Method of producing a wired circuit board

Claim 1

A method for producing a wired circuit board comprising the steps of: routing a continuous insulated wire along a predetermined path through a plurality of pins projecting from a fixture plate; fastening the continuous wire to a supporting layer to maintain said wire in a fixed position along said path; mating a circuit board having a plurality of conductive pads disposed on the surface of the board with the wire such that selected points of the wire confront selected ones of the conductive pads; and interconnecting said selected points of the wire with selected ones of said conductive pads.

Claim 2

A method for producing a wired circuit board comprising the steps of: routing a continuous insulated wire along a predetermined path through a plurality of pins projecting from a fixture plate; fastening the continuous wire to a supporting layer to maintain said wire in a fixed position along said path; mating a circuit board having a plurality of conductive pads disposed on the surface of the board with the wire such that selected points of the wire confront selected ones of the conductive pads; and interconnecting said selected points of the wire with selected ones of said conductive pads.

Claim 9

A method of producing a wired circuit board comprising the steps of: routing a continuous wire along a predetermined path through first and second pluralities of pins projecting from a fixture plate; adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path; removing said second plurality of pins from said fixture plate; and mating a circuit board having a plurality of conductive pads disposed in a predetermined arrangement on said board with the wire such that selected points of the wire confront selected conductive pads on the circuit board.

Claim 10

A method of producing a wired circuit board comprising the steps of: routing a continuous wire along a predetermined path through first and second pluralities of pins projecting from a fixture plate; adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path; removing said second plurality of pins from said fixture plate; and mating a circuit board having a plurality of conductive pads disposed in a predetermined arrangement on said board with the wire such that selected points of the wire confront selected conductive pads on the circuit board.

Claim 14

A method of producing a wired circuit board comprising the steps of: loading a first plurality of pins in a first plurality of apertures of a first fixture plate having a wiring surface such that one end of said first plurality of pins projects above said wiring surface; loading a second plurality of pins in a first plurality of apertures of a second fixture plate having an upper surface such that one end of each of said second plurality of pins projects above said upper surface; locating said first fixture plate with said first plurality of pins disposed therein over said second fixture plate with said second plurality of pins disposed therein such that said one end of at least some of said second plurality of pins projects through said second plurality of apertures in said first fixture plate and above said wiring surface; routing a continuous wire along a predetermined path through said first and second pluralities of pins projecting above said wiring surface of said first fixture plate; adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path; withdrawing said second fixture plate and said second plurality of pins disposed therein from said first fixture plate; adhering a second adhesive layer to a wiring surface of a circuit board having a plurality of electrically conductive pads disposed in a predetermined arrangement on said wiring surface; registering said circuit board above said first adhesive layer and wire adhered thereto such that the second adhesive layer adhered to the wiring surface confronts the first adhesive layer; compressing the first adhesive layer and adhered continuous wire into confronting adhered contact with the second adhesive layer adhered to said circuit board such that selected points of the continuous wire confront selected ones of the conductive pads; soldering selected points of the continuous wire to selected ones of said pads; and severing the continuous wire at selected locations to form a plurality of wire segments interconnecting selected ones of said pads.

Claim 15

A method of producing a wired circuit board comprising the steps of: loading a first plurality of pins in a first plurality of apertures of a first fixture plate having a wiring surface such that one end of said first plurality of pins projects above said wiring surface; loading a second plurality of pins in a first plurality of apertures of a second fixture plate having an upper surface such that one end of each of said second plurality of pins projects above said upper surface; locating said first fixture plate with said first plurality of pins disposed therein over said second fixture plate with said second plurality of pins disposed therein such that said one end of at least some of said second plurality of pins projects through said second plurality of apertures in said first fixture plate and above said wiring surface; routing a continuous wire along a predetermined path through said first and second pluralities of pins projecting above said wiring surface of said first fixture plate; adhering the continuous wire to a first adhesive layer to maintain said wire in fixed position along said path; withdrawing said second fixture plate and said second plurality of pins disposed therein from said first fixture plate; adhering a second adhesive layer to a wiring surface of a circuit board having a plurality of electrically conductive pads disposed in a predetermined arrangement on said wiring surface; registering said circuit board above said first adhesive layer and wire adhered thereto such that the second adhesive layer adhered to the wiring surface confronts the first adhesive layer; compressing the first adhesive layer and adhered continuous wire into confronting adhered contact with the second adhesive layer adhered to said circuit board such that selected points of the continuous wire confront selected ones of the conductive pads; soldering selected points of the continuous wire to selected ones of said pads; and severing the continuous wire at selected locations to form a plurality of wire segments interconnecting selected ones of said pads.