US4621019A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-photosensitive transfer resist
Assignee: 3M Co
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Filing: 1985-02-19
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Granted: 1986-11-04
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Expires: 2005-02-19
Abstract
Abstract A non-photosensitive transfer resist sheet material comprises in sequence (a) a carrier support (b) a release layer (c) a flexible, water-insoluble, aqueous-alkaline-soluble, non-photosensitive resist layer comprising a thermoplastic organic polymer, wherein said resist is able to adhere to a surface against which it is pressed at a temperature above 60 DEG C. The resist is useful as a protective layer in etching and coating processes in electronic circuitry technology.
Inventors
- 👤 John P. Vikesland
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:02
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0079; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0537; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0786; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24843; Y10T428/28; Y10T428/2813; Y10T428/2817; Y10T428/2848
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
74 words
A non-photosensitive transfer resist sheet material comprising in sequence (a) a strippably adhered carrier support, (b) a release layer, and (c) a flexible, water-insoluble, aqueous-alkaline-soluble, non-photosensitive resist layer comprising a thermoplastic organic polymer. wherein said resist maintains its physical integrity during chemical operations up to a pH of at least 9.0, and wherein said resist is able to be adhered to a surface against which it is pressed at a temperature above 60° C.
Claim 2
Dependent Claim
74 words
A non-photosensitive transfer resist sheet material comprising in sequence (a) a strippably adhered carrier support, (b) a release layer, and (c) a flexible, water-insoluble, aqueous-alkaline-soluble, non-photosensitive resist layer comprising a thermoplastic organic polymer. wherein said resist maintains its physical integrity during chemical operations up to a pH of at least 9.0, and wherein said resist is able to be adhered to a surface against which it is pressed at a temperature above 60° C.
Claim 3
Dependent Claim
23 words
The sheet material according to claim 1 wherein said resist layer dissolves in an aqueous-alkaline solution having a pH of at least 9.0.
Claim 4
Dependent Claim
23 words
The sheet material according to claim 1 wherein said resist layer dissolves in an aqueous-alkaline solution having a pH of at least 12.0.
Claim 5
Dependent Claim
27 words
The sheet material according to claim 1 wherein said resist is able to be adhered to said surface in the temperature range of 80° to 120° C.
Claim 6
Dependent Claim
16 words
The sheet material according to claim 1 wherein said resist layer comprises a phenol formaldehyde resin.
Claim 7
Dependent Claim
15 words
The sheet material according to claim 1 wherein said resist layer comprises an acrylic polymer.
Claim 8
Dependent Claim
22 words
The sheet material according to claim 1 wherein said organic polymer of said resist layer is crosslinkable by the application of heat.
Claim 9
Dependent Claim
20 words
The sheet material according to claim 1 wherein said resist layer comprises a phenol formaldehyde resin and an acrylic polymer.
Claim 10
Dependent Claim
28 words
The sheet material according to claim 1 wherein said resist layer comprises (1) an acrylic copolymer or terpolymer and (2) a phenol formaldehyde resin crosslinked with a polyisocyanate.
Claim 11
Dependent Claim
59 words
A multi-layered electronic circuitry article consisting essentially of: (a) an electronic circuitry element having an electronic circuit on at least one surface thereof, and (b) laminated at a temperature of at least 60° C. over at least one surface of said electronic circuitry element at least one flexible, water-insoluble, non-photosensitive, aqueous-alkaline soluble resist layer comprising a thermoplastic organic polymer.
Claim 12
Dependent Claim
59 words
A multi-layered electronic circuitry article consisting essentially of: (a) an electronic circuitry element having an electronic circuit on at least one surface thereof, and (b) laminated at a temperature of at least 60° C. over at least one surface of said electronic circuitry element at least one flexible, water-insoluble, non-photosensitive, aqueous-alkaline soluble resist layer comprising a thermoplastic organic polymer.
Claim 13
Dependent Claim
67 words
A multi-layered electronic circuitry article comprising: (a) an electronic circuitry element having an electronic circuit on at least one surface thereof, (b) laminated at a temperature of at least 60° C. over at least one surface of said electronic circuitry element at least one flexible, water-insoluble, non-photosensitive, aqueous-alkaline soluble resist layer comprising a thermoplastic organic polymer, and (c) a strippable carrier support adhered to said resist layer.
