Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
166 words
A housing for electromagnetically shielding electronic circuits, said housing comprising in combination: a conductive frame having a multiplicity of sides surrounding a central opening; a first circuit substrate having front and rear surfaces, said first substrate being positioned in said opening of said frame; a first electromagnetic shield positioned over said rear surface of said first substrate, said first shield having front and rear surfaces and a plurality of sides substantially perpendicular to said surfaces, certain of said sides of said first shield having spring fingers contacting said frame, said first shield having an opening; a second circuit substrate having front and rear surfaces positioned over said rear surface of said first shield; an electrical interconnection between said first and second circuit substrates, said interconnection including first and second mating connectors respectively electrically connected to said first and second substrates, said electrical interconnection passing through said opening in said first shield; and a second electromagnetic shield positioned over said rear surface of said second circuit substrate.
Claim 2
Dependent Claim
166 words
A housing for electromagnetically shielding electronic circuits, said housing comprising in combination: a conductive frame having a multiplicity of sides surrounding a central opening; a first circuit substrate having front and rear surfaces, said first substrate being positioned in said opening of said frame; a first electromagnetic shield positioned over said rear surface of said first substrate, said first shield having front and rear surfaces and a plurality of sides substantially perpendicular to said surfaces, certain of said sides of said first shield having spring fingers contacting said frame, said first shield having an opening; a second circuit substrate having front and rear surfaces positioned over said rear surface of said first shield; an electrical interconnection between said first and second circuit substrates, said interconnection including first and second mating connectors respectively electrically connected to said first and second substrates, said electrical interconnection passing through said opening in said first shield; and a second electromagnetic shield positioned over said rear surface of said second circuit substrate.
Claim 3
Dependent Claim
36 words
The housing of claim 1, wherein: said frame has a plurality of slots; and said first circuit substrate has a plurality of protuberances engaging certain of said slots to retain said first substrate in said frame.
Claim 4
Dependent Claim
35 words
The housing of claim 1, wherein: said frame has a plurality of slots; and said first shield has a plurality of protuberances engaging certain of said slots to retain said first shield on said frame.
Claim 5
Dependent Claim
67 words
The housing of claim 1, wherein: said frame has a plurality of tabs, each of said tabs having a hole; and said first and second shields and said first and second circuit substrates each having a plurality of holes in alignment with said holes of said tabs, wherein fasteners are inserted to attach said first and second shields and said first and second substrates to said frame.
Claim 6
Dependent Claim
53 words
The housing of claim 1, further comprising a third electromagnetic shield, positioned over said front surface or said first circuit substrate, said third shield having front and rear surfaces and a plurality of sides substantially perpendicular to said surfaces, certain of said sides of said third shield having spring fingers contacting said frame.
Claim 7
Dependent Claim
40 words
The housing of claim 5, wherein: said frame has a plurality of slots; and certain of said sides of said third shield have a plurality of protuberances engaging certain of said slots to attach said third shield to said frame.
Claim 8
Dependent Claim
30 words
The housing of claim 5, further comprising a speaker, mounted to one of said surfaces of said third shield, whereby said shield functions as an acoustic baffle for said speaker.
Claim 9
Dependent Claim
51 words
The housing of claim 1, further comprising an outer housing enclosing said frame, said outer housing having a plurality of attachment points to said frame, said attachment points being positioned on two sides of said frame, whereby said outer housing and said attachment points provide mechanical shock isolation for said frame.
Claim 10
Dependent Claim
70 words
The housing of claim 8, wherein said outer housing includes a grounding strap and electrical components, said electrical components having exposed metal parts, said strap being electrically connected to said frame through one of said attachment points and in electrical contact with said exposed metal parts, whereby any external electrostatic charge that comes into contact with said exposed metal parts is grounded to said frame, thereby protecting said electronic circuits.
Claim 11
Dependent Claim
35 words
The housing of claim 9, wherein: said outer housing includes a third connector, electrically connected to said components; and said first circuit substrate includes a fourth connector, whereby said fourth connector engages said third connector.
Claim 12
Dependent Claim
34 words
The housing of claim 8, further comprising: a third connector attached to said third shield; and an electronic module attached to said outer housing, said module having a fourth connector engaging said third connector.
Claim 13
Dependent Claim
37 words
The housing of claim 11, wherein: said third connector includes a circuit substrate having a plurality of contacts printed thereon; and said third shield includes a plurality of tabs attaching said third connector to said third shield.
Claim 14
Dependent Claim
29 words
The housing of claim 1, wherein said second circuit substrate includes an electrical connector, said electrical connector including electrical contacts on one of said surfaces of said second substrate.
Claim 15
Dependent Claim
44 words
The housing of claim 1, wherein: said first circuit substrate includes at least one power module; and said frame includes a means for attaching said power module to said frame, whereby heat generated in said power module is conducted into said frame and dissipated.