US4683378A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for ion beam work
Assignee: Hitachi Ltd
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Filing: 1985-07-15
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Granted: 1987-07-28
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Expires: 2005-07-15
Abstract
Abstract This invention discloses an ion beam work apparatus which comprises ion mean radiation means for focusing and radiating an ion beam extracted from an ion source to a target put on a moving mechanism, and scanning two-dimensionally the radiation position; secondary particle detection means for detecting the secondary particles generated from the target upon radiation of the ion beam; and superposition-display means for superposing the secondary particle image with a different kind of image containing such information that is not contained in the secondary particle image, and displaying the resulting image; and which can accurately position the beam radiation position to lower wiring layers of the target such as a semiconductor device that can not be observed by the secondary particle image obtained by scanning the focused ion beam.
Inventors
- 👤 Akira Shimase
- 👤 Hiroshi Yamaguchi
- 👤 Satoshi Haraichi
- 👤 Tateoki Miyauchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:03
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/30; H01J37/305; H01J37/3053; H01J37/3056; H01J37/3002; H01J37/3005; H01J37/304
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
241 words
An ion beam work apparatus comprising: ion beam radiation means for focusing and radiating an ion beam extracted from an ion beam source on a target placed on a moving mechanism, and scanning two-dimensionally the ion beam radiation position; secondary particle detection means for detecting secondary particles generated from a surface of said target by radiation of said ion beam, and forming a secondary particle image from the detection signals; display means fopr superposing a display of said secondary particle image near a processing area formed by said secondary particles with a different image having position information not obtained from said secondary particle image and indicating a wiring layer of said target near the processing area, said different image including at least one of an optical microscope image and an image derived from an optical microscope image; first means for detecting a relative deviation of reference points for each of said secondary particle image and said different image, and for moving at least one of said images with respect to the other of said images so that the relative deviation is minimized; second means for setting the processing area of said target based on the position information of said different image as adjusted by said first means; and third means for processing a portion of the wiring layer of said target by radiating the ion beam from said ion beam radiation means on the processing area set by the second means;
Claim 2
Dependent Claim
241 words
An ion beam work apparatus comprising: ion beam radiation means for focusing and radiating an ion beam extracted from an ion beam source on a target placed on a moving mechanism, and scanning two-dimensionally the ion beam radiation position; secondary particle detection means for detecting secondary particles generated from a surface of said target by radiation of said ion beam, and forming a secondary particle image from the detection signals; display means fopr superposing a display of said secondary particle image near a processing area formed by said secondary particles with a different image having position information not obtained from said secondary particle image and indicating a wiring layer of said target near the processing area, said different image including at least one of an optical microscope image and an image derived from an optical microscope image; first means for detecting a relative deviation of reference points for each of said secondary particle image and said different image, and for moving at least one of said images with respect to the other of said images so that the relative deviation is minimized; second means for setting the processing area of said target based on the position information of said different image as adjusted by said first means; and third means for processing a portion of the wiring layer of said target by radiating the ion beam from said ion beam radiation means on the processing area set by the second means;
Claim 3
Dependent Claim
26 words
The ion beam work apparatus as defined in claim 10, wherein said different image include one that is constituted from the design data of said target.
Claim 4
Dependent Claim
41 words
The ion beam work apparatus as defined in claim 1, wherein said secondary particle image is taken from said target, and said optical microscopic image is taken from a reference target which is the same kind as that of said target.
Claim 5
Dependent Claim
43 words
The ion beam work apparatus as defined in claim 3, wherein the XYθ stage for bringing the position of said reference target into agreement with the position of said target is placed on an XY stage for placing thereon both of said targets.
Claim 6
Dependent Claim
38 words
The ion beam work apparatus as defined in claim 4, wherein the relative position of both of said targets is mechanically adjusted by said XYθ stage, and then fine adjustment of said optical microscopic image is made electrically.
Claim 7
Dependent Claim
50 words
The ion beam work apparatus as defined in claim 1, wherein said is an optical microscope image obtained from said target and said target is moved to the position of the optical axis of said ion beam radiation means so as to obtain said secondary particle image from said target.
Claim 8
Dependent Claim
39 words
The ion beam work apparatus as defined in claim 6, wherein fine adjustment of the position of said optical microscopic image is effected electrically when said optical microscopic image is to be superposed after the movement of said target.
Claim 9
Dependent Claim
39 words
The ion beam work apparatus as defined in claim 1 wherein said different image comprises a combination of at least two images constituted by optical microscopic image, a scanning electron microscopic image and an image constituted by design data.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-07-27 | 1991-01-26 | 1991-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-07-27 | 1995-01-26 | 1995-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-07-27 | 1999-01-26 | 1999-07-28 | $7700.00 | Window Closed / Lapsed |