Multi-layer circuit board

Claim 1

A multi-layer printed circuit board for enabling a manufacture of printed circuits, the multi-layer print circuit including a first and second circuit board, each of said first and second circuit boards including an outer surface and an inner surface, the inner surfaces of said first and second circuit boards being disposed in composition to each other, metallic conductor means provided on each of said first and second circuit boards, a shielding means interposed between said inner surfaces of said first and second circuit boards for enabling an electrostatic decoupling of said metallic conductor means, a plurality of throughholes provided in said first and second circuit boards for accomodating portions of electrical circuit elements of the printed circuits, an electrically conductive lining means provided in each of said throughholes and connected to said shielding means, said electrically conductive lining means having an axial length less than an axial length of said throughholes, an electrically conductive metallic layer disposed in each of said throughholes connected to said metallic conductor means, an insulating means disposed on said electrically conductive lining means for electrically separating the electrically conductive metallic layer from said electrically conductive lining means, said insulated lining means including a pair of flange means interposed between respective ends of said electrically conductive lining means and said electrically conductive metallic conductor means so as to insulate the respective ends of the electrically conductive lining means from the electrically conductive metallic layer means, said flange means being disposed between the respective ends of the electrically conductive layer means and the respective outer surfaces of said circuit boards, and wherein respective ends of said electrically conductive metallic layer are electrically connected to said electrically conductive metallic conductor means.