US4659425A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Continuous process for the manufacture of printed circuit boards
Assignee: International Business Machines Corp
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Filing: 1986-02-03
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Granted: 1987-04-21
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Expires: 2006-02-03
Abstract
Abstract A continuous method for the manufacture of a circuit board wherein a coating of a solvent-free thermosetting resin is applied to the surface of a metal foil. The resin coated foil is advanced into contact with a reinforcing cloth sheet layer to form a foil/cloth assembly. The assembly is continuously conveyed between a pair of endless belts revolving in opposite directions with mutually facing surfaces, the belts being heated to the curing temperature of the resin whereby the belts are pressed against the assembly to continuously compact the assembly and cure the resin to form a composite product which can then be circuitized from a printed circuit board.
Inventors
- 👤 Eugene A. Eggers
- 👤 William J. Summa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 10:45
CPC Classifications
B; B32; B32B; B32B38/00; B32B38/08; B32B15/00; B32B15/14; B32B37/00; B32B37/10; B32B37/1027; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; B32B2038/0052; B32B2038/0076; B32B2260/00; B32B2260/04; B32B2260/046; B32B2457/00; B32B2457/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2203/00; H05K2203/06; H05K2203/068; H05K2203/11; H05K2203/1121; H05K2203/15; H05K2203/1545
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
169 words
A method for the continuous manufacture of a composite circit board which comprises the continuous steps of coating the surface of a metal foil with a layer of a liquid thermosetting resin free of a volatile solvent, heating the foil to a temperature below the curing temperature of the resin to further fluidize the resin, advancing the heated resin coated foil into contact with a sheet of reinforcing cloth to form a foil/cloth assembly, continuously conveying the assembly between a pair of rotating endless belts having mutually facing surfaces mutually pressable against one another in a heating zone heated to the curing temperature of the resin, pressing the mutually facing surfaces of the belts against the assembly to simultaneously compress the assembly and impregnate the assembly with the resin, curing the resin in the heating zone whereby there is formed a composite structure bonded together with the cured resin, and then cooling the composite structure while the belts remain pressed against the composite structure to obtain the circuit board.
Claim 2
Independent Claim
169 words
A method for the continuous manufacture of a composite circit board which comprises the continuous steps of coating the surface of a metal foil with a layer of a liquid thermosetting resin free of a volatile solvent, heating the foil to a temperature below the curing temperature of the resin to further fluidize the resin, advancing the heated resin coated foil into contact with a sheet of reinforcing cloth to form a foil/cloth assembly, continuously conveying the assembly between a pair of rotating endless belts having mutually facing surfaces mutually pressable against one another in a heating zone heated to the curing temperature of the resin, pressing the mutually facing surfaces of the belts against the assembly to simultaneously compress the assembly and impregnate the assembly with the resin, curing the resin in the heating zone whereby there is formed a composite structure bonded together with the cured resin, and then cooling the composite structure while the belts remain pressed against the composite structure to obtain the circuit board.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein the metal foil is copper foil.
Claim 4
Dependent Claim
14 words
The method of claim 1 wherein the reinforcing cloth is a glass fiber cloth.
Claim 5
Dependent Claim
14 words
The method of claim 1 wherein the liquid thermosetting resin is an epoxy resin.
Claim 6
Dependent Claim
13 words
The method of claim 4 wherein the epoxy resin is an epoxy-styrene composition.
Claim 7
Dependent Claim
24 words
The method of claim 1 wherein the composite structure is compressed by the belts at a pressure of about 30 to about 50 psi.
Claim 8
Dependent Claim
25 words
The method of claim 1 wherein the metal foil layers of the cooled composite are etched to form circuits to obtain a printed circuit board.
Claim 9
Dependent Claim
29 words
The method of claim 7 wherein the composite board has subsequently applied thereto a plurality of metal foil and reinforcing cloth layers to form a multilayer laminated circuit board.
References Cited (Backward Citations)
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Cited
US4557784A
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US4372800A
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US4451317A
Cited
US4284753A
Cited
US4579612A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-20 | 1990-10-20 | 1991-04-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-20 | 1994-10-20 | 1995-04-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-20 | 1998-10-20 | 1999-04-21 | $7700.00 | Window Closed / Lapsed |