US4626872A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermal print head
Assignee: Toshiba Corp
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Filing: 1985-08-29
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Granted: 1986-12-02
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Expires: 2005-08-29
Abstract
Abstract A thermal print head comprises a heat resisting resin film and resistive heating layers and metal circuit layers on the film, the metal circuit layers connected to the resistive heating layers respectively. The film is supported on a heat sink substrate provided with a flat surface and corner sections formed at the both sides of the flat surface, the resistive heating layers positioned over the flat surface. The heat sink substrate supports the film to prevent the resistive heating layers from electrical resistance value fluctuation due to bending of the film.
Inventors
- 👤 Shozo Takeno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:42
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/315; B41J2/32; B41J2/335; B41J2/33505; B41J2/33515; B41J2/33535; B41J2/3355; B41J2/33555; B41J2/33565; B41J2/3358; B41J2/345
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
109 words
A thermal print head comprising: a heat sink substrate having a flat surface with corners extending along both sides thereof; a heat resisting organic resin film sheet formed on the flat surface and folded at the corners; resistive heating layers comprising a plurality of resistive heating elements deposited on an area of the film sheet on the flat surface; metal circuit layers extending on the film sheet electrically connected to the resistive heating layers respectively; and integrated circuits mounted on the substrate at a position spaced from said flat surface and electrically connected to the metal circuit layers, wherein the resistive heating layers are kept flat supported without bending.
Claim 2
Dependent Claim
109 words
A thermal print head comprising: a heat sink substrate having a flat surface with corners extending along both sides thereof; a heat resisting organic resin film sheet formed on the flat surface and folded at the corners; resistive heating layers comprising a plurality of resistive heating elements deposited on an area of the film sheet on the flat surface; metal circuit layers extending on the film sheet electrically connected to the resistive heating layers respectively; and integrated circuits mounted on the substrate at a position spaced from said flat surface and electrically connected to the metal circuit layers, wherein the resistive heating layers are kept flat supported without bending.
Claim 3
Dependent Claim
47 words
The thermal print head of claim 1 wherein the heat sink substrate comprises a flat metal plate having a flat metal surface on which said film sheet is mounted and a metal block fixed to a surface of said flat metal plate opposite said flat surface thereof.
Claim 4
Dependent Claim
16 words
The thermal print head of claim 1 wherein the film sheet is comprised of polyimide resin.
Claim 5
Dependent Claim
33 words
The thermal print head of claim 1 wherein at least the film sheet, the resistive heating layers and the metal circuit layers on the flat surface are overcoated with a wear resisting layer.
Claim 6
Dependent Claim
29 words
The thermal print head of claim 4 wherein the resistive heating layers are comprised of Ta-Si-O and the wear resisting layer is comprised of Ta 2 O 5 .
Claim 7
Dependent Claim
30 words
The thermal print head of claim 1 wherein the resistive heating layers are excluded from both folded sections of the film sheet at the corners of the heat sink substrate.
Claim 8
Dependent Claim
21 words
The thermal print head of claim 6 wherein the metal circuit layers extend through the folded sections of the film sheet.
Claim 9
Dependent Claim
18 words
The thermal print head of claim 2 wherein the film sheet intimately contacts said flat metal plate surface.
Claim 10
Dependent Claim
23 words
The thermal print head of claim 1 wherein the integrated circuit is mounted on the film sheet with the deposited resistive heating layers.
Claim 11
Dependent Claim
19 words
The thermal print head of claim 1 wherein the heat sink substrate is in the shape of a rod.
Claim 12
Dependent Claim
17 words
The thermal print head of claim 2 wherein said integrated circuit is mounted on said metal block.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-12-01 | 1990-06-02 | 1990-12-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-12-01 | 1994-06-02 | 1994-12-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-12-01 | 1998-06-02 | 1998-12-02 | $7700.00 | Window Closed / Lapsed |