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US4686761A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of fabrication of low crosstalk photodiode array

Assignee: United States Department of the Army
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Filing: 1986-10-31
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Granted: 1987-08-18
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Expires: 2006-10-31
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Abstract

Abstract A photodiode array structure and method of fabrication is provided. The ay is fabricated on a substrate as a multilayer structure with a novel combination of different type layers and then separated into optically independent diodes by delineation of the diodes. A novel array with heterojunction diodes for far-infrared is specifically disclosed.

Inventors

  • 👤 Michael Hacskaylo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 00:37
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/80; H10F39/802; H10F39/011; H10F39/028; H10F39/10; H10F39/12; H10F39/18; H10F39/184

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 182 words
The method of forming an array of pixel photodiodes for a selected band of radiation comprising the steps of: forming a crystalline substrate with a lattice structure compatible with the semiconductor materials used in said photodiodes; epitaxially depositing on a substrate a base contact layer of semiconducting material transparent to said of radiation and doped to provide high conductivity through majority carriers of a first polarity; epitaxially depositing on all but a small surface portion of said base contact layer a photo-current-generating layer of semiconducting material highly absorptive to said band of radiation and doped to provide medium conductivity through majority carriers of said first polarity; epitaxially depositing on said photo-current-generating layer a contact cap layer transparent to said band of radiation doped to provide medium conductivity through majority carriers opposite in polarity to said first polarity; removing small groove portions of said cap layer and all underlying portions of said photo-current-generating layer whereby these layers are divided into electro-optically isolated islands electrically interconnected through said base contact layer; and forming a passivation coating over all the exposed surfaces of said layers.
Claim 2
Independent Claim 182 words
The method of forming an array of pixel photodiodes for a selected band of radiation comprising the steps of: forming a crystalline substrate with a lattice structure compatible with the semiconductor materials used in said photodiodes; epitaxially depositing on a substrate a base contact layer of semiconducting material transparent to said of radiation and doped to provide high conductivity through majority carriers of a first polarity; epitaxially depositing on all but a small surface portion of said base contact layer a photo-current-generating layer of semiconducting material highly absorptive to said band of radiation and doped to provide medium conductivity through majority carriers of said first polarity; epitaxially depositing on said photo-current-generating layer a contact cap layer transparent to said band of radiation doped to provide medium conductivity through majority carriers opposite in polarity to said first polarity; removing small groove portions of said cap layer and all underlying portions of said photo-current-generating layer whereby these layers are divided into electro-optically isolated islands electrically interconnected through said base contact layer; and forming a passivation coating over all the exposed surfaces of said layers.
Claim 3
Dependent Claim 25 words
The method according to claim 1 wherein said step of removing includes: milling a series of narrow straight line grooves extending entirely across said layers.
Claim 4
Dependent Claim 30 words
The method according to claim 1 wherein said step of removing further includes the step of: removing only a small amount of the underlying portions of said base contact layer.
Claim 5
Dependent Claim 36 words
The method according to claim 1 further comprising the step of: depositing a metal contact on said small surface portion and on the cap layer of each of said islands, said contacts extending through said coating.
Claim 6
Dependent Claim 67 words
The method according to claim 1 further including the steps of: forming said crystalline substrate from a material transparent to radiation in said selected band; depositing a continuous layer of highly conductive metal over the exposed broad surface of said cap layer prior to removing said small portions; and removing the portions of said metal layer which overlay said small portions when said small portions are removed.
Claim 7
Dependent Claim 32 words
The method according to claim 5 wherein the step of forming a crystalline substrate includes the step of: forming said crystalline substrate from a material transparent to radiation in said selected band.

References Cited (Backward Citations)

US3880633A Cited
US4197141A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-08-17 1991-02-16 1991-08-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-08-17 1995-02-16 1995-08-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-08-17 1999-02-16 1999-08-18 $7700.00 Window Closed / Lapsed

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