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US4663208A Expired / Lapsed US ⏱️ 0.0 years remaining

Printed circuit board and method of manufacturing same

Assignee: O Key Printed Wiring Co Ltd
•
Filing: 1985-01-15
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Granted: 1987-05-05
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Expires: 2005-01-15
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Abstract

Abstract The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board of the present invention consists of a metal board glued to a resin board which is provided with at least one circuit layer. The metal board is provided with holes which are filled with resin, and lead wire holes are provided at the centers of the resin filled holes. The resin board is provided with through holes. The center of the lead wire holes and the centers of the through holes are on identical lines. Further, the method of manufacturing a printed circuit board under the present invention is to provide resin holes on a metal board, filling the holes with resin, and providing lead wire holes at the centers of the resin filled holes. In this process, an identical hole position designating means is used for providing the resin holes and the lead wire holes. At least one circuit layer and through holes are to be provided on the resin board. Thereafter, the metal board and the resin board are glued together. In this process, the centers of the lead wire holes and the centers of the through holes are to be put on identical lines.

Inventors

  • 👤 Takeshi Ninomiya
  • 👤 Risuke Ozaki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 06:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0058; H05K3/0061; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H05K1/00; H05K1/02; H05K1/0296; H05K1/0298; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K3/38; H05K3/386; H05K3/40; H05K3/42; H05K3/429; H05K3/44; H05K3/445; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/12; Y10T428/12361; Y10T428/12389; Y10T428/12396; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 89 words
A printed circuit board which consists of: a metal board and a resin board glued together by a prepreg; said metal board having holes printed therein filled with resin and lead wire holes provided at the centers of said resin filled holes; said resin board being provided with at least one circuit layer and through holes, with centers of said lead wire holes and centers of said through holes being on identical lines, said prepreg not having holes therein corresponding to said holes in said metal and resin boards.
Claim 2
Dependent Claim 89 words
A printed circuit board which consists of: a metal board and a resin board glued together by a prepreg; said metal board having holes printed therein filled with resin and lead wire holes provided at the centers of said resin filled holes; said resin board being provided with at least one circuit layer and through holes, with centers of said lead wire holes and centers of said through holes being on identical lines, said prepreg not having holes therein corresponding to said holes in said metal and resin boards.
Claim 3
Dependent Claim 14 words
The printed circuit board of claim 1 in which said metal board is aluminum.
Claim 4
Independent Claim 99 words
A method of manufacturing a printed circuit board which comprises providing holes in a metal board by a drilling machine or press machine with a hole position designating means, filling said holes with resin, providing lead wire holes at centers of said resin filled holes by a drilling machine with said hole position designating means, and providing a resin board having at least one circuit layer therein and through holes provided therethrough; said metal board and said resin board being glued together, keeping the centers of said lead wire holes and centers of said through holes on identical lines.
Claim 5
Independent Claim 99 words
A method of manufacturing a printed circuit board which comprises providing holes in a metal board by a drilling machine or press machine with a hole position designating means, filling said holes with resin, providing lead wire holes at centers of said resin filled holes by a drilling machine with said hole position designating means, and providing a resin board having at least one circuit layer therein and through holes provided therethrough; said metal board and said resin board being glued together, keeping the centers of said lead wire holes and centers of said through holes on identical lines.
Claim 6
Dependent Claim 18 words
The method of claim 3 in which an NC tape is employed as said hole position designating means.
Claim 7
Dependent Claim 17 words
The method of claim 4 in which an NC drilling machine is employed as said drilling machine.
Claim 8
Dependent Claim 26 words
The method of claim 3 in which the surface of said metal board is roughened prior to providing said resin filled holes on said metal board.
Claim 9
Dependent Claim 21 words
The method of claim 3 in which said metal board and said resin board are glued together by a prepreg layer.
Claim 10
Dependent Claim 24 words
The method of claim 7 in which holes are formed in said prepreg layer corresponding to said holes in said metal board, simultaneously therewith.
Claim 11
Dependent Claim 37 words
The method of claim 7 in which a conductive circuit layer is formed in an area adjacent said through holes of said resin board on the side of said resin board where said metal board is glued.
Claim 12
Dependent Claim 11 words
The method of claim 7 in which said metal is aluminum.

References Cited (Backward Citations)

US3334395A Cited
US3259805A Cited
US3514538A Cited
US3613230A Cited
US4075757A Cited
US4522667A Cited
US4478884A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-05-04 1990-11-03 1991-05-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-05-04 1994-11-03 1995-05-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-05-04 1998-11-03 1999-05-05 $7700.00 Window Closed / Lapsed

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