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US4618878A
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Semiconductor device having a multilayer wiring structure using a polyimide resin
Assignee: Toshiba Corp
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Filing: 1984-06-15
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Granted: 1986-10-21
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Expires: 2004-06-15
Abstract
Abstract A semiconductor device having a multilayer wiring structure which comprises a semiconductor substrate, a first wiring layer deposited on said substrate, and a second wiring layer deposited on said first wiring layer with insulating layers disposed therebetween, wherein the insulating interlayer consists of an inorganic insulating layer and a polyimide-based resin film overlying the inorganic insulating layer. The thickness ratio of the polyimide-based resin film to the inorganic insulating film ranges from 0.1 to 0.5. A method of manufacturing a semiconductor device of a multilayer wiring structure wherein an opening is formed in the insulating interlayer to have a small step.
Inventors
- 👤 Masaharu Aoyama
- 👤 Masahiro Abe
- 👤 Takashi Ajima
- 👤 Toshio Yonezawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 17:45
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
105 words
A semiconductor device having a multilayer wiring structure which comprises a semiconductor substrate, a first wiring layer deposited on said substrate, and a second wiring layer deposited on said first wiring layer with an insulating interlayer disposed therebetween, wherein said insulating interlayer consisting essentially of an inorganic insulating layer as an underlying layer and a polyimide-based resin film as an overlying layer, wherein said inorganic insulating film has a thickness falling within a range between 0.5 μm and 1.5 μm, the ratio of a thickness of said polyimide-based resin film to that of said inorganic insulating film falling within a range between 0.1 and 0.5.
Claim 2
Dependent Claim
105 words
A semiconductor device having a multilayer wiring structure which comprises a semiconductor substrate, a first wiring layer deposited on said substrate, and a second wiring layer deposited on said first wiring layer with an insulating interlayer disposed therebetween, wherein said insulating interlayer consisting essentially of an inorganic insulating layer as an underlying layer and a polyimide-based resin film as an overlying layer, wherein said inorganic insulating film has a thickness falling within a range between 0.5 μm and 1.5 μm, the ratio of a thickness of said polyimide-based resin film to that of said inorganic insulating film falling within a range between 0.1 and 0.5.
Claim 3
Dependent Claim
34 words
A device according to claim 1, wherein said inorganic insulating film comprises a film selected from the group consisting of a silicon nitride film, a nitride-containing silicon oxide film, and a multilayer film thereof.
Claim 4
Dependent Claim
17 words
A device according to claim 2, wherein said inorganic insulating film comprises a chemical vapor deposition film.
Claim 5
Dependent Claim
18 words
A device according to claim 2, wherein said inorganic insulating film comprises a plasma chemical vapor deposition film.
Claim 6
Dependent Claim
24 words
A device according to claim 1, wherein said inorganic insulating film has a thickness falling within a range between 0.5 μm and 1.5 μm.
Claim 7
Dependent Claim
29 words
A device according to claim 1, wherein the ratio of a thickness of said polyimide-based resin film to that of said inorganic insulating film ranges between 0.2 and 0.4.
Claim 8
Dependent Claim
20 words
A device according to claim 1, wherein the polymide-based resin has a thermal decomposition temperature of 450° C. or more.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-10-20 | 1990-04-21 | 1990-10-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-10-20 | 1994-04-21 | 1994-10-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-10-20 | 1998-04-21 | 1998-10-21 | $7700.00 | Window Closed / Lapsed |