Claim 14
Dependent Claim
67 words
A multi-layered electronic circuitry article comprising: (a) an electronic circuitry element having an electronic circuit on at least one surface thereof, (b) laminated at a temperature of at least 60° C. over at least one surface of said electronic circuitry element at least one flexible, water-insoluble, non-photosensitive, aqueous-alkaline soluble resist layer comprising a thermoplastic organic polymer, and (c) a strippable carrier support adhered to said resist layer.
Claim 15
Dependent Claim
20 words
The article according to claim 11 further comprising a release layer between said strippable carrier support and said resist layer.
Claim 16
Dependent Claim
22 words
The article according to claim 10 wherein said resist layer dissolves in an aqueous-alkaline solution having a pH of at least 9.0.
Claim 17
Dependent Claim
22 words
The article according to claim 10 wherein said resist layer dissolves in an aqueous-alkaline solution having a pH of at least 12.0.
Claim 18
Dependent Claim
23 words
The article according to claim 10 wherein said resist is able to be adhered in the temperture range of 80° to 120° C.
Claim 19
Dependent Claim
15 words
The article according to claim 10 wherein said resist layer comprises a phenol formaldehyde resin.
Claim 20
Dependent Claim
14 words
The article according to claim 10 wherein said resist layer comprises an acrylic polymer.
Claim 21
Dependent Claim
19 words
The article according to claim 10 wherein said resist layer comprises a phenol formaldehyde resin and an acrylic polymer.
Claim 22
Independent Claim
145 words
A method of protecting an electronic circuitry element with a laminated non-photosensitive resist layer comprising the steps of (a) providing an electronic circuitry element having a circuit panel on at least one surface thereof, (b) providing a non-photosensitive transfer resist sheet material comprising in sequence (1) a carrier support, (2) a release layer, and (3) a flexible, water-insoluble, aqueous-alkaline soluble, non-photosensitive resist layer comprising thermoplastic organic polymer, said resist layer being laminable at a temperature above 60° C., (c) contacting said transfer resist sheet material to at least one surface of said electronic circuitry element, (d) applying heat at a temperature above 60° C. and at a pressure and time sufficient to adhere said resist layer of said transfer resist sheet material to said electronic circuitry element, and (e) stripping away said carrier support to provide said electronic circuitry element bearing a protective resist layer.
Claim 23
Independent Claim
145 words
A method of protecting an electronic circuitry element with a laminated non-photosensitive resist layer comprising the steps of (a) providing an electronic circuitry element having a circuit panel on at least one surface thereof, (b) providing a non-photosensitive transfer resist sheet material comprising in sequence (1) a carrier support, (2) a release layer, and (3) a flexible, water-insoluble, aqueous-alkaline soluble, non-photosensitive resist layer comprising thermoplastic organic polymer, said resist layer being laminable at a temperature above 60° C., (c) contacting said transfer resist sheet material to at least one surface of said electronic circuitry element, (d) applying heat at a temperature above 60° C. and at a pressure and time sufficient to adhere said resist layer of said transfer resist sheet material to said electronic circuitry element, and (e) stripping away said carrier support to provide said electronic circuitry element bearing a protective resist layer.
Claim 24
Dependent Claim
22 words
The method according to claim 19 wherein said resist layer dissolves in an aqueous-alkaline solution having a pH of at least 9.0.
Claim 25
Dependent Claim
22 words
The method according to claim 19 wherein said resist layer dissolves in an aqueous-alkaline solution having a pH of at least 12.0.
Claim 26
Dependent Claim
20 words
The method according to claim 19 wherein said resist is laminated in the temperature range of 80° to 120° C.
Claim 27
Dependent Claim
15 words
The method according to claim 19 wherein said resist layer comprises a phenol formaldehyde resin.
Claim 28
Dependent Claim
14 words
The method according to claim 19 wherein said resist layer comprises an acrylic polymer.
Claim 29
Dependent Claim
19 words
The method according to claim 19 wherein said resist layer comprises a phenol formaldehyde resin and an acrylic polymer.
Claim 30
Dependent Claim
27 words
The method according to claim 19 wherein said resist layer comprises (1) an acrylic copolymer or terpolymer and (2) and phenol formaldehyde resin crosslinked with a polyisocyanate.
Claim 31
Dependent Claim
21 words
The method according to claim 19 wherein said organic polymer of said resist layer is crosslinkable by the application of heat.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-11-03 | 1990-05-05 | 1990-11-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-11-03 | 1994-05-05 | 1994-11-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-11-03 | 1998-05-05 | 1998-11-04 | $7700.00 | Window Closed / Lapsed |