Frequency synthesizer module

Claim 2

A frequency synthesizer module comprising: a two-piece metallic-die cast housing and cover assembly including a an internal metallic wall disposed between two end walls which divides the space enclosed thereby into two isolated cavities; a VCO circuit sub-assembly on a first substrate which is solder-affixed onto a first side of said internal metallic wall; a PLL circuit sub-assembly on a second substrate which is removably affixed with adhesive into position adjacent a second side of said internal metallic wall, each said circuit sub-assembly being electrically interconnected directly to the other by at least one conductor passing through at least one aperture in said internal metallic wall; and said housing includes said two end walls transverse to said internal metallic wall which is centrally disposed therebetween and wherein said housing further includes two mounting brackets, each extending generally parallel to said internal metallic wall and located between respective lower inside corners of said end walls.

Claim 3

A frequency synthesizer module comprising: a two piece metallic die-cast housing and cover assembly including an internal metallic wall which divides the space enclosed thereby into two electromagnetically isolated cavities; a first circuit sub-assembly on a first substrate and a second circuit sub-assembly on a second substrate each substrate being removably affixed into positions on respective opposite side of said internal metallic wall and each electrically interconnected directly to the other by at least one conductor passing through at least one aperture in said internal metallic wall; a one-piece molded plastic header removably affixed to a side of said housing opposite said cover and said header having apertures through which electrical leads extend outwardly from said housing; and said housing including two ends walls transverse to said internal metallic wall which is centrally disposed therebetween and wherein said housing further includes two mounting brackets, each extending generally parallel to said internal metallic wall and located between respective lower inside corners of said end walls.

Claim 4

A frequency synthesizer module comprising: a two piece metallic die-cast housing and cover assembly including an internal metallic wall which divides the space enclosed thereby into two electromagnetically isolated cavities; a first circuit sub-assembly on a first substrate and a second circuit sub-assembly on a second substrate each substrate being removably affixed into positions on respective opposite side of said internal metallic wall and each electrically interconnected directly to the other by at least one conductor passing through at least one aperture in said internal metallic wall; a one-piece molded plastic header removably affixed to a side of said housing opposite said cover and said header having apertures through which electrical leads extend outwardly from said housing; and said housing including two ends walls transverse to said internal metallic wall which is centrally disposed therebetween and wherein said housing further includes two mounting brackets, each extending generally parallel to said internal metallic wall and located between respective lower inside corners of said end walls.

Claim 5

A frequency synthesizer module as in claim 2 further comprisng a separate secondary metallic shield disposed over portions of said first substate and directly affixed thereto.

Claim 6

A frequency synthesizer module as in claim 3 wherein one of said substrates is affixed to said internal metallic wall with low temperature solder and the other of said substrates is affixed into its said position with respect to said internal wall with adhesive.

Claim 7

A frequency synthesizer module comprising: a two piece metallic die-cast housing and cover assembly including an internal metallic wall which divides the space enclosed thereby two electromagnetically isolated cavities; a first circuit sub-assembly on a first substrate and a second circuit and sub-assembly on a second substrate each substrate being removably affixed into positions on respective opposite sides of said internal metallic wall and each electrically interconnected directly to the other by at least one conductor passing through at least one aperture in said internal metallic wall; a one-piece molded plastic header removably affixed to a side of said housing opposite said cover and said header having apertures through which electrical leads extends outwardly from said housing; a separate secondary metallic shield disposed over portions of said first substrate and directly affixed thereto; one of said substrates being affixed to said internal metallic wall with low temperature solder and the other of said substrates being affixed into its said position with respect to said internal wall with adhesive; and said housing including two end walls transverse to said internal metallic wall which is centrally disposed therebetween and wherein said housing further includes two mounting brackets, each extending generally parallel to said internal metallic wall and located between respective lower inside corners of said end walls.

Claim 8

A frequency synthesizer module comprising: a two piece metallic die-cast housing and cover assembly including an internal metallic wall which divides the space enclosed thereby two electromagnetically isolated cavities; a first circuit sub-assembly on a first substrate and a second circuit and sub-assembly on a second substrate each substrate being removably affixed into positions on respective opposite sides of said internal metallic wall and each electrically interconnected directly to the other by at least one conductor passing through at least one aperture in said internal metallic wall; a one-piece molded plastic header removably affixed to a side of said housing opposite said cover and said header having apertures through which electrical leads extends outwardly from said housing; a separate secondary metallic shield disposed over portions of said first substrate and directly affixed thereto; one of said substrates being affixed to said internal metallic wall with low temperature solder and the other of said substrates being affixed into its said position with respect to said internal wall with adhesive; and said housing including two end walls transverse to said internal metallic wall which is centrally disposed therebetween and wherein said housing further includes two mounting brackets, each extending generally parallel to said internal metallic wall and located between respective lower inside corners of said end walls.

Claim 9

A frequency synthesizer module as in claim 5 wherein the lower edge of said internal metallic wall stops above a substantial portion of said mounting brackets to permit assembly of said header beneath said internal metallic wall with at least outer tab portions of said header remaining disposed above and upon portions of said mounting brackets.

Claim 10

A frequency synthesizer module comprising: a one-piece metallic housing having a center wall disposed between two transverse end walls and having at least one aperture formed through said center wall; a one-piece metallic cover of generally U-shaped cross-section and removably attached to said housing to fit over and enclose said center wall and inside surface of said end walls by providing top and side walls for the housing when attached thereto; an insulating header with first and second sets of apertures formed therein, said header being affixed to said housing to provide its bottom wall; a controlled oscillator circuit sub-assembly removably affixed into a position on one side of said center wall; a phase-locked loop circuit sub-assembly removably affixed into a position on the opposite side of said center wall; said circuit sub-assembly being electrically interconnected through said at least one aperture in said center wall; and each of said circuit sub-assbmlies including conductive leads extending downwardly through a respective one of said sets of apertures in said header and cut of said housing; said housing including transverse mounting brackets formed between lower inside corners of said end walls, said cover and said header each being removably attached to said mounting brackets.

Claim 11

A frequency synthesizer module comprising: a one-piece metallic housing having a center wall disposed between two transverse end walls and having at least one aperture formed through said center wall; a one-piece metallic cover of generally U-shaped cross-section and removably attached to said housing to fit over and enclose said center wall and inside surface of said end walls by providing top and side walls for the housing when attached thereto; an insulating header with first and second sets of apertures formed therein, said header being affixed to said housing to provide its bottom wall; a controlled oscillator circuit sub-assembly removably affixed into a position on one side of said center wall; a phase-locked loop circuit sub-assembly removably affixed into a position on the opposite side of said center wall; said circuit sub-assembly being electrically interconnected through said at least one aperture in said center wall; and each of said circuit sub-assbmlies including conductive leads extending downwardly through a respective one of said sets of apertures in said header and cut of said housing; said housing including transverse mounting brackets formed between lower inside corners of said end walls, said cover and said header each being removably attached to said mounting brackets.

Claim 12

A freuqnecy synthesizer module as in claim 7 wherein said controlled oscillator circuit sub-assembly is soldered to said center wall.

Claim 13

A frequency synthesizer module as in claim 7 wherein said phase-locked loop circuit sub-assembly is adhesively affixed into its said position.

Claim 14

A frequency synthesizer module as in claim 7 wherein said controlled oscillator circuit sub-assembly includes a further metallic shield disposed over a portion thereof by bent legs having distal ends soldered to a surface of this sub-assembly.

Claim 15

A frequency synthesizer module as in claim 7 wherein said housing and said cover are of zinc die-cast construction.

Claim 16

A frequency synthesizer module as in claim 7 wherein said cover is removably affixed to said mounting brackets by screws.

Claim 17

A frequency synthesizer module as in claim 12 wherein said mounting brackets also include threaded screw holes disposed downwardly to permit removable screw connection of module to an underlying circuit board structure.

Claim 18

A frequency synthesizer module as in claim 7 wherein said header is a one-piece molded plastic structure which includes a central longitudinal portion which fits between said mounting brackets and outer opposing tab portions which fit over respective ones of said mounting brackets, said mounting brackets and said tab portions each having mated mounting holes formed therein.

Claim 19

A frequency synthesizer module as in claim 14 wherein said controlled oscillator circuit sub-assembly is soldered to said center wall.

Claim 20

A frequency synthesizer module as in claim 15 wherein said mounting brackets also include threaded screw holes disposed downwardly to permit removable screw connection of said module to an underlying circuit board structure.

Claim 21

A frequency synthesizer module as in claim 15 wherein said controlled oscillator circuit sub-assembly includes a further metallic shield disposed over a portion thereof by bent legs having distal ends soldered to a surface of said controlled oscillator circuit sub-assembly.

Claim 22

A frequency synthesizer module comprising: a one-piece metallic housing having a center wall disposed between two transverse end walls and having at least one aperture formed through said center wall; a one-piece metallic cover of generally U-shaped cross-section and removably attached to said housing to fit over and enclose said center wall and inside surface of said end walls by providing top and side walls for the housing when attached thereto; an insualting header with first and second sets of apertures formed therein, said header being affixed to said housing to provide its bottom wall; said circuit sub-assemblies being electrically interconnected through said at least one aperture in said center wall; and each of said circuit sub-assemblies including conductive leads extending downwardly through a respective one of said sets of aperture in said header and out of said housing; surface of said center wall each including cavities positioned under through-holes of respective associated sub-assemblies so as to prevent electrical shorting thereof to said center wall.

Claim 23

A frequency synthesizer module comprising: a one-piece metallic housing having a center wall disposed between two transverse end walls and having at least one aperture formed through said center wall; a one-piece metallic cover of generally U-shaped cross-section and removably attached to said housing to fit over and enclose said center wall and inside surface of said end walls by providing top and side walls for the housing when attached thereto; an insualting header with first and second sets of apertures formed therein, said header being affixed to said housing to provide its bottom wall; said circuit sub-assemblies being electrically interconnected through said at least one aperture in said center wall; and each of said circuit sub-assemblies including conductive leads extending downwardly through a respective one of said sets of aperture in said header and out of said housing; surface of said center wall each including cavities positioned under through-holes of respective associated sub-assemblies so as to prevent electrical shorting thereof to said center wall.

Claim 24

A frequency synthesizer module comprising: a one-piece metallic housing having a center wall disposed between two transverse end walls and having at least one aperture formed through said center wall; a one-piece metallic cover of generally U-shaped cross-section and removably attached to said housing to fit over and enclose said center wall and inside surfaces of said end walls by providing top and side walls for the housing when attached thereto; an insulating header with first and second sets of apertures formed therein, said header being affixed to said housing to provide its bottom wall; a controlled oscillator circuit sub-assembly removably affixed into a position on one side of said center wall; a phase-locked loop circuit sub-assembly removably affixed into a position on the opposite side of said center wall; said circuit sub-assemblies being electrically interconnected through said at least one aperture in said center wall; and each of said circuit sub-assemblies including conductive leads extending downwardly through a respective one of said sets of apertures in said header and out of said housing; the surface of said center wall associated with said controlled oscillator circuit sub-assembly including at least one cavity containing solder for use in attaching said controlled oscillator circuit sub-assembly to said center wall.

Claim 25

A frequency synthesizer module comprising: a one-piece metallic housing having a center wall disposed between two transverse end walls and having at least one aperture formed through said center wall; a one-piece metallic cover of generally U-shaped cross-section and removably attached to said housing to fit over and enclose said center wall and inside surfaces of said end walls by providing top and side walls for the housing when attached thereto; an insulating header with first and second sets of apertures formed therein, said header being affixed to said housing to provide its bottom wall; a controlled oscillator circuit sub-assembly removably affixed into a position on one side of said center wall; a phase-locked loop circuit sub-assembly removably affixed into a position on the opposite side of said center wall; said circuit sub-assemblies being electrically interconnected through said at least one aperture in said center wall; and each of said circuit sub-assemblies including conductive leads extending downwardly through a respective one of said sets of apertures in said header and out of said housing; the surface of said center wall associated with said controlled oscillator circuit sub-assembly including at least one cavity containing solder for use in attaching said controlled oscillator circuit sub-assembly to said center wall.