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US4674704A Expired / Lapsed US ⏱️ 0.0 years remaining

Direct air cooling system for airborne electronics

Assignee: United States Department of the Air Force
•
Filing: 1985-12-03
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Granted: 1987-06-23
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Expires: 2005-12-03
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Abstract

Abstract A direct air cooling system 12 for electronics carried by aircraft. The cooling system provides a submerged air scoop 16 which directs outside air to several electronic modules 14. The air flows through passages 76 in the modules 14 which are adjacent to circuit boards 74, 78 bearing discrete electronic components 88. A foil layer 86 and aluminum fin stock help transfer heat from the electronic components to the directed air. Heated air is then exhausted through exhaust port 24 or 28.

Inventors

  • 👤 Frank E. Altoz
  • 👤 John J. Buckley

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 19:36
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20009; H05K7/20136; B; B64; B64D; B64D2241/00; Y; Y10; Y10S; Y10S62/00; Y10S62/05

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 180 words
A direct air cooling system for aircraft electronics which comprises: (a) a submerged air scoop for bringing an air flow from the exterior of an aircraft to its interior wherein said air scoop comprises a vacuum slot for drawing off boundary layer air from the air flow passing through said air scoop in order to avoid air flow separation and stagnation, (b) an inlet air duct for directing said air flow to electronic modules requiring cooling wherein said electronic modules comprise a multitude of electronic circuit board assemblies comprising circuit boards, discrete heat producing electronic components, a heat spreader and air passages adjacent to said circuit boards wherein said air passages are connected to said air inlet duct and comprise theremally conductive fin stock positioned to produce a high capacity heat transfer area where air from said inlet duct is used to cool said circuit boards and discrete heat producing components via said heat spreader; and (c) an air exit port duct connected to said air passages for exhausting air to an exhaust port on the exterior of said aircraft.
Claim 2
Dependent Claim 180 words
A direct air cooling system for aircraft electronics which comprises: (a) a submerged air scoop for bringing an air flow from the exterior of an aircraft to its interior wherein said air scoop comprises a vacuum slot for drawing off boundary layer air from the air flow passing through said air scoop in order to avoid air flow separation and stagnation, (b) an inlet air duct for directing said air flow to electronic modules requiring cooling wherein said electronic modules comprise a multitude of electronic circuit board assemblies comprising circuit boards, discrete heat producing electronic components, a heat spreader and air passages adjacent to said circuit boards wherein said air passages are connected to said air inlet duct and comprise theremally conductive fin stock positioned to produce a high capacity heat transfer area where air from said inlet duct is used to cool said circuit boards and discrete heat producing components via said heat spreader; and (c) an air exit port duct connected to said air passages for exhausting air to an exhaust port on the exterior of said aircraft.
Claim 3
Dependent Claim 23 words
The direct air cooling system of claim 1 wherein said air scoop further comprises a valve for controlling air flow through said scoop.
Claim 4
Dependent Claim 22 words
The direct air cooling system of claim 1 further comprising a fan for supplying air flow when said aircraft is at rest.
Claim 5
Dependent Claim 24 words
The direct air cooling system of claim 1 wherein said inlet duct further comprising a debris trap for removing contaminants from said air flow.
Claim 6
Dependent Claim 161 words
A direct air cooling system for electronics carried aboard an aircraft comprising: (a) a submerged air inlet exposed to air flowing past said aircraft; (b) a relatively low pressure slot in said submerged air inlet for removing high pressure boundary layer air from said inlet; (c) an air control valve for selectively controlling air flow through said submerged air inlet; (d) an air duct system fluidly connected to said subxerged air inlet comprising: (i) contaminant traps to remove contaminants from air flowing through said air duct system, and (ii) a fan for inducing air flow when air is not flowing past said aircraft; (e) an electronic module fluidly connected to said air duct system wherein cooling air from said air duct system flow directly through air passages in said electronic module adjacent to circuit boards, said circuit boards being in close proximity to discrete heat producing electronic components; and (f) an air exit for exhausting air heated by said electronic components.
Claim 7
Dependent Claim 161 words
A direct air cooling system for electronics carried aboard an aircraft comprising: (a) a submerged air inlet exposed to air flowing past said aircraft; (b) a relatively low pressure slot in said submerged air inlet for removing high pressure boundary layer air from said inlet; (c) an air control valve for selectively controlling air flow through said submerged air inlet; (d) an air duct system fluidly connected to said subxerged air inlet comprising: (i) contaminant traps to remove contaminants from air flowing through said air duct system, and (ii) a fan for inducing air flow when air is not flowing past said aircraft; (e) an electronic module fluidly connected to said air duct system wherein cooling air from said air duct system flow directly through air passages in said electronic module adjacent to circuit boards, said circuit boards being in close proximity to discrete heat producing electronic components; and (f) an air exit for exhausting air heated by said electronic components.
Claim 8
Dependent Claim 33 words
The direct air cooling system of claim 5 wherein said air passages further comprise thermally conductive fin stock positioned to increase the heat transfer area between the cooling air and the circuit boards.
Claim 9
Dependent Claim 53 words
The direct air cooling system of claim 5 wherein said electronic modules further comprise a foil heat spreader interspaced between said circuit board and said air passages in order to spread the heat produced by the heat producing electronic components and to facilitate heat transfer between said circuit boards and said air flow.

References Cited (Backward Citations)

US2319894A Cited
US2721715A Cited
US3062484A Cited
US2902597A Cited
US3104522A Cited
US3752422A Cited
US3977206A Cited
US3783935A Cited
US4174083A Cited
US4250703A Cited
US4275857A Cited
US4504030A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-06-22 1990-12-22 1991-06-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-06-22 1994-12-22 1995-06-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-06-22 1998-12-22 1999-06-23 $7700.00 Window Closed / Lapsed

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