IC in a bath of flux prior to immersing said flatpack IC in said bath of molten solder so that when said flatpack IC is immersed in said bath of molten solder, flux which is removed from said bath of flux together with said flatpack IC will float on the surface of said bath of molten solder; and passing said flatpack IC through said flux floating on said bath of molten solder while removing said flatpack IC from said bath of molten solder.
Claim 5
Independent Claim
134 words
A method of performing preliminary plating of a row of leads of a flatpack IC comprising supporting said flatpack IC with a clip which is secured to a conveying and supporting member having a flux-retaining member, immersing said flatpack IC in a bath of flux, after removing the flatpack IC from the bath, immersing said flatpack IC in a bath of molten solder, removing said flatpack IC from said bath while maintaining said flatpack IC in an attitude such that said row of leads is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said leads, thereby decreasing the surface tension of the solder adhering to said leads and preventing bridges of solder from forming between said leads.
Claim 6
Independent Claim
134 words
A method of performing preliminary plating of a row of leads of a flatpack IC comprising supporting said flatpack IC with a clip which is secured to a conveying and supporting member having a flux-retaining member, immersing said flatpack IC in a bath of flux, after removing the flatpack IC from the bath, immersing said flatpack IC in a bath of molten solder, removing said flatpack IC from said bath while maintaining said flatpack IC in an attitude such that said row of leads is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said leads, thereby decreasing the surface tension of the solder adhering to said leads and preventing bridges of solder from forming between said leads.
Claim 7
Dependent Claim
23 words
A method as claimed in claim 4, wherein said flux-retaining member comprises a plate formed into a V-shaped roof covering the flatpack IC.
References Cited (Backward Citations)
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US3359132A
Cited
JPS5473559A
Cited
US4469716A
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US4506238A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-09-21 | 1991-03-23 | 1991-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-09-21 | 1995-03-23 | 1995-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-09-21 | 1999-03-23 | 1999-09-22 | $7700.00 | Window Closed / Lapsed |