US4644643A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin
Assignee: Kangyo Denkikiki KK
•
Filing: 1985-07-29
•
Granted: 1987-02-24
•
Expires: 2005-07-29
Abstract
Abstract A method for electrically interconnecting a laminated printed circuit structure comprises the steps of inserting a solder-plated connecting conductor pin into a through hole bored through overlying interconnecting sections of the respective printed circuit sheets, applying pressure to both ends of the pin to compress and thicken the pin, and passing an electric current through the pin to solder the pin and the respective interconnecting sections to one another at the inner peripheral surface of the through hole.
Inventors
- 👤 Michio Sudo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 05:01
CPC Classifications
H; H02; H02K; H02K29/00; H02K29/06; H02K29/08; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49147; Y10T29/49149; Y10T29/49151; Y10T29/49153
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
228 words
A method for electrically interconnecting a laminated printed circuit structure, comprising: laminating a plurality of printed circuit sheets each composed of an insulating sheet having a conductive wiring pattern formed on at least one surface of said insulating sheet, said wiring pattern of each of said printed circuit sheets including at least one interconnecting section, the interconnecting sections of said printed circuit sheets being disposed in overlying relation to one another; forming a through hole penetrating through the respective interconnecting sections and insulating sheets of said laminated printed circuit sheets; press-inserting a connecting conductor pin, which is solder plated over its entire peripheral surface, into said through hole; and passing an electric current through said connecting conductor pin for a time sufficient to fuse the solder plating on said pin thereby to connect said conductor pin to the said interconnecting sections of said printed circuit sheets at the inner peripheral surface of said through hole; said method including the step, before said electric current is passed through said connecting conductor pin, of applying pressure to the ends of said pin to compress said pin so as to increase the thickness of said pin thereby to enhance the electrical connection between the pin and said interconnecting sections of said printed circuit sheets and to form flanges at the opposite ends of said pin before passing current through the pin.
Claim 2
Independent Claim
228 words
A method for electrically interconnecting a laminated printed circuit structure, comprising: laminating a plurality of printed circuit sheets each composed of an insulating sheet having a conductive wiring pattern formed on at least one surface of said insulating sheet, said wiring pattern of each of said printed circuit sheets including at least one interconnecting section, the interconnecting sections of said printed circuit sheets being disposed in overlying relation to one another; forming a through hole penetrating through the respective interconnecting sections and insulating sheets of said laminated printed circuit sheets; press-inserting a connecting conductor pin, which is solder plated over its entire peripheral surface, into said through hole; and passing an electric current through said connecting conductor pin for a time sufficient to fuse the solder plating on said pin thereby to connect said conductor pin to the said interconnecting sections of said printed circuit sheets at the inner peripheral surface of said through hole; said method including the step, before said electric current is passed through said connecting conductor pin, of applying pressure to the ends of said pin to compress said pin so as to increase the thickness of said pin thereby to enhance the electrical connection between the pin and said interconnecting sections of said printed circuit sheets and to form flanges at the opposite ends of said pin before passing current through the pin.
References Cited (Backward Citations)
US3264524A
Cited
US3281923A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-23 | 1990-08-25 | 1991-02-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-23 | 1994-08-25 | 1995-02-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-23 | 1998-08-25 | 1999-02-24 | $7700.00 | Window Closed / Lapsed |