← Back to Patent Explorer
US4684841A Expired / Lapsed US ⏱️ 0.0 years remaining

Saw devices including resistive films

Assignee: Nortel Networks Ltd
•
Filing: 1985-04-01
•
Granted: 1987-08-04
•
Expires: 2005-04-01
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Each IDT (inter-digital transducer) of a SAW (surface acoustic wave) device is formed on a thin resistive doped silicon film having the same pattern as the IDT, which improves adhesion of the IDT to the substrate. The silicon film also constitutes electroacoustic absorbers between the IDTs and edges of the substrate, and can have a linearly tapered edge adjacent to each IDT to suppress reflections at the absorber boundary. The SAW device is formed by sputtering silicon onto the substrate, subsequently forming the IDTs, and then etching the silicon from areas where it is not wanted.

Inventors

  • 👤 Grantley O. Este
  • 👤 Mark S. Suthers
  • 👤 Richard W. Streater
  • 👤 Blair K. MacLaurin

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 17:53
CPC Classifications
H; H03; H03H; H03H3/00; H03H3/007; H03H3/08; H03H9/00; H03H9/02; H03H9/02535; H03H9/02818; H03H9/02842; H03H9/125; H03H9/145; H03H9/14538; H10; H10N; H10N30/00; H10N30/01; H10N30/06

Claims Analysis

Total Claims: 31
Claim 1
Independent Claim 45 words
A method of producing a SAW (surface acoustic wave) device comprising the steps of: forming a resistively conductive film on a surface of a substrate of piezo-electric material; and forming at least one IDT (inter-digital transducer) for the SAW device on the resistively conductive film.
Claim 2
Independent Claim 45 words
A method of producing a SAW (surface acoustic wave) device comprising the steps of: forming a resistively conductive film on a surface of a substrate of piezo-electric material; and forming at least one IDT (inter-digital transducer) for the SAW device on the resistively conductive film.
Claim 3
Dependent Claim 36 words
A method as claimed in claim 1 wherein the resistively conductive film is formed on substantially all of said surface, the method further including the step of removing part of the film after forming the IDT.
Claim 4
Dependent Claim 43 words
A method as claimed in claim 2 wherein the step of removing part of the film comprises the step of leaving the film in at least one area on the substrate surface to define a surface acoustic wave absorber region in this area.
Claim 5
Dependent Claim 32 words
A method as claimed in claim 3 wherein the film is left in at least one area defining a surface acoustic wave absorber region adjacent to an IDT formed on the film.
Claim 6
Dependent Claim 37 words
A method as claimed in claim 4 wherein the film is left, in each area defining a surface acoustic wave absorber region region adjacent to an IDT, with a substantially linear tapered edge adjacent to the IDT.
Claim 7
Dependent Claim 26 words
A method as claimed in claim 2 wherein the resistively conductive film comprises a silicon film having a sheet resistivity of at least about 0.5 Mohm/sq.
Claim 8
Dependent Claim 19 words
A method as claimed in claim 6 wherein the silicon film is formed on the substrate surface by sputtering.
Claim 9
Dependent Claim 26 words
A method as claimed in claim 6 wherein the step of removing part of the silicon film after forming the IDT comprises etching the silicon film.
Claim 10
Dependent Claim 27 words
A method as claimed in claim 8 wherein the step of forming the IDT comprises evaporating aluminum onto the silicon film in the pattern of the IDT.
Claim 11
Dependent Claim 16 words
A method as claimed in claim 1 wherein the resistively conductive film comprises a silicon film.
Claim 12
Dependent Claim 27 words
A method as claimed in claim 10 wherein the silicon film is formed with a thickness to provide a sheet resistivity of at least about 0.5 Mohm/sq.
Claim 13
Dependent Claim 14 words
A method as claimed in claim 11 wherein the substrate material is lithium niobate.
Claim 14
Dependent Claim 28 words
A method as claimed in claim 1 wherein the resistively conductive film is formed on the substrate surface in the pattern of each IDT to be formed thereon.
Claim 15
Dependent Claim 58 words
A method as claimed in claim 1 wherein the resistively conductive film is formed on the substrate surface in the pattern of each IDT to be formed thereon and with at least one area defining a surface acoustic wave absorber region adjacent to this pattern, the resistively conductive film constituting a surface acoustic wave absorber in this region.
Claim 16
Dependent Claim 33 words
A method as claimed in claim 14 wherein the film is formed with a substantially linear tapered edge of each area defining a surface acoustic wave absorber region adjacent to an IDT pattern.
Claim 17
Dependent Claim 24 words
A method as claimed in claim 14 wherein the film comprises a silicon film having a sheet resistivity of at least about 0.5 Mohm/sq.
Claim 18
Dependent Claim 35 words
A SAW (surface acoustic wave) device comprising at least one IDT (inter-digital transducer) on a resistively conductive film, having substantially the same pattern as the IDT, on a surface of a substrate of piezo-electric material.
Claim 19
Dependent Claim 35 words
A SAW (surface acoustic wave) device comprising at least one IDT (inter-digital transducer) on a resistively conductive film, having substantially the same pattern as the IDT, on a surface of a substrate of piezo-electric material.
Claim 20
Dependent Claim 31 words
A SAW device as claimed in claim 17 and including on the substrate surface a resistively conductive film constituting a surface acoustic wave absorber in a region adjacent to the IDT.
Claim 21
Dependent Claim 37 words
A SAW device as claimed in claim 18 wherein the resistively conductive film constituting the surface acoustic wave absorber and the resistively conductive film having the IDT thereon are films of substantially the same material and thickness.
Claim 22
Dependent Claim 18 words
A SAW device as claimed in claim 19 wherein each of said films comprises an amorphous silicon film.
Claim 23
Dependent Claim 23 words
A SAW device as claimed in claim 20 wherein each of said films has a sheet resistivity of at least about 0.5 Mohm/sq.
Claim 24
Dependent Claim 15 words
A SAW device as claimed in claim 21 wherein the substrate material is lithium niobate.
Claim 25
Dependent Claim 30 words
A SAW device as claimed in claim 18 wherein the resistively conductive film constituting the surface acoustic wave absorber has a substantially linear tapered edge adjacent to the IDT pattern.
Claim 26
Dependent Claim 32 words
A SAW device as claimed in claim 23 wherein the resistively conductive film constituting the surface acoustic wave absorber extends from adjacent to the IDT pattern to an edge of the substrate.
Claim 27
Dependent Claim 32 words
A SAW device as claimed in claim 18 wherein the resistively conductive film constituting the surface acoustic wave absorber extends from adjacent to the IDT pattern to an edge of the substrate.
Claim 28
Dependent Claim 53 words
A SAW device comprising a substrate; two IDTs spaced apart for propagation of a surface acoustic wave therebetween on a surface of the substrate; and a resistively conductive film constituting a surface acoustic wave absorber between each IDT and a respective edge of the substrate, the resistively conductive film also underlying the IDTs.
Claim 29
Dependent Claim 53 words
A SAW device comprising a substrate; two IDTs spaced apart for propagation of a surface acoustic wave therebetween on a surface of the substrate; and a resistively conductive film constituting a surface acoustic wave absorber between each IDT and a respective edge of the substrate, the resistively conductive film also underlying the IDTs.
Claim 30
Dependent Claim 28 words
A SAW device as claimed in claim 26 wherein the resistively conductive film comprises an amorphous silicon film having a sheet resistivity of at least about 0.5 Mohm/sq.
Claim 31
Dependent Claim 40 words
A SAW device as claimed in claim 26 wherein each surface acoustic wave absorber extends between the respective IDT and substrate edge through a distance of about 80 wavelengths of the surface acoustic wave to be propagated between the IDTs.

References Cited (Backward Citations)

US3760299A Cited
JPS5412661A Cited
US4223286A Cited
US4463327A Cited
US4450374A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-08-03 1991-02-02 1991-08-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-08-03 1995-02-02 1995-08-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-08-03 1999-02-02 1999-08-04 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag