US4604594A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface wave filter having photoresist damping material thereon and method for manufacturing the same
Assignee: Siemens AG
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Filing: 1983-09-15
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Granted: 1986-08-05
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Expires: 2003-09-15
Abstract
Abstract A surface wave filter with a wafer-shaped substrate formed of monocrystalline piezoelectric material having a surface, input and output transducers disposed on the surface of the substrate, a coupler for coupling the transducers being spaced apart from the transducers on the surface of the substrate defining zones therebetween, and electric conductor runs being connected to the transducers on the surface of the substrate and having ends, includes a damping layer formed of photoresist material with a plastic base covering substantially the entire surface of the substrate except for a region bounded by the transducers, the coupler, the ends of the electric conductor runs and the zones between the transducers and the coupler, and a method for manufacturing the filter.
Inventors
- 👤 Heinrich Angerer
- 👤 Badri Sinha
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 16:24
CPC Classifications
H; H03; H03H; H03H3/00; H03H3/007; H03H3/08; H03H9/00; H03H9/02; H03H9/02535; H03H9/02818; H03H9/02842; Y; Y10; Y10T; Y10T29/00; Y10T29/42
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
122 words
In a surface wave filter with a wafer-shaped substrate formed of monocrystalline piezoelectric material having a surface, input and output transducers disposed on the surface of the substrate, a coupler for coupling the transducers, said coupler being spaced apart from the transducers on the surface of the substrate, and electric conductor leads being connected to the transducers on the surface of the substrate and having respective electrodes, the improvement comprising a damping layer formed of photoresist material having a plastic base covering substantially the entire surface of the perimeter of the substrate except for a region bounded by the perimeter of the transducers, the coupler, the respective electrodes of the electric conductor leads and the zones between the transducers and the coupler.
Claim 2
Dependent Claim
122 words
In a surface wave filter with a wafer-shaped substrate formed of monocrystalline piezoelectric material having a surface, input and output transducers disposed on the surface of the substrate, a coupler for coupling the transducers, said coupler being spaced apart from the transducers on the surface of the substrate, and electric conductor leads being connected to the transducers on the surface of the substrate and having respective electrodes, the improvement comprising a damping layer formed of photoresist material having a plastic base covering substantially the entire surface of the perimeter of the substrate except for a region bounded by the perimeter of the transducers, the coupler, the respective electrodes of the electric conductor leads and the zones between the transducers and the coupler.
Claim 3
Dependent Claim
95 words
In a surface wave filter with a wafer-shaped substrate formed of monocrystalline piezoelectric material having a surface, input and output transducers disposed on the surface of the substrate and defining zones therebetween, and electric conductor leads being connected to the transducers on the surface of the substrate and having respective electrodes, the improvement comprising a damping layer formed of photoresist material having a plastic base covering substantially the entire surface of the substrate except for a region bounded by the transducers, the respective electrodes of the electric conductor leads and the zones between the transducers.
Claim 4
Dependent Claim
95 words
In a surface wave filter with a wafer-shaped substrate formed of monocrystalline piezoelectric material having a surface, input and output transducers disposed on the surface of the substrate and defining zones therebetween, and electric conductor leads being connected to the transducers on the surface of the substrate and having respective electrodes, the improvement comprising a damping layer formed of photoresist material having a plastic base covering substantially the entire surface of the substrate except for a region bounded by the transducers, the respective electrodes of the electric conductor leads and the zones between the transducers.
Claim 5
Dependent Claim
18 words
Surface wave filter according to claim 1, wherein said damping layer is formed of a positive photoresist material.
Claim 6
Dependent Claim
18 words
Surface wave filter according to claim 2, wherein said damping layer is formed of a positive photoresist material.
Claim 7
Dependent Claim
18 words
Surface wave filter according to claim 1, wherein said damping layer is formed of a negative photoresist material.
Claim 8
Dependent Claim
18 words
Surface wave filter according to claim 2, wherein said damping layer is formed of a negative photoresist material.
Claim 9
Dependent Claim
15 words
Surface wave filter according to claim 1, wherein the substrate is formed of lithium niobate.
Claim 10
Dependent Claim
15 words
Surface wave filter according to claim 2, wherein the substrate is formed of lithium niobate.
Claim 11
Dependent Claim
94 words
Method for manufacturing a surface wave filter including a wafer-shaped substrate having a surface, input and output transducers disposed on the surface of the substrate and electric conductor leads being connected to the transducers on the surface of the substrate and having respective electrodes, said method comprised of: photolithographically applying a damping layer formed of photoresist material having a plastic base over substantially the entire surface of the substrate except for a region bounded by the perimeter of the transducers, the respective electrodes of the electric conductor leads and the zones between the transducers.
Claim 12
Dependent Claim
94 words
Method for manufacturing a surface wave filter including a wafer-shaped substrate having a surface, input and output transducers disposed on the surface of the substrate and electric conductor leads being connected to the transducers on the surface of the substrate and having respective electrodes, said method comprised of: photolithographically applying a damping layer formed of photoresist material having a plastic base over substantially the entire surface of the substrate except for a region bounded by the perimeter of the transducers, the respective electrodes of the electric conductor leads and the zones between the transducers.
Claim 13
Dependent Claim
19 words
Method according to claim 9, which comprises providing the damping layer in the form of a negative photoresist material.
Claim 14
Dependent Claim
19 words
Method according to claim 9, which comprises providing the damping layer in the form of a positive photoresist material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-04 | 1990-02-03 | 1990-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-04 | 1994-02-03 | 1994-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-04 | 1998-02-03 | 1998-08-05 | $7700.00 | Window Closed / Lapsed |