US4666796A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plated parts and their production
Assignee: SEMI-ALLOYS Co
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Filing: 1986-05-28
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Granted: 1987-05-19
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Expires: 2006-05-28
Abstract
Abstract Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second layer of gold is electroplated onto the second layer of nickel. The resultant plated parts exhibit higher salt atmosphere corrosion resistance than parts plated with a single nickel-gold set. Other metals can be used as the plating layers.
Inventors
- 👤 Samuel W. Levine
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:28
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/01; B32B15/018; C; C25; C25D; C25D5/00; C25D5/10; C25D5/12; C25D5/14; C25D5/60; C25D5/623; H; H10; H10W; H10W70/00; H10W70/01; H10W70/02; H10W76/00; H10W76/10; H10W76/17; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12875; Y10T428/12889; Y10T428/12896; Y10T428/12903; Y10T428/1291; Y10T428/12937
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
111 words
A sealing cover for a hermetic package containing a semiconductor device, said cover comprising: a base layer of a metal which is corrodable in a salt atmosphere environment; a first layer of nickel or a nickel based alloy plated on said base metal; an intermediate layer of a metal selected from the group consisting of copper, silver, palladium, platinum or their alloys plated on said first layer of nickel or a nickel based alloy; a second layer of nickel or a nickel based alloy plated on said intermediate layer; and a layer of gold or a gold based alloy plated on said second layer of nickel or a nickel based alloy.
Claim 2
Dependent Claim
111 words
A sealing cover for a hermetic package containing a semiconductor device, said cover comprising: a base layer of a metal which is corrodable in a salt atmosphere environment; a first layer of nickel or a nickel based alloy plated on said base metal; an intermediate layer of a metal selected from the group consisting of copper, silver, palladium, platinum or their alloys plated on said first layer of nickel or a nickel based alloy; a second layer of nickel or a nickel based alloy plated on said intermediate layer; and a layer of gold or a gold based alloy plated on said second layer of nickel or a nickel based alloy.
Claim 3
Dependent Claim
15 words
The sealing cover of claim 1, wherein the base metal layer comprises an iron-based alloy.
Claim 4
Dependent Claim
19 words
The sealing cover of claim 2 wherein said metal of said intermediate layer comprises copper or a copper-based alloy.
Claim 5
Dependent Claim
19 words
The sealing cover of claim 2, wherein said metal of said intermediate layer comprises silver or a silver-based alloy.
Claim 6
Dependent Claim
19 words
The sealing cover of claim 2, wherein said metal of said intermediate layer comprises palladium or a palladium-based alloy.
Claim 7
Dependent Claim
19 words
The sealing cover of claim 2, wherein said metal of said intermediate layer comprises platinum or a platinum-based alloy.
Claim 8
Dependent Claim
58 words
The sealing cover of claim 2, wherein said iron-based alloy is selected from the group consisting of an alloy comprising about 17 weight percent cobalt, 29 weight percent nickel, the balance iron and a minor percentage of other elements or an alloy comprising about 42 weight percent nickel, the balance iron and a minor percentage of other elements.
Claim 9
Dependent Claim
32 words
The sealing cover of claim 7, wherein said iron-based alloy is an alloy comprising 17 weight percent cobalt, 29 weight percent nickel the balance iron and a minor percentage of other elements.
Claim 10
Dependent Claim
20 words
The sealing cover of claim 2, wherein each of said plated players has a thickness less than about 500 microinches.
Claim 11
Dependent Claim
22 words
The sealing cover of claim 9, wherein each of said nickel layers has a thickness of between about 10 to 300 microinches.
Claim 12
Dependent Claim
29 words
The sealing cover of claim 10, wherein the thickness of each of said intermediate layer and said gold layer is in the range of about 5 to 150 microinches.
Claim 13
Dependent Claim
116 words
A process for plating a sealing cover for a hermetic package containing a semiconductor device, said method comprising: plating on a base layer of a metal which is corrodable in a salt atmosphere environment, a first layer of nickel or a nickel based alloy on said base metal; plating an intermediate layer of a metal selected from the group consisting of copper, silver, palladium, platinum or their alloys on said first layer of nickel or a nickel based alloy; plating a second layer of nickel or a nickel based alloy on said intermediate layer; and plating a layer of gold or a gold based alloy on said second layer of nickel or a nickel based alloy.
Claim 14
Dependent Claim
116 words
A process for plating a sealing cover for a hermetic package containing a semiconductor device, said method comprising: plating on a base layer of a metal which is corrodable in a salt atmosphere environment, a first layer of nickel or a nickel based alloy on said base metal; plating an intermediate layer of a metal selected from the group consisting of copper, silver, palladium, platinum or their alloys on said first layer of nickel or a nickel based alloy; plating a second layer of nickel or a nickel based alloy on said intermediate layer; and plating a layer of gold or a gold based alloy on said second layer of nickel or a nickel based alloy.
Claim 15
Dependent Claim
14 words
The process of claim 12, wherein said base metal layer comprises an iron-based alloy.
Claim 16
Dependent Claim
19 words
The process of claim 13, wherein said metal of said intermediate layer comprises copper or a copper based alloy.
Claim 17
Dependent Claim
19 words
The process of claim 13, wherein said metal of said intermediate layer comprises silver or a silver based alloy.
Claim 18
Dependent Claim
19 words
The process of claim 13, wherein said metal of said intermediate layer comprises palladium or a palladium based alloy.
Claim 19
Dependent Claim
19 words
The process of claim 13, wherein said metal of said intermediate layer comprises platinum or a platinum based alloy.
Claim 20
Dependent Claim
22 words
The process of claim 13, wherein the each of said plated layers is plated to a thickness less than about 500 microinches.
Claim 21
Dependent Claim
24 words
The process of claim 18, wherein said first and second nickel layers are plated to a thickness of between about 10 to 300 microinches.
Claim 22
Dependent Claim
27 words
The process of claim 19, wherein each of said intermediate layer and said gold layer are plated to a thickness of between about 5 to 150 microinches.
References Cited (Backward Citations)
US2428033A
Cited
US3221219A
Cited
US3199003A
Cited
US3219748A
Cited
US3364064A
Cited
US3362851A
Cited
US3823468A
Cited
US3874549A
Cited
US3946190A
Cited
US4243729A
Cited
US4284481A
Cited
US4486622A
Cited
US4411965A
Cited
EP0127857A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-05-18 | 1990-11-17 | 1991-05-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-05-18 | 1994-11-17 | 1995-05-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-05-18 | 1998-11-17 | 1999-05-19 | $7700.00 | Window Closed / Lapsed |