Polycrystalline silicon Schottky diode array

Claim 2

A Schottky diode comprising: a substrate; an insulating layer formed over said substrate; a layer of metal silicide formed over said insulating layer; a layer of polysilicon formed over said metal silicide and self-aligned with the edges thereof and in contact with said metal silicide; a wall of insulating material formed over all exposed polysilicon and silicide surfaces except the entire top surface of said polysilicon; and a layer of metal in contact with said top surface of said polysilicon.

Claim 3

A Schottky diode comprising: a substrate; a layer of metal silicide having sidewalls, said metal silicide overlying said substrate; a layer of polysilicon having sidewalls and a top surface, said polysilicon overlying said silicide and aligned with the edges thereof and in contact with said metal silicide; silicon dioxide spacers insulating all said sidewalls but not any part of said top surface; and a Schottky contact to said top surface.

Claim 4

A Schottky diode comprising: a substrate; a layer of metal silicide having sidewalls, said metal silicide overlying said substrate; a layer of polysilicon having sidewalls and a top surface, said polysilicon overlying said silicide and aligned with the edges thereof and in contact with said metal silicide; silicon dioxide spacers insulating all said sidewalls but not any part of said top surface; and a Schottky contact to said top surface.

Claim 5

A Schottky diode for connecting metal to metal-silicide formed above a semiconductor substrate but insulated from it comprising: (1) a dielectric layer on said substrate (2) a layer of metal-silicide having an upper and a lower surface and having edges between said upper and lower surfaces, the lower surface being disposed on said dielectric layer; (3) a layer of polycrystalline silicon having a top surface and side surfaces, said polycrystalline silicon aligned with said edges of the layer of metal-silicide and in contact with said metal-silicide; (4) a region of insulating material disposed around the sides but not the top of said polycrystalline silicon and around said edges of said metal-silicide; and (5) a layer of metal deposited over the entire structure so as to be in contact with the top of the layer of polycrystalline silicon.

Claim 6

A Schottky diode for connecting metal to metal-silicide formed above a semiconductor substrate but insulated from it comprising: (1) a dielectric layer on said substrate (2) a layer of metal-silicide having an upper and a lower surface and having edges between said upper and lower surfaces, the lower surface being disposed on said dielectric layer; (3) a layer of polycrystalline silicon having a top surface and side surfaces, said polycrystalline silicon aligned with said edges of the layer of metal-silicide and in contact with said metal-silicide; (4) a region of insulating material disposed around the sides but not the top of said polycrystalline silicon and around said edges of said metal-silicide; and (5) a layer of metal deposited over the entire structure so as to be in contact with the top of the layer of polycrystalline silicon.

Claim 7

A diode as in claim 3 wherein the layer of metal-silicide is a refractory metal-silicide.

Claim 8

A diode as in claim 4 wherein the metalsilicide is tantalum silicide.

Claim 9

A diode as in claim 3 wherein the layer of polycrystalline silicon is doped with an impurity.

Claim 10

A diode as in claim 6 wherein the impurity is introduced into the polycrystalline silicon nonuniformly.

Claim 11

The diode of claim 7 wherein said non-uniform doping is of a lesser concentration near said top of said polycrystalline silicon than in said polycrystalline silicon near said upper surface of said metal-silicide.

Claim 12

A diode as in claim 7 wherein the impurity is N conductivity-type.

Claim 13

A diode as in claim 3 wherein the region of insulating material comprises silicon dioxide.

Claim 14

A diode as in claim 3 wherein the layer of metal is aluminum.

Claim 15

An array of Schottky diodes in a desired pattern comprising: a dielectric substrate; a plurality of first strips on the dielectric substrate, each strip including a lower region of metal-silicide and an upper region of polycrystalline silicon aligned with the edges, of the metal-silicide and in contact with said metal-silicide, said first strips each having sides and a top; a first region of insulating material on each of the plurality of strips covering said sides; a second region of insulating material on selected portions of the tops of said first strips covering the polycrystalline silicon at those selected portions; a plurality of metal strips, each disposed to cross at least one of the plurality of first strips, the metal strip forming a Schottky diode wherever the metal contacts the upper region of polycrystalline silicon, and the metal strip not forming a Schottky diode wherever the metal contacts only some or all of the second region of insulating material but not any of said polycrystalline silicon.

Claim 16

An array of Schottky diodes in a desired pattern comprising: a dielectric substrate; a plurality of first strips on the dielectric substrate, each strip including a lower region of metal-silicide and an upper region of polycrystalline silicon aligned with the edges, of the metal-silicide and in contact with said metal-silicide, said first strips each having sides and a top; a first region of insulating material on each of the plurality of strips covering said sides; a second region of insulating material on selected portions of the tops of said first strips covering the polycrystalline silicon at those selected portions; a plurality of metal strips, each disposed to cross at least one of the plurality of first strips, the metal strip forming a Schottky diode wherever the metal contacts the upper region of polycrystalline silicon, and the metal strip not forming a Schottky diode wherever the metal contacts only some or all of the second region of insulating material but not any of said polycrystalline silicon.

Claim 17

An array as in claim 12 wherein the dielectric substrate comprises silicon dioxide.

Claim 18

An array as in claim 13 wherein the dielectric substrate is formed on monocrystalline silicon.

Claim 19

An array as in claim 14 wherein the monocrystalline silicon includes other electronic devices.

Claim 20

An array as in claim 12 wherein the plurality of first strips is disposed perpendicularly to the plurality of metal strips.

Claim 21

An array as in claim 12 wherein the polycrystalline silicon is doped with an impurity.

Claim 22

An array as in claim 17 wherein the impurity is introduced into the polycrystalline silicon nonuniformly and has a higher concentration at the bottom of the layer of polycrystalline silicon than at the top of the layer of polycrystalline silicon.

Claim 23

An array as in claim 18 wherein the impurity is N conductivity type.

Claim 24

An array as in claim 12 wherein the first region of insulating material comprises silicon dioxide.

Claim 25

An array as in claim 20 wherein the second region of insulating material comprises silicon dioxide.

Claim 26

An array as in claim 12 wherein the plurality of metal strips comprise aluminum.