Fusible powdered metal paste

Claim 2

An improved essentially nonaqueous noncorrosive inorganic salt free paste vehicle for soft solder metal powder, said vehicle comprising a nonhydrocarbon resinous binder in which is dispersed a nonaqueous organic liquid composition, said composition having a surface tension of from 43 to 65 or higher dynes/cm. at 20° C.

Claim 3

A vehicle as defined in claim 1 in which the vehicle also includes an organic anhydrous flux.

Claim 4

A nonaqueous noncorrosive inorganic salt free soft solder paste characterized by resistance to slumping during heating to the solder fusion point comprising: (a) from 75 to 95 weight parts per 100 parts of paste composition of a soft solder metal powder composition having a particle size of from -200 to +400 mesh (U.S. Standard Screen), (b) from 25 to 5 weight parts heat liquefiable nonhydrocarbon resinous binder composition ranging from semi-solid at room temperature to fugitive from the metal powder at the fusion temperature thereof, said binder composition including: (c) a nonaqueous organic liquid composition having a surface tension of from 43 to 65 dynes/cm. or higher at 20° C. dispersed in said binder, and, (d) an amount of a noncorrosive organic flux for said soft solder sufficient to form a shiny and coherent residue of solder upon melting and solidifying said powdered soft solder.

Claim 5

A nonaqueous noncorrosive inorganic salt free soft solder paste characterized by resistance to slumping during heating to the solder fusion point comprising: (a) from 75 to 95 weight parts per 100 parts of paste composition of a soft solder metal powder composition having a particle size of from -200 to +400 mesh (U.S. Standard Screen), (b) from 25 to 5 weight parts heat liquefiable nonhydrocarbon resinous binder composition ranging from semi-solid at room temperature to fugitive from the metal powder at the fusion temperature thereof, said binder composition including: (c) a nonaqueous organic liquid composition having a surface tension of from 43 to 65 dynes/cm. or higher at 20° C. dispersed in said binder, and, (d) an amount of a noncorrosive organic flux for said soft solder sufficient to form a shiny and coherent residue of solder upon melting and solidifying said powdered soft solder.

Claim 6

A vehicle as defined in claim 1 wherein the nonhydrocarbon resinous binder is a thermoplastic resinous binder having a melting point above 15° C. and below the melting point of the solder metal powder.

Claim 7

A vehicle as defined in claim 4 wherein the nonhydrocarbon resinous binder is selected from the group consisting of wood rosin and derivatives thereof, gum rosin and derivatives thereof and tall oil rosin and derivatives thereof.

Claim 8

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is rosin.

Claim 9

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a rosin polymer.

Claim 10

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a rosin ester.

Claim 11

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a rosin glycerine ester.

Claim 12

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a hydrogenated or partially hydrogenated rosin.

Claim 13

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a hydrogenated or partially hydrogenated rosin ester.

Claim 14

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a polyester.

Claim 15

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a polyester of a dihydric alcohol and a dicarboxylic acid.

Claim 16

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a polyvinyl halide polymer or copolymer.

Claim 17

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a polyvinyl acetate or polyvinyl alcohol.

Claim 18

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is a copolymer of polyvinyl chloride and polyvinyl acetate.

Claim 19

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is an epoxy resin.

Claim 20

A vehicle as defined in claim 5 wherein the nonhydrocarbon resinous binder is an acrylic polymer or copolymer.

Claim 21

An improved essentially nonaqueous noncorrosive inorganic salt free paste vehicle for soft solder metal powder, said vehicle comprising a nonhydrocarbon resinous binder in which is dispersed in a proportion effective for diminishing hot slump of said metal powder when it is compounded with said vehicle, a base dispersed in a liquid polyol and an organic anhydrous flux, said vehicle having a surface tension of from 43 to 65 or higher dynes/cm. at 20° C.

Claim 22

An improved essentially nonaqueous noncorrosive inorganic salt free paste vehicle for soft solder metal powder, said vehicle comprising a nonhydrocarbon resinous binder in which is dispersed in a proportion effective for diminishing hot slump of said metal powder when it is compounded with said vehicle, a base dispersed in a liquid polyol and an organic anhydrous flux, said vehicle having a surface tension of from 43 to 65 or higher dynes/cm. at 20° C.

Claim 23

A nonaqueous noncorrosive inorganic salt free powdered solf solder metal paste composition in accordance with claim 1 wherein the nonaqueous organic liquid composition includes triethanolamine.

Claim 24

A nonaqueous noncorrosive inorganic salt free powdered soft solder metal paste composition in accordance with claim 1 wherein the nonaqueous organic liquid composition includes diethanolamine.

Claim 25

The vehicle of claim 19 in which the base is sodium hydroxide in a proportion between about 0.05% and about 5% by weight of the vehicle.

Claim 26

The past of claim 1 comprising from about 75-95 parts of powdered tin-containing solder which melts below 330° C. and has a particle size not substantially larger than about 100 mesh.

Claim 27

The vehicle of claim 1 which consists essentially of rosin, a base and a polyol having a surface tension of from 43 to 65 or more dynes/cm. at 20° C. and is further characterized by the presence therein of a surfactant.

Claim 28

The vehicle of claim 1 which consists essentially of rosin, an alkali metal hydroxide and a polyol having a surface tension of from 43 to 65 or more dynes/cm. at 20° C. and is further characterized by the presence therein of plasticizer or diluent.

Claim 29

The vehicle of claim 1 wherein said nonaqueous organic liquid comprises glycerine.

Claim 30

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 2 wherein the flux is a basic reacting flux.

Claim 31

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 27 wherein the basic reacting flux is an amine.

Claim 32

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 28 wherein the amine is trialkylamine in which the alkyl group is selected from the same or different alkyl groups containing from 2 to 6 carbon atoms.

Claim 33

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 29 in which the trialkylamine is triethylamine.

Claim 34

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 2 in which the flux is an alkali metal hydroxide or an alkali metal alcoholate.

Claim 35

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 31 in which the alkali metal hydroxide is dissolved in or reacted with the polyol.

Claim 36

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 31 in which the alkali metal hydroxide is sodium hydroxide.

Claim 37

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 2 in which the nonaqueous organic liquid is a polyhydric alcohol containing only the elements C, H, and O.

Claim 38

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 34 in which the polyhydric alcohol is glycerine.

Claim 39

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 2 said paste being further characterized by the presence therein of from 0.5% to 10% by weight of an alkanolamine.

Claim 40

A nonaqueous noncorrosive inorganic salt free soft solder paste as defined in claim 36 wherein the alkanolamine is triethanolamine.

Claim 41

The paste of claim 2 comprising from about 75-95 parts of powdered tin-containing solder which melts below 330° C. and has particle size not substantially larger than about 100 mesh.