Multiphase epoxy thermosets having rubber within disperse phase

Claim 2

A thermoset comprising a crosslinked epoxy resin matrix with a fracture toughness, K IC , of at least 1.2 MPa√m, at least one Tg of at least about 150° C. and comprising a glassy discontinuous phase which contains a rubber phase and is dispersed in a glassy continuous phase that continues throughout said resin matrix, said discontinuous phase constituting at least about 25 volume % of the total volume of said phases.

Claim 3

A thermoset in accordance with claim 1, wherein said matrix contains high strength filaments.

Claim 4

A thermoset in accordance with claim 1, wherein said matrix contains carbon (graphite) fiber as at least a portion of said filaments.

Claim 5

A thermoset in accordance with claim 1, wherein said discontinuous phase constitutes between about 45% and about 55% of the total volume of the discontinuous and continuous phases and said rubber phase comprises about 10-90% of said discontinuous phase.

Claim 6

A thermoset in accordance with claim 1, wherein said discontinuous phase comprises domains having a largest dimension of between about 0.1 and 50 microns.

Claim 7

A thermosetting epoxy resin composition comprising: (a) about 20-70% by weight of a polyepoxy component having on average of at least about 1.5 epoxy groups per molecule (b) an amount of an amine hardener having molecular weight below 1000 sufficient to provide from 0.8 to 1.5 equivalents of active hydrogen atoms per one equivalent of epoxy groups in the composition, (c) from 10 to 60% by weight of the composition of an aromatic oligomer having a number average molecular weight between about 2,000 and about 10,000, a glass transition temperature between about 125° C. and 250° C. and at least 1.4 functional groups per molecule which are reactive with (a) or (b), or (a) and (b) under curing conditions for the composition and (d) a liquid rubber that is reactive with epoxy.

Claim 8

A thermosetting epoxy resin composition comprising: (a) about 20-70% by weight of a polyepoxy component having on average of at least about 1.5 epoxy groups per molecule (b) an amount of an amine hardener having molecular weight below 1000 sufficient to provide from 0.8 to 1.5 equivalents of active hydrogen atoms per one equivalent of epoxy groups in the composition, (c) from 10 to 60% by weight of the composition of an aromatic oligomer having a number average molecular weight between about 2,000 and about 10,000, a glass transition temperature between about 125° C. and 250° C. and at least 1.4 functional groups per molecule which are reactive with (a) or (b), or (a) and (b) under curing conditions for the composition and (d) a liquid rubber that is reactive with epoxy.

Claim 9

The composition of claim 6, wherein the amine hardener comprises an aromatic amine.

Claim 10

The composition of claim 7, wherein the oligomer contains sulfone bridged diphenylene units.

Claim 11

The composition of claim 8, wherein said liquid rubber is amine functional.

Claim 12

The composition of claim 9, wherein said liquid rubber has a molecular weight between about 1000 and 3000.

Claim 13

The composition of claim 10, wherein said rubber is a nitrile rubber.

Claim 14

The composition of claim 6, which contains high strength filaments.

Claim 15

The composition of claim 12, wherein said high strength filaments are carbon fiber.

Claim 16

A method of adhesively bonding first and second bodies which comprises applying an amount of the composition of claim 6 between said first and second bodies and curing said composition.

Claim 17

The method of claim 14, wherein said epoxy resin composition is applied as a partially cured film between said bodies.