US4604294A
Expired / Lapsed
US
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Process for forming an organic thin film
Assignee: Hitachi Ltd
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Filing: 1984-10-12
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Granted: 1986-08-05
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Expires: 2004-10-12
Abstract
Abstract An organic thin film consisting essentially of an organic compound is formed on a substrate surface by vacuum vapor deposition by exposing the organic compound as a vapor source to a laser beam having an energy level corresponding to that of the chemical bond of the organic compound, thereby sputtering the organic compound onto a substrate surface in vacuum and forming the organic thin film thereon. When a light or radiation-sensitive organic compound is used as the vapor source, a light or radiation-sensitive resist film is formed. The thin film thus formed retains the original chemical structure of the vapor source, and has a good flatness. Resolvability of resist film is improved owing to the absence of pin holes and particulate matters. A resist film having a higher sensitivity and a better contrast is formed by heating the substrate during the vapor deposition.
Inventors
- 👤 Masahiro Tanaka
- 👤 Kazufumi Azuma
- 👤 Kazuo Nate
- 👤 Mitsuo Nakatani
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:14
CPC Classifications
B; B05; B05D; B05D1/00; B05D1/60; G; G03; G03C; G03C1/00; G03C1/76; B05D3/00; B05D3/06
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
81 words
A process for forming an organic thin film on a substrate by vacuum vapor deposition, which comprises exposing an organic compound as a vapor source to a laser beam having an energy level corresponding to that of the chemical bond of the organic compound in vacuum, to break the chemical bond and form vapors from said organic compound, and sputtering the organic compound vapors in vacuum onto a substrate surface and forming a film consisting essentially of the organic compound thereon.
Claim 2
Dependent Claim
81 words
A process for forming an organic thin film on a substrate by vacuum vapor deposition, which comprises exposing an organic compound as a vapor source to a laser beam having an energy level corresponding to that of the chemical bond of the organic compound in vacuum, to break the chemical bond and form vapors from said organic compound, and sputtering the organic compound vapors in vacuum onto a substrate surface and forming a film consisting essentially of the organic compound thereon.
Claim 3
Dependent Claim
18 words
A process according to claim 1, where the laser beam has a wavelength of 190 to 400 nm.
Claim 4
Dependent Claim
24 words
A process according to claim 1, wherein the sputtering is carried out in a degree of vaccum of 10 -8 to 10 -2 Torr.
Claim 5
Dependent Claim
21 words
A process according to claim 1, wherein the laser beam has a power density of 0.5 to 30 J/cm 2 .
Claim 6
Dependent Claim
11 words
A process according to claim 1, wherein the substrate is heated.
Claim 7
Dependent Claim
87 words
A process for forming a light or radiation-sensitive resist film by vacuum vapor deposition on a substrate, which comprises exposing a light or radiation-sensitive organic compound as a vapor source to a laser beam having an energy level corresponding to that of the chemical bond of the organic compound in vacuum, to break the chemical bond and form vapors from said organic compound, and sputtering the organic compound vapors in vacuum to a substrate surface and forming a resist film consisting essentially of the organic compound thereon.
Claim 8
Dependent Claim
87 words
A process for forming a light or radiation-sensitive resist film by vacuum vapor deposition on a substrate, which comprises exposing a light or radiation-sensitive organic compound as a vapor source to a laser beam having an energy level corresponding to that of the chemical bond of the organic compound in vacuum, to break the chemical bond and form vapors from said organic compound, and sputtering the organic compound vapors in vacuum to a substrate surface and forming a resist film consisting essentially of the organic compound thereon.
Claim 9
Dependent Claim
18 words
A process according to claim 6, wherein the laser beam has a wavelength of 190 to 400 nm.
Claim 10
Dependent Claim
24 words
A process according to claim 6, wherein the sputtering is carried out in a degree of vacuum of 10 -8 to 10 -2 Torr.
Claim 11
Dependent Claim
21 words
A process according to claim 6, wherein the laser beam has a powder density of 0.5 to 30 J/cm 2 .
Claim 12
Dependent Claim
24 words
A process according to claim 6, wherein the organic compound as the vapor source is at least one of polymethacrylate esters and ketonic polymers.
Claim 13
Dependent Claim
11 words
A process according to claim 6, wherein the substrate is heated.
Claim 14
Dependent Claim
13 words
A process according to claim 1, wherein said organic compound is a polymer.
Claim 15
Dependent Claim
48 words
A process according to claim 1, wherein the laser beam has an energy level corresponding to that of the chemical bond so as to photochemically break the chemical bond and form the organic compound vapors, and wherein in forming said film the vapors are polymerized on the substrate.
Claim 16
Dependent Claim
13 words
A process according to claim 13, wherein said organic compound is a polymer.
Claim 17
Dependent Claim
35 words
A process according to claim 1, wherein said organic compound is selected from the group consisting of polymethacrylic acid esters and copolymers thereof, ketonic polymers and copolymers thereof, polyacrylic acid esters, polyacrylic acid and polybutene-1-sulfone.
Claim 18
Dependent Claim
45 words
A process according to claim 1, wherein the organic compound is spaced a predetermined distance from said substrate, and the sputtering is carried out under a sufficient vacuum such that the mean free path of the organic compound vapors is larger than said predetermined distance.
Claim 19
Dependent Claim
41 words
A process according to claim 5, wherein the substrate is heated to a temperature at least 10° C. lower than the decomposition temperature of the organic compound but higher than the boiling point of the components of the organic compound vapors.
Claim 20
Dependent Claim
14 words
A process according to claim 1, wherein said organic compound is in solid form.
Claim 21
Dependent Claim
21 words
A process according to claim 10, wherein the laser beam has a power density of 10 to 20 J/cm 2 .
Claim 22
Dependent Claim
48 words
A process according to claim 6, wherein the laser beam has an energy level corresponding to that of the chemical bond so as to photochemically break the chemical bond and form the organic compound vapors, and wherein in forming said film the vapors are polymerized on the substrate.
Claim 23
Dependent Claim
13 words
A process according to claim 20, wherein said organic compound is a polymer.
Claim 24
Dependent Claim
45 words
A process according to claim 6, wherein the organic compound is spaced a predetermined distance from said substrate, and the sputtering is carried out under a sufficient vacuum such that the means free path of the organic compound vapors is larger than said predetermined distance.
Claim 25
Dependent Claim
41 words
A process according to claim 11, wherein the substrate is heated to a temperature at least 10° C. lower than the decomposition temperature of the organic compound but higher than the boiling point of the components of the organic compound vapors.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-04 | 1990-02-03 | 1990-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-04 | 1994-02-03 | 1994-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-04 | 1998-02-03 | 1998-08-05 | $7700.00 | Window Closed / Lapsed |