US4668533A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ink jet printing of printed circuit boards
Assignee: EIDP Inc
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Filing: 1985-05-10
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Granted: 1987-05-26
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Expires: 2005-05-10
Abstract
Abstract Imagewise deposition of ink onto a substrate such as a circuit board, by ink jet technology, to produce a metal-imaged circuit board.
Inventors
- 👤 Joel S. Miller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:05
CPC Classifications
B; B41; B41M; B41M5/00; B41M5/0041; B41M5/0047; B41M5/0058; B41M5/0064; B41M5/007; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/18; C23C18/1803; C23C18/1824; C23C18/1827; C23C18/1831; C23C18/1851; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2053; C23C18/206; C23C18/28; C23C18/30; C23C18/31; C23C18/38; C23C18/42; H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1241; H05K3/125; B41M3/00; B41M3/006; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/013; H05K2203/07; H05K2203/0703; H05K2203/0709; H05K2203/12; H05K2203/121
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
77 words
An improved process for preparing printed circuit board wherein the improvement consists essentially of: (i) depositing a water-based ink comprising a first metal on a substrate in a predetermined pattern by the ink jet process, and (ii) depositing on said substrate, by electroless deposition, a second metal having a reduction potential equal to or more positive than that of the first metal, said second metal depositing in a pattern substantially congruent to that formed in step (i).
Claim 2
Dependent Claim
77 words
An improved process for preparing printed circuit board wherein the improvement consists essentially of: (i) depositing a water-based ink comprising a first metal on a substrate in a predetermined pattern by the ink jet process, and (ii) depositing on said substrate, by electroless deposition, a second metal having a reduction potential equal to or more positive than that of the first metal, said second metal depositing in a pattern substantially congruent to that formed in step (i).
Claim 3
Dependent Claim
98 words
An improved process for preparing a printed circuit board wherein the improvement consists essentially of: (i) depositing a water-based ink comprising a sensitizer for image sensitization on a substrate in a predetermined pattern by the ink jet process, (ii) treating the sensitized substrate of step (i) with a metal which is reduced by the sensitizer, and (iii) depositing on said substrate, by electroless deposition, a metal having a reduction potential equal to or more positive than that of the metal employed in step (ii), said metal depositing in a pattern substantially congruent to that formed in step (ii).
Claim 4
Dependent Claim
98 words
An improved process for preparing a printed circuit board wherein the improvement consists essentially of: (i) depositing a water-based ink comprising a sensitizer for image sensitization on a substrate in a predetermined pattern by the ink jet process, (ii) treating the sensitized substrate of step (i) with a metal which is reduced by the sensitizer, and (iii) depositing on said substrate, by electroless deposition, a metal having a reduction potential equal to or more positive than that of the metal employed in step (ii), said metal depositing in a pattern substantially congruent to that formed in step (ii).
Claim 5
Dependent Claim
35 words
A process according to claim 1 wherein the metal of step (i) is selected from the group palladium and copper, and the metal of step (ii) is selected from the group copper, silver and gold.
Claim 6
Dependent Claim
38 words
A process according to claim 2 wherein the metal of step (i) is tin, the metal of step (ii) is selected from palladium and copper, and the metal of step (iii) is selected from copper, silver, and gold.
Claim 7
Dependent Claim
22 words
A process according to claim 3 wherein the metal of step (i) is palladium and the metal of step (ii) is copper.
Claim 8
Dependent Claim
22 words
A process according to claim 4 wherein the metal of step (ii) is palladium and the metal of step (iii) is copper.
Claim 9
Dependent Claim
12 words
A process according to claim 5 wherein the substrate comprises a polymer.
Claim 10
Dependent Claim
11 words
A process according to claim 5 wherein the substrate comprises paper.
Claim 11
Dependent Claim
12 words
A process according to claim 5 wherein the substrate comprises a metal.
Claim 12
Dependent Claim
12 words
A process according to claim 5 wherein the substrate comprises a ceramic.
Claim 13
Dependent Claim
11 words
A process according to claim 5 wherein the substrate comprises glass.
Claim 14
Dependent Claim
12 words
A process according to claim 6 wherein the substrate comprises a polymer.
Claim 15
Dependent Claim
11 words
A process according to claim 6 wherein the substrate comprises paper.
Claim 16
Dependent Claim
12 words
A process according to claim 6 wherein the substrate comprises a metal.
Claim 17
Dependent Claim
12 words
A process according to claim 6 wherein the substrate comprises a ceramic.
Claim 18
Dependent Claim
11 words
A process according to claim 6 wherein the substrate comprises glass.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-05-25 | 1990-11-24 | 1991-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-05-25 | 1994-11-24 | 1995-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-05-25 | 1998-11-24 | 1999-05-26 | $7700.00 | Window Closed / Lapsed |