Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
97 words
A method of patterning electrically conductive layers on a substrate, said method comprising the steps of: providing a substrate having a metallic material patterned thereon; heating said substrate and depositing a layer of electrically conductive material over said metallic pattern and on said substrate; depositing a layer of a photoresist composition over said electrically conductive layer and exposing said photoresist layer to ultraviolet light through the side of said substrate opposite said photoresist layer; and developing said photoresist layer to form a photoresist mask and to expose portions of said conductive material disposed over said metallic pattern.
Claim 2
Independent Claim
97 words
A method of patterning electrically conductive layers on a substrate, said method comprising the steps of: providing a substrate having a metallic material patterned thereon; heating said substrate and depositing a layer of electrically conductive material over said metallic pattern and on said substrate; depositing a layer of a photoresist composition over said electrically conductive layer and exposing said photoresist layer to ultraviolet light through the side of said substrate opposite said photoresist layer; and developing said photoresist layer to form a photoresist mask and to expose portions of said conductive material disposed over said metallic pattern.
Claim 3
Dependent Claim
16 words
The method according to claim 1 wherein said substrate is made of an optically transparent material.
Claim 4
Dependent Claim
12 words
The method according to claim 1 wherein said metallic material includes aluminum.
Claim 5
Dependent Claim
16 words
The method according to claim 1 wherein said electrically conductive material includes a semiconductive metal oxide.
Claim 6
Dependent Claim
14 words
The method according to claim 4 wherein said metal oxide includes indium tin oxide.
Claim 7
Dependent Claim
86 words
The method according to claim 1 wherein said step of providing said substrate with said pattern includes the steps of: providing an optically transparent substrate coated with a layer of a metallic material layer; coating said metallic layer with a layer of a photoresist composition; exposing to ultraviolet light and developing said photoresist layer to form a photoresist mask and to expose portions of said metallic layer; and etching said exposed metallic portions and removing said photoresist mask, resulting in a metallic pattern on said substrate.
Claim 8
Independent Claim
155 words
A method of patterning electrically conductive layers on a substrate, said method comprising the steps of: providing an optically transparent substrate coated with a layer of metallic material; coating said metallic layer with a layer of a photoresist composition; exposing said photoresist layer to ultraviolet light and developing said photoresist layer to form a photoresist mask and to expose portions of said metallic layer; etching said exposed metallic portions and removing said photoresist mask, resulting in a metallic pattern on said substrate; heating said substrate and depositing a layer of an electrically conductive material on said substrate and over said metallic pattern; depositing a layer of photoresist composition over said electrically conductive layer and exposing said photoresist layer to ultraviolet light through the side of said substrate opposite said photoresist layer; and developing said photoresist layer to form a photoresist mask and to expose portions of said electrically conductive material disposed over said metallic pattern.
Claim 9
Independent Claim
155 words
A method of patterning electrically conductive layers on a substrate, said method comprising the steps of: providing an optically transparent substrate coated with a layer of metallic material; coating said metallic layer with a layer of a photoresist composition; exposing said photoresist layer to ultraviolet light and developing said photoresist layer to form a photoresist mask and to expose portions of said metallic layer; etching said exposed metallic portions and removing said photoresist mask, resulting in a metallic pattern on said substrate; heating said substrate and depositing a layer of an electrically conductive material on said substrate and over said metallic pattern; depositing a layer of photoresist composition over said electrically conductive layer and exposing said photoresist layer to ultraviolet light through the side of said substrate opposite said photoresist layer; and developing said photoresist layer to form a photoresist mask and to expose portions of said electrically conductive material disposed over said metallic pattern.
Claim 10
Dependent Claim
12 words
The method according to claim 7 wherein said metallic material includes aluminum.
Claim 11
Dependent Claim
16 words
The method according to claim 7 wherein said electrically conductive material includes a semiconductive metal oxide.
Claim 12
Dependent Claim
14 words
The method according to claim 9 wherein said metal oxide includes indium tin oxide.