Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
89 words
A printed circuit board which consists of: a metal board and a resin board glued together by a prepreg; said metal board having holes printed therein filled with resin and lead wire holes provided at the centers of said resin filled holes; said resin board being provided with at least one circuit layer and through holes, with centers of said lead wire holes and centers of said through holes being on identical lines, said prepreg not having holes therein corresponding to said holes in said metal and resin boards.
Claim 2
Dependent Claim
89 words
A printed circuit board which consists of: a metal board and a resin board glued together by a prepreg; said metal board having holes printed therein filled with resin and lead wire holes provided at the centers of said resin filled holes; said resin board being provided with at least one circuit layer and through holes, with centers of said lead wire holes and centers of said through holes being on identical lines, said prepreg not having holes therein corresponding to said holes in said metal and resin boards.
Claim 3
Dependent Claim
14 words
The printed circuit board of claim 1 in which said metal board is aluminum.
Claim 4
Independent Claim
99 words
A method of manufacturing a printed circuit board which comprises providing holes in a metal board by a drilling machine or press machine with a hole position designating means, filling said holes with resin, providing lead wire holes at centers of said resin filled holes by a drilling machine with said hole position designating means, and providing a resin board having at least one circuit layer therein and through holes provided therethrough; said metal board and said resin board being glued together, keeping the centers of said lead wire holes and centers of said through holes on identical lines.
Claim 5
Independent Claim
99 words
A method of manufacturing a printed circuit board which comprises providing holes in a metal board by a drilling machine or press machine with a hole position designating means, filling said holes with resin, providing lead wire holes at centers of said resin filled holes by a drilling machine with said hole position designating means, and providing a resin board having at least one circuit layer therein and through holes provided therethrough; said metal board and said resin board being glued together, keeping the centers of said lead wire holes and centers of said through holes on identical lines.
Claim 6
Dependent Claim
18 words
The method of claim 3 in which an NC tape is employed as said hole position designating means.
Claim 7
Dependent Claim
17 words
The method of claim 4 in which an NC drilling machine is employed as said drilling machine.
Claim 8
Dependent Claim
26 words
The method of claim 3 in which the surface of said metal board is roughened prior to providing said resin filled holes on said metal board.
Claim 9
Dependent Claim
21 words
The method of claim 3 in which said metal board and said resin board are glued together by a prepreg layer.
Claim 10
Dependent Claim
24 words
The method of claim 7 in which holes are formed in said prepreg layer corresponding to said holes in said metal board, simultaneously therewith.
Claim 11
Dependent Claim
37 words
The method of claim 7 in which a conductive circuit layer is formed in an area adjacent said through holes of said resin board on the side of said resin board where said metal board is glued.
Claim 12
Dependent Claim
11 words
The method of claim 7 in which said metal is aluminum.