US4612408A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrically isolated semiconductor integrated photodiode circuits and method
Assignee: SERA SOLAR Corp A CA CORP
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Filing: 1984-10-22
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Granted: 1986-09-16
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Expires: 2004-10-22
Abstract
Abstract An interconnected array of solar cell or photodiode devices is formed by a method which includes the steps of forming on one major surface of a semiconductor wafer a plurality of said devices, forming grooves in said one major surface extending partway into said substrate between adjacent said devices, forming an oxide layer on selected portions of said one major surface and on the surfaces of said grooves, filling the grooves with an insulating material, forming metal interconnects between adjacent devices extending over said grooves and insulating material, attaching said one major surface to an insulating support, and severing through the wafer into the grooves from the other major surface to separate adjacent devices while leaving the metal interconnects.
Inventors
- 👤 Garret R. Moddel
- 👤 Lee A. Christel
- 👤 James F. Gibbons
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:59
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/18; H10F19/00; H10F19/20; Y; Y02; Y02E; Y02E10/00; Y02E10/50
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
118 words
The method of forming an interconnected array of solar cell or photodiode devices which includes the steps of forming on one major surface of a semiconductor wafer a plurality of said devices, forming grooves in said one major surface extending partway into said substrate between adjacent said devices, forming an oxide layer on selected portions of said one major surface and on the surfaces of said grooves, filling the grooves with an insulating material, forming metal interconnects between adjacent devices extending over said grooves and insulating material, attaching said one major surface to an insulating support, and severing through the wafer into the grooves from the other major surface to separate adjacent devices while leaving the metal interconnects.
Claim 2
Independent Claim
118 words
The method of forming an interconnected array of solar cell or photodiode devices which includes the steps of forming on one major surface of a semiconductor wafer a plurality of said devices, forming grooves in said one major surface extending partway into said substrate between adjacent said devices, forming an oxide layer on selected portions of said one major surface and on the surfaces of said grooves, filling the grooves with an insulating material, forming metal interconnects between adjacent devices extending over said grooves and insulating material, attaching said one major surface to an insulating support, and severing through the wafer into the grooves from the other major surface to separate adjacent devices while leaving the metal interconnects.
Claim 3
Dependent Claim
15 words
The method of claim 1 in which the wafer is severed by masking and etching.
Claim 4
Dependent Claim
21 words
The method of claim 2 in which the orientation of the wafer and circuits is chosen to produce selected etching characteristics.
Claim 5
Dependent Claim
15 words
The method of claim 1 in which the wafer is severed by sawing and etching.
Claim 6
Dependent Claim
12 words
The method of claim 1 in which the support is transparent material.
Claim 7
Dependent Claim
17 words
The method as in claim 5 in which the support is thinned after the wafer is severed.
Claim 8
Dependent Claim
10 words
A solar cell formed by the method of claim 5.
Claim 9
Dependent Claim
17 words
The method of claim 1 in which the semiconductor wafer is thinned after attachment to the support.
Claim 10
Dependent Claim
10 words
A solar cell formed by the method of claim 8.
Claim 11
Dependent Claim
23 words
The method of claim 1 including the additional step of forming alignment cuts from the one major surface for aligning the severing operation.
Claim 12
Dependent Claim
35 words
The method of claim 1 which includes the additional steps of attaching the other major surface to an insulating support and then removing the insulating support from the one major surface to expose the devices.
Claim 13
Dependent Claim
32 words
The method of claim 1 in which the step of forming a plurality of devices includes the step of forming a blocking diode in the wafer connected in series with the devices.
Claim 14
Dependent Claim
34 words
The method of claim 1 in which the step of forming a plurality of devices includes the step of forming a bypass diode in the wafer connected in parallel to all of the devices.
Claim 15
Dependent Claim
10 words
A solar cell formed by the method of claim 1.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-09-15 | 1990-03-17 | 1990-09-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-09-15 | 1994-03-17 | 1994-09-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-09-15 | 1998-03-17 | 1998-09-16 | $7700.00 | Window Closed / Lapsed |