US4647331A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for assembling an electro-optical device
Assignee: NXP USA Inc
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Filing: 1984-09-24
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Granted: 1987-03-03
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Expires: 2004-09-24
Abstract
Abstract An assembly method is described in which low level light is used to align an optical fiber to the emitting area of an LED. When alignment is achieved, the power dissipated by the LED is increased to gel or partially cure an adhesive, thereby securing the aligned fiber to the LED.
Inventors
- 👤 Daniel N. Koury, Jr.
- 👤 Howard M. Berg
- 👤 David W. Stevenson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 15:00
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/4236; G02B6/4239; H; H10; H10H; H10H20/00; H10H20/01
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
100 words
A process for assembling opto-electronic devices comprising the steps of supplying electric current to a semiconductor die, said current being sufficient to activate said semiconductor die but insufficient to substantially warm said semiconductor die; aligning optical fiber means with respect to an active area on said semiconductor die; applying adhesive to the volume between said fiber and said semiconductor die either before, between, or after said supplying and aligning steps; and then increasing said current to warm said semiconductor die and at least partially curing said adhesive, thereby securing the alignment of said optical fiber means to said semiconductor die.
Claim 2
Dependent Claim
100 words
A process for assembling opto-electronic devices comprising the steps of supplying electric current to a semiconductor die, said current being sufficient to activate said semiconductor die but insufficient to substantially warm said semiconductor die; aligning optical fiber means with respect to an active area on said semiconductor die; applying adhesive to the volume between said fiber and said semiconductor die either before, between, or after said supplying and aligning steps; and then increasing said current to warm said semiconductor die and at least partially curing said adhesive, thereby securing the alignment of said optical fiber means to said semiconductor die.
Claim 3
Dependent Claim
19 words
The process as set forth in claim 1 wherein said fiber means is aligned in three axes of motion.
Claim 4
Dependent Claim
39 words
The process as set forth in claim 1 wherein said semiconductor die comprises a light emitting diode and said current is sufficient to cause said diode to emit light but is insufficient to cause appreciable heating of the diode.
Claim 5
Dependent Claim
25 words
The process as set forth in claims 1 or 3 and further comprising the initial step of heating said semiconductor die to a predetermined temperature.
Claim 6
Dependent Claim
21 words
The process as set forth in claim 4 wherein said fiber means is aligned in at least two axes of motion.
Claim 7
Dependent Claim
44 words
The process as set forth in claim 5 wherein said optical fiber means comprises an optical fiber having a lens on the end thereof adjacent said semiconductor die and wherein said alignment step comprises adjusting the spacing of the lens from said semiconductor die.
Claim 8
Dependent Claim
19 words
The process as set forth in claim 6 wherein said fiber means is aligned in three axes of motion.
Claim 9
Independent Claim
87 words
A method for assembling an optical fiber to an optoelectronic semiconductor die, comprising: activating the optoelectronic semiconductor die at a power level to operation of the die but to not cause the die to generate an a substantial amount of heat; aligning the optical fiber and the die; applying adhesive to the optical fiber and the die; and activating the optoelectronic semiconductor die at a high power level so that heat generated by the die will cure the adhesive thereby bonding the optical fiber to the die.
Claim 10
Independent Claim
87 words
A method for assembling an optical fiber to an optoelectronic semiconductor die, comprising: activating the optoelectronic semiconductor die at a power level to operation of the die but to not cause the die to generate an a substantial amount of heat; aligning the optical fiber and the die; applying adhesive to the optical fiber and the die; and activating the optoelectronic semiconductor die at a high power level so that heat generated by the die will cure the adhesive thereby bonding the optical fiber to the die.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-03-02 | 1990-09-01 | 1991-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-03-02 | 1994-09-01 | 1995-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-03-02 | 1998-09-01 | 1999-03-03 | $7700.00 | Window Closed / Lapsed |