US4623577A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board made from cross-linked polycyanurate polymer, thermoplastic polymer and polyaramid fiber
Assignee: Honeywell International Inc
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Filing: 1985-02-01
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Granted: 1986-11-18
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Expires: 2005-02-01
Abstract
Abstract The present invention is a circuit board having a substrate comprising a semi-IPN and at least one balanced polyaramid layer.
Inventors
- 👤 Eric S. Hsiue
- 👤 Daniel Ziatyk
- 👤 George R. Stone
- 👤 Bruce T. DeBona
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 00:30
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/02; H05K2201/0275; H05K2201/0278; H05K2201/06; H05K2201/068; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/902; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31547; Y10T442/00; Y10T442/20; Y10T442/2861; Y10T442/2893; Y10T442/30; Y10T442/3854
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
64 words
A circuit board comprising a substrate comprising at least one polymeric layer comprising a crosslinked cyanurate polymer, a thermoplastic polymer having a Tg of greater than 80° C., and at least one balanced polyaramid fibrous layer adhered to the polymeric layer, the substrate having a coefficient of thermal expansion of from 2.0 to 8.0×10 -6 cm/cm/°C.; and at least one layer of conductive material.
Claim 2
Dependent Claim
64 words
A circuit board comprising a substrate comprising at least one polymeric layer comprising a crosslinked cyanurate polymer, a thermoplastic polymer having a Tg of greater than 80° C., and at least one balanced polyaramid fibrous layer adhered to the polymeric layer, the substrate having a coefficient of thermal expansion of from 2.0 to 8.0×10 -6 cm/cm/°C.; and at least one layer of conductive material.
Claim 3
Dependent Claim
72 words
The circuit board of claim 1, wherein the crosslinked cyanurate polymer is formed by crosslinking an aromatic dicyanate monomer of the formula NCO-R-OCN wherein R comprises at least on aromatic moiety and contains 6-40 carbon atoms, in which the aromatic rings may be further substituted with groups inert during the crosslinking, selected from halogen, C 1 -C 4 alkyl, C 1 -C 4 alkoxy and C 1 -C 4 alkyl carboxylic ester.
Claim 4
Dependent Claim
18 words
The circuit board of claim 1 wherein the conductive material is in a configuration which forms a circuit.
Claim 5
Dependent Claim
16 words
The circuit board of claim 1 wherein the polyaramid layer is coated with the polymeric layer.
Claim 6
Dependent Claim
16 words
The circuit board of claim 1 wherein the polyaramid layer is embedded in the polymeric layer.
Claim 7
Dependent Claim
16 words
The circuit board of claim 1 wherein the polyaramid layers is laminated to the polymeric layer.
Claim 8
Dependent Claim
23 words
The circuit board of claim 1 wherein the thermoplastic polymer is selected from the group consisting of polyethersulfone, and polycarbonate, and poly(ester carbonate).
Claim 9
Dependent Claim
16 words
The circuit board of claim 1 futher comprising at least one leadless chip carrier interconnected therewith.
Claim 10
Dependent Claim
69 words
An improved circuit board of the type having a substrate and a conducting layer wherein the improvement comprises a substrate comprising at least one polymeric layer comprising a crosslinked cyanurate polymer, a thermoplastic polymer having a Tg of greater than 80° C., and at least one balanced polyaramid layer adhered to the polymeric layer, the substrate having a coefficient of thermal expansion of from 2.0 to 8.0×10 -6 cm/cm/°C.
Claim 11
Dependent Claim
69 words
An improved circuit board of the type having a substrate and a conducting layer wherein the improvement comprises a substrate comprising at least one polymeric layer comprising a crosslinked cyanurate polymer, a thermoplastic polymer having a Tg of greater than 80° C., and at least one balanced polyaramid layer adhered to the polymeric layer, the substrate having a coefficient of thermal expansion of from 2.0 to 8.0×10 -6 cm/cm/°C.
Claim 12
Dependent Claim
16 words
The circuit board of claim 9 further comprising at least one leadless chip carriers interconnected therewith.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-11-17 | 1990-05-19 | 1990-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-11-17 | 1994-05-19 | 1994-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-11-17 | 1998-05-19 | 1998-11-18 | $7700.00 | Window Closed / Lapsed |