Die bonder with electrically driven scrubbing means

Claim 1

In a die bonder for bonding a semiconductor die to a substrate comprising: a frame; a support assembly within said frame, which supports an arm; means attached to said arm for holding a semiconductor die; means for moving said arm and holding means along the three orthogonal axes; and electrical scrubbing means for oscillating said arm and holding means at a low frequency along the axis perpendicular to the arm and in the plane parallel to the interface of the die and the substrate wherein said electrical scrubbing means comprises an electromagnetic coil with a plunger therethrough, which plunger is disposed so that when electrical power is applied to the coil, the plunger periodically contacts said arm at the frequency of the power applied; the improvement wherein said electrical scrubbing means further comprises a flexible tab integral with said arm, which tab is contacted by the plunger, wherein the flexibility of the tab provides that upon oscillation the displacement of the holding means is less than the displacement of the plunger.