US4675960A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing an electrically variable piezoelectric hybrid capacitor
Assignee: Motorola Solutions Inc
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Filing: 1985-12-30
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Granted: 1987-06-30
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Expires: 2005-12-30
Abstract
Abstract An electrically variable three terminal monomorphic piezoelectric capacitor is manufactured with thick or thin film hybrid microelectronic circuit technology. A first capacitor plate and a ridge, which substantially surrounds and extends above the first capacitor plate, are formed on the surface of a substrate. A monomorphic piezoelectric wafer having a control plate and a second capacitor plate on opposing surfaces is bonded to the upper surface of the ridge. During bonding, a force is applied at the center of the wafer which fixes a permanent bow in the wafer in the direction of the first capacitor plate. A four terminal monomorphic embodiment and three and four terminal bimorphic embodiments are also described.
Inventors
- 👤 Robert J. Higgins, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 08:18
CPC Classifications
H; H01; H01G; H01G5/00; H01G5/16; H01G5/18; Y; Y10; Y10T; Y10T29/00; Y10T29/42; Y10T29/43
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
132 words
A method of constructing an electrically variable piezoelectric hybrid microelectronic circuit capacitor, comprising the steps of: forming a first capacitor plate on a surface of a substrate; forming a ridge on said surface of said substrate by a hybrid microelectronic circuit manufacturing process, whereby the upper surface of said ridge is positioned a predetermined distance above said first capacitor plate; forming a second capacitor plate on a first surface of a piezoelectric wafer; forming a first control plate on a second surface of said piezoelectric wafer; placing said piezoelectric wafer on said ridge; applying a force substantially at the center of said piezoelectric wafer, thereby causing said piezoelectric wafer to arch; and bonding said piezoelectric wafer to said ridge whereby said piezoelectric wafer maintains an arched shape when said force is removed.
Claim 2
Independent Claim
132 words
A method of constructing an electrically variable piezoelectric hybrid microelectronic circuit capacitor, comprising the steps of: forming a first capacitor plate on a surface of a substrate; forming a ridge on said surface of said substrate by a hybrid microelectronic circuit manufacturing process, whereby the upper surface of said ridge is positioned a predetermined distance above said first capacitor plate; forming a second capacitor plate on a first surface of a piezoelectric wafer; forming a first control plate on a second surface of said piezoelectric wafer; placing said piezoelectric wafer on said ridge; applying a force substantially at the center of said piezoelectric wafer, thereby causing said piezoelectric wafer to arch; and bonding said piezoelectric wafer to said ridge whereby said piezoelectric wafer maintains an arched shape when said force is removed.
Claim 3
Dependent Claim
23 words
The method of claim 1, further comprising the step of applying a dielectric material over the surface of one of said capacitor plates.
Claim 4
Dependent Claim
22 words
The method of claim 1, wherein said step of forming said ridge includes the step of tooling said ridge in said substrate.
Claim 5
Dependent Claim
19 words
The method of claim 1, wherein said hybrid microelectronic circuit manufacturing process includes sputtering said ridge on said substrate.
Claim 6
Dependent Claim
20 words
The method of claim 1, wherein said hybrid microelectronic circuit manufacturing process includes vacuum depositing said ridge on said substrate.
Claim 7
Dependent Claim
19 words
The method of claim 1, wherein said hybrid microelectronic circuit manufacturing process includes electroplating said ridge on said substrate.
Claim 8
Dependent Claim
19 words
The method of claim 1, wherein said hybrid microelectronic circuit manufacturing process includes screening said ridge on said substrate.
Claim 9
Dependent Claim
27 words
The method of claim 1, wherein said hybrid microelectronic circuit manufacturing process includes bonding said ridge to said substrate, wherein said ridge is a preformed glass ring.
Claim 10
Dependent Claim
23 words
The method of claim 1, further comprising the step of forming a second control plate on said first surface of said piezoelectric wafer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-06-29 | 1990-12-29 | 1991-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-06-29 | 1994-12-29 | 1995-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-06-29 | 1998-12-29 | 1999-06-30 | $7700.00 | Window Closed / Lapsed |