Spring finger interconnect for IC chip carrier

Claim 1

An electrical interconnect apparatus for connecting electrical circuits on first and second circuit boards, said apparatus comprising: A. a miniaturized area array of spring finger contact assemblies, each of said assemblies comprising (i) a first electrically conductive contact pad positioned on said first circuit board; (ii) a first electrically conductive bump pad attached to said first contact pad such that said first bump pad is located substantially at one end of said first contact pad; and (iii) an electrically conductive flexible contact finger having first and second ends, said first end attached to said first bump pad, said second and being free to move; B. a miniaturized area array of electrical contact pad assemblies, each of said assemblies comprising a raised electrical second contact pad coupled to said second circuit board in order to provide an electrical conducting path from said electrical circuit on said first circuit board through said spring finger assembly and through said electrical contact pad assembly to said electrical circuit on said second circuit board; C. a second electrically conductive bump pad coupled to said first contact pad such that said second bump pad is located substantially in a spaced relationship with said first bump pad on said first contact pad, and wherein said second bump pad is positioned between said contact finger and said first contact pad in order to increase the electrical contact area of said interconnect apparatus and to provide spring force on said conductive flexible contact finger; and D. wherein said second end of said contact finger is separably engagable with said second bump pad